SMD Power Inductor - MPIT252010 Series
This specification applies to the MPIT series of SMD power inductors manufactured by SHENZHEN MICROGATE TECHNOLOGY CO.,LTD. These inductors are designed for various electronic applications requiring compact and reliable power management solutions.
Product Attributes
- Brand: MICROGATE
- Origin: SHENZHEN MICROGATE TECHNOLOGY CO.,LTD., P.R.C.
- Product Series: MPIT252010 Series
- Material: Ni-Zn Ferrite Core, Enameled Copper Wire, Ag/Ni/Sn/Cu Terminal Electrode, Epoxy resin and magnetic powder Magnetic Glue
- Lead Free: Yes
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () Max. | Isat 1 (A) Typ. | Irms 2 (A) Typ. | SRF (MHz) Typ. |
|---|---|---|---|---|---|
| MPIT252010-R47N-LF | 0.4730% | 0.056 | 2.50 | 2.15 | 201 |
| MPIT252010-R68N-LF | 0.6830% | 0.074 | 2.20 | 1.80 | 139 |
| MPIT252010-1R0N-LF | 1.030% | 0.108 | 1.85 | 1.50 | 100 |
| MPIT252010-1R5N-LF | 1.530% | 0.182 | 1.80 | 1.20 | 80 |
| MPIT252010-2R2N-LF | 2.230% | 0.209 | 1.20 | 1.10 | 60 |
| MPIT252010-3R3M-LF | 3.320% | 0.328 | 1.05 | 0.85 | 49 |
| MPIT252010-4R7M-LF | 4.720% | 0.564 | 1.00 | 0.65 | 40 |
| MPIT252010-5R6M-LF | 5.620% | 0.564 | 0.80 | 0.65 | 37 |
| MPIT252010-6R8M-LF | 6.820% | 0.896 | 0.78 | 0.58 | 32 |
| MPIT252010-100M-LF | 1020% | 1.092 | 0.65 | 0.48 | 26 |
Dimensions
| Model | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | f (Typ.) | g (Typ.) | h (Typ.) |
|---|---|---|---|---|---|---|---|---|
| MPIT252010 | 2.500.20 | 2.000.20 | 1.00Max. | 0.800.2 | 0.800.2 | 0.80 | 2.50 | 2.00 |
Testing Conditions
Ordinary Conditions: Temperature: 5 to 35, Humidity: 25 to 85% RH, Atmospheric Pressure: 86 to 106 kPa
Reference Conditions: Temperature: 202, Humidity: 60 to 75% RH, Atmospheric Pressure: 86 to 106 kPa
Operating Conditions
- Ambient Temperature: -25 to +85
- Maximum Allowed Temperature: +125
- Temperature Dependency: 40
- Storage Temperature: -25 to +85
- Storage Life: Half a year
- Operating Frequency: 0.1MHz ~ 1MHz
Recommended Soldering Conditions
Suitable for flow and reflow soldering. Use rosin-based flux and Sn solder. Pre-heating temperature difference should be limited to 150 max. Cooling into solvent after soldering should also be gradual.
Packaging
Refer to section 9 of the original specification for packaging details.
Storage Conditions
Products should be stored under conditions specified in section 11 of the original specification.
2410121314_microgate-MPIT252010-1R0N-LF_C486421.pdf
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