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Specifications
Current - Saturation (Isat):
900mA
Mfr. Part #:
MPIH201610-4R7M-LF
Package:
0806
Key Attributes
Model Number:
MPIH201610-4R7M-LF
Product Description
SMD Power Inductor - MPIH201610 Series
This specification applies to the MPIH201610 series of SMD power inductors. These components are designed for various electronic applications requiring efficient power management.
Product Attributes
- Brand: SHENZHEN MICROGATE TECHNOLOGY CO.,LTD.
- Product Name: (SMD power inductor)
- Series: MPIH201610 series
- Origin: Shenzhen, P.R.C.
- Environmental Compliance: Lead free products (LF)
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR Max () | Isat Max (A) | Irms Max (A) |
| MPIH201610-R24M-LF | 0.2420% | 0.032 | 3.80 | 3.70 |
| MPIH201610-R33M-LF | 0.3320% | 0.041 | 3.50 | 3.50 |
| MPIH201610-R47M-LF | 0.4720% | 0.041 | 2.35 | 2.80 |
| MPIH201610-R68M-LF | 0.6820% | 0.060 | 2.20 | 2.60 |
| MPIH201610-1R0M-LF | 1.020% | 0.072 | 1.70 | 2.00 |
| MPIH201610-2R2M-LF | 2.220% | 0.215 | 1.10 | 1.25 |
| MPIH201610-3R3M-LF | 3.320% | 0.380 | 1.00 | 0.95 |
| MPIH201610-4R7M-LF | 4.720% | 0.420 | 0.90 | 0.90 |
| MPIH201610-6R8M-LF | 6.820% | 0.660 | 0.70 | 0.70 |
| MPIH201610-100M-LF | 1020% | 0.820 | 0.60 | 0.60 |
Dimensions and Material
| Item | Material | Dimensions (mm) |
| Core | Ni-Zn Ferrite | A: 2.000.20, B: 1.600.20, C: 1.00 Max. |
| Wire | Enameled Copper Wire | f: 0.80 Typ., g: 2.20 Typ. |
| Terminal | Ag/Ni/Sn/Cu | D: 0.600.2, E: 0.600.2, h: 1.60 Typ. |
| Magnetic Glue | Epoxy resin and magnetic powder |
Reliability and Test Conditions
Operating Temperature: -40 ~ +125
Testing Conditions: Unless otherwise specified, temperature: 5 to 35, humidity: 25 to 85% RH. In case of doubt, temperature: 202, humidity: 60 to 75% RH, atmospheric pressure: 86 to 106 kPa.
Reliability Tests:
- High temperature storage: 1252 for 1000 hours.
- Low temperature storage: -402 for 1000 hours.
- Humidity test: 25-85, 85% RH for 1000 hours.
- Thermal shock: 1000 cycles of -40 (30 min) to 125 (30 min).
- Solderability: 90% min. solder coverage on terminal area.
- Heat endurance of reflow soldering: 3 reflow cycles, peak temperature 260+5/-0.
- Vibration: 10~55Hz, 1.5mm amplitude, 2 hours per direction (3 directions total).
- Drop test: 1 meter onto concrete floor, 10 times.
- Terminal strength: 17.64N pull/push test, 10 seconds.
- Loading at High Temperature: 852 for 1000 hours with rated current.
Recommended Soldering Conditions
Suitable for flow and reflow soldering.
- Flux: Rosin-based flux.
- Solder: Sn solder.
- Flow soldering: Temperature difference between product surface and solder max 150 during preheating, max 100 during cooling.
- Reflow soldering: Peak temperature 260, 3-4 seconds. Average ramp-up rate max 3/second.
2410121252_microgate-MPIH201610-4R7M-LF_C696470.pdf
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