Product Overview
This specification applies to the MPIT4030 series of SMD power inductors. These inductors are designed for various applications requiring reliable power handling and inductance characteristics.
Product Attributes
- Brand: SHENZHEN MICROGATE TECHNOLOGY CO.,LTD.
- Product Series: MPIT4030 series
- Product Type: SMD power inductor
- Origin: P.R.C.
- Material: Ni-Zn Ferrite (Core), Enameled Copper Wire (Wire), Ag/Ni/Sn/Cu (Terminal), Epoxy resin and magnetic powder (Magnetic Glue)
- Environmental Compliance: Lead free products
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () Max. | DCR () Typ. | Isat (A) Max. | Isat (A) Typ. | Irms (A) Max. | Irms (A) Typ. |
|---|---|---|---|---|---|---|---|
| MPIT4030-R91M-LF | 0.9120% | 0.017 | 0.013 | 7.00 | 8.00 | 4.15 | 4.70 |
| MPIT4030-1R0M-LF | 1.020% | 0.018 | 0.014 | 6.50 | 7.20 | 4.15 | 4.70 |
| MPIT4030-1R2M-LF | 1.220% | 0.020 | 0.015 | 6.00 | 6.80 | 3.82 | 4.20 |
| MPIT4030-1R5M-LF | 1.520% | 0.026 | 0.020 | 5.50 | 6.50 | 3.34 | 3.60 |
| MPIT4030-1R8M-LF | 1.820% | 0.033 | 0.025 | 5.50 | 5.80 | 3.20 | 3.30 |
| MPIT4030-2R2M-LF | 2.220% | 0.039 | 0.030 | 5.00 | 5.40 | 2.95 | 3.20 |
| MPIT4030-3R3M-LF | 3.320% | 0.052 | 0.040 | 3.60 | 4.20 | 2.40 | 2.65 |
| MPIT4030-3R9M-LF | 3.920% | 0.072 | 0.057 | 3.30 | 3.80 | 2.10 | 2.30 |
| MPIT4030-4R7M-LF | 4.720% | 0.078 | 0.060 | 2.70 | 3.20 | 2.00 | 2.20 |
| MPIT4030-5R6M-LF | 5.620% | 0.085 | 0.065 | 2.70 | 2.90 | 1.95 | 2.10 |
| MPIT4030-6R8M-LF | 6.820% | 0.109 | 0.084 | 2.30 | 2.80 | 1.65 | 1.80 |
| MPIT4030-8R2M-LF | 8.220% | 0.109 | 0.084 | 2.10 | 2.35 | 1.65 | 1.80 |
| MPIT4030-100M-LF | 1020% | 0.125 | 0.096 | 1.80 | 2.20 | 1.52 | 1.65 |
| MPIT4030-120M-LF | 1220% | 0.170 | 0.131 | 1.65 | 2.10 | 1.30 | 1.45 |
| MPIT4030-150M-LF | 1520% | 0.245 | 0.189 | 1.60 | 1.90 | 1.11 | 1.20 |
| MPIT4030-220M-LF | 2220% | 0.295 | 0.225 | 1.10 | 1.50 | 1.00 | 1.10 |
| MPIT4030-330M-LF | 3320% | 0.415 | 0.320 | 1.00 | 1.30 | 0.85 | 0.95 |
| MPIT4030-390M-LF | 3920% | 0.450 | 0.345 | 1.03 | 1.10 | 0.80 | 0.90 |
| MPIT4030-470M-LF | 4720% | 0.580 | 0.445 | 0.75 | 1.05 | 0.72 | 0.80 |
| MPIT4030-560M-LF | 5620% | 0.720 | 0.555 | 0.85 | 0.95 | 0.65 | 0.70 |
| MPIT4030-620M-LF | 6220% | 1.080 | 0.829 | 0.80 | 0.85 | 0.53 | 0.60 |
| MPIT4030-680M-LF | 6820% | 1.130 | 0.868 | 0.70 | 0.85 | 0.52 | 0.55 |
| MPIT4030-101M-LF | 10020% | 1.450 | 1.110 | 0.60 | 0.75 | 0.45 | 0.50 |
| MPIT4030-121M-LF | 12020% | 1.630 | 1.250 | 0.53 | 0.60 | 0.43 | 0.47 |
| MPIT4030-151M-LF | 15020% | 1.720 | 1.440 | 0.50 | 0.60 | 0.42 | 0.46 |
| MPIT4030-181M-LF | 18020% | 1.836 | 1.530 | 0.48 | 0.55 | 0.40 | 0.44 |
| MPIT4030-331M-LF | 33020% | 4.080 | 3.400 | 0.30 | 0.38 | 0.27 | 0.30 |
Testing Conditions
Unless otherwise specified: Temperature: 5 to 35, Humidity: 25 to 85% RH. In case of doubt: Temperature: 202, Humidity: 60 to 75% RH, Atmospheric Pressure: 86 to 106 kPa.
Test Instruments and Remarks
- L & DCR: CHROMA 3302 meter.
- IDC: CHROMA 3302 and 1320 meter.
- L test condition: 100KHz/1V.
- Isat: Based on inductance change (|LI-L|/L30%).
- Irms: Based on temperature rise (T:40 TYP).
Operating Conditions
Ambient temperature: -40 to +125.
Reliability and Test Conditions
High temperature storage test: 1252 for 1000 hours. Requirements: No case deformation, |L|/L10%. Measurement after 244 hours at room temperature.
Low temperature storage test: -402 for 1000 hours. Requirements: No case deformation, |L|/L10%. Measurement after 244 hours at room temperature.
Humidity test: 25-85, 85% RH for 1000 hours. Requirements: No case deformation, |L|/L10%. Measurement after 244 hours at room temperature.
Thermal shock test: 1000 cycles of -40 (30 min) to 125 (30 min).
Solderability test: Terminal area must have 90% min. solder coverage. Dip pads in flux then dip in solder pot at 2455 for 50.1 second.
Heat endurance of reflow soldering: Refer to reflow curve. Peak temperature: 260+5/-0. Requirements: No case deformation, |L|/L10%.
Vibration test: 10~55Hz, 1.5mm amplitude for 2 hours in each of 3 mutually perpendicular directions (total 6 hours).
Drop test: Drop 10 times on a concrete floor from a height of 1m.
Terminal strength push test: Apply 17.64N force for 10s.
Terminal strength bending test: Apply pressure at the middle point of the PCB, 2mm deflection at 0.5mm/sec speed, hold for 601s.
Loading at High Temperature: Temperature: 852, Time: 1000 hours, Apply rated current. Requirements: No case deformation, |L|/L10%. Measurement after 244 hours at room temperature.
Recommended Soldering Conditions
Flux: Use rosin-based flux. Dont use highly acidic flux with halide content exceeding 0.2wt% (chlorine conversion value). Use Sn solder.
Flow soldering conditions: Temperature difference between solder and product surface should not exceed 150 during pre-heating and 100 during cooling. Refer to standard soldering profile.
Reflow soldering conditions: Refer to reflow curve. Peak temperature: 260+5/-0.
Packaging
Not specified in the provided text.
Visual Inspection Standard of Product
Not specified in the provided text.
Storage
Not specified in the provided text.
2410121250_microgate-MPIT4030-150M-LF_C281286.pdf
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