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Quality Microgate MPIT4030-2R2M-LF SMD power inductor lead free with Ni-Zn ferrite core and magnetic powder encapsulation factory
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Quality Microgate MPIT4030-2R2M-LF SMD power inductor lead free with Ni-Zn ferrite core and magnetic powder encapsulation factory
>
Specifications
Current - Saturation (Isat):
5A
Mfr. Part #:
MPIT4030-2R2M-LF
Package:
SMD,4x4mm
Key Attributes
Model Number: MPIT4030-2R2M-LF
Product Description

Product Overview

The MPIT4030 series of SMD power inductors are designed for various electronic applications. These inductors offer reliable performance and are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD.

Product Attributes

  • Brand: MICROGATE
  • Origin: Shenzhen, P.R.C.
  • Material: Ni-Zn Ferrite core, Enameled Copper Wire, Ag/Ni/Sn/Cu terminals, Epoxy resin and magnetic powder encapsulation.
  • Certifications: Lead-free products (LF).

Technical Specifications

Microgate Part No.Inductance (uH)DCR Max. ()Isat Max. (A)Irms (A)
MPIT4030-R91M-LF0.9120%0.0177.004.15
MPIT4030-1R0M-LF1.020%0.0186.504.15
MPIT4030-1R2M-LF1.220%0.0206.003.82
MPIT4030-1R5M-LF1.520%0.0265.503.34
MPIT4030-1R8M-LF1.820%0.0335.503.20
MPIT4030-2R2M-LF2.220%0.0395.002.95
MPIT4030-3R3M-LF3.320%0.0523.602.40
MPIT4030-3R9M-LF3.920%0.0723.302.10
MPIT4030-4R7M-LF4.720%0.0782.702.00
MPIT4030-5R6M-LF5.620%0.0852.701.95
MPIT4030-6R8M-LF6.820%0.1092.301.65
MPIT4030-8R2M-LF8.220%0.1092.101.65
MPIT4030-100M-LF1020%0.1251.801.52
MPIT4030-120M-LF1220%0.1701.651.30
MPIT4030-150M-LF1520%0.2451.601.11
MPIT4030-220M-LF2220%0.2951.101.00
MPIT4030-330M-LF3320%0.4151.000.85
MPIT4030-390M-LF3920%0.4501.030.80
MPIT4030-470M-LF4720%0.5800.750.72
MPIT4030-560M-LF5620%0.7200.850.65
MPIT4030-620M-LF6220%1.0800.800.53
MPIT4030-680M-LF6820%1.1300.700.52
MPIT4030-101M-LF10020%1.4500.600.45
MPIT4030-121M-LF12020%1.6300.530.43
MPIT4030-151M-LF15020%1.7200.500.42
MPIT4030-181M-LF18020%1.8360.480.40
MPIT4030-331M-LF33020%4.0800.300.27
ItemRequired CharacteristicsTest Method/Condition
High temperature storage testNo case deformation or change in appearance. |L|/L10%Temperature: 1252, Time : 1000 hours. Measurement at 244 hours after test conclusion.
Low temperature storage testNo case deformation or change in appearance. |L|/L10%Temperature : -402, Time : 1000 hours. Measurement at 244 hours after test conclusion.
Humidity testNo case deformation or change in appearance. |L|/L10%Temperature: 25-85, Humidity :85% RH, Time : 1000 hours. Measurement at 244 hours after test conclusion.
Thermal shock testNo case deformation or change in appearance. |L|/L10%-40 for 30min, then 125 for 30min as 1 cycle. 1000 cycles.
Solderability testTerminal area must have 90% min. solder coverage.Dip pads in flux then dip in solder pot at 2455 for 50.1 second. Solder: Sn96.5%Ag3%Cu0.5%. Flux: rosin flux.
Heat endurance of reflow solderingNo case deformation or change in appearance. |L|/L10%Refer to reflow curve, 3 times. Peak temperature: 260+5/-0.
Vibration testNo case deformation or change in appearance. |L|/L10%Frequency 10~55Hz, 1.5mm amplitude in each of 3 mutually perpendicular directions for 2 hours each (total 6 hours).
Drop testNo case deformation or change in appearance. |L|/L10%Drop 10 times on a concrete floor from a height of 1m.
Terminal strength push testTerminal should not pull off.Pulling test: 17.64N force for 10s. Bending test: deflection 2mm.
Loading at High TemperatureNo case deformation or change in appearance. |L|/L10%Temperature: 852, Time : 1000 hours, Apply rated current. Measurement at 244 hours after test conclusion.

2410121250_microgate-MPIT4030-2R2M-LF_C281294.pdf

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