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Specifications
Current - Saturation (Isat):
1.95A
Mfr. Part #:
AMPIT3015-2R2M-LF
Package:
SMD
Key Attributes
Model Number:
AMPIT3015-2R2M-LF
Product Description
Product Overview
The AMPIT3015 series of SMD Power Inductors are designed for automotive electronics applications. These inductors offer reliable performance and are built with high-quality materials to meet stringent automotive standards.
Product Attributes
- Brand: MICROGATE
- Origin: SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
- Certifications: ROHS COMPLIANT, AEC-Q200
Technical Specifications
| Microgate Part No. | Inductance L (uH) | DCR() Max. | DCR() Typ. | Isat1 (A) Max. | Isat1 (A) Typ. | Irms2 (A) Max. | Irms2 (A) Typ. |
| AMPIT3015-1R0M-LF | 1.020% | 0.040 | 0.030 | 2.65 | 2.80 | 2.65 | 2.85 |
| AMPIT3015-1R5M-LF | 1.520% | 0.055 | 0.045 | 2.55 | 2.75 | 2.30 | 2.60 |
| AMPIT3015-2R2M-LF | 2.220% | 0.072 | 0.060 | 1.95 | 2.10 | 2.10 | 2.25 |
| AMPIT3015-3R3M-LF | 3.320% | 0.102 | 0.085 | 1.65 | 1.75 | 1.75 | 1.85 |
| AMPIT3015-4R7M-LF | 4.720% | 0.145 | 0.120 | 1.35 | 1.45 | 1.40 | 1.50 |
| AMPIT3015-6R8M-LF | 6.820% | 0.200 | 0.170 | 1.00 | 1.15 | 1.20 | 1.30 |
| AMPIT3015-100M-LF | 1020% | 0.300 | 0.250 | 0.85 | 1.00 | 1.00 | 1.05 |
| AMPIT3015-120M-LF | 1220% | 0.300 | 0.250 | 0.75 | 0.85 | 1.00 | 1.05 |
| AMPIT3015-150M-LF | 1520% | 0.420 | 0.350 | 0.70 | 0.80 | 0.85 | 0.95 |
| AMPIT3015-220M-LF | 2220% | 0.545 | 0.440 | 0.55 | 0.65 | 0.75 | 0.85 |
| AMPIT3015-470M-LF | 4720% | 1.200 | 1.000 | 0.40 | 0.45 | 0.50 | 0.55 |
| No. | Item | Requirements | Test Methods and Remarks | Reference | Sample Size |
| 1 | Solderability | Terminal area shall be at least 95% covered. | Temperature:240 5, flux 5-10 s. Sample immersion tin furnace 3 1s. Sn/3.0Ag/0.5Cu | AEC-Q200 (J-STD-002) | 15 |
| 2 | Resistance to Soldering Heat | (1) No case deformation or change in appearance. (2)L0/L010% | The peak temperature: 260+5/-0. Reflow:3times. Temperature curve is as below: | AEC-Q200 (MIL-STD-202 Method 210) | 30 |
| 3 | High Temperature Storage | (1) No case deformation or change in appearance. (2)L0/L010% | Temperature: 1502. Time : 1000(+48,0) hours. Measurement at 244 hours after test conclusion. | AEC-Q200 (MIL-STD -202 Method 108) | 77 |
| 4 | Low Temperature Storage | (1) No case deformation or change in appearance. (2)L0/L010% | Temperature: -552. Time : 1000(+48,0) hours. Measurement at 244 hours after test conclusion. | ||
| 5 | Temperature Cycling | (1) No case deformation or change in appearance. (2)L0/L010% | First -55 for 30 minutes, last 150 30minutes as 1 cycle. Go through 1000 cycles.. Max transfer time is 20 second. Measurement at 244 hours after test conclusion. | AEC-Q200 (JESD22-A104) | 77 |
| 6 | Resistance to Solvents | (1) No case deformation or change in appearance. (2)L0/L010% | Prepare solvent (isopropyl alcohol: kerosene: ethylbenzene =4:9:3 volume ) Specimen be completely immersed in solvent for 3+0.5/-0min Brush dipped in solution until wetted and brush part 10 strokes . Repeat 2 more times, Air blow dry. Inspect at 3x magnifier for marking and 10x for part damage. Note: Add Aqueous wash chemical. OKEM Clean or equivalent. Do not use banned solvents. | AEC-Q200 (MIL-STD-202 Method 215) | 15 |
| 7 | ESD | (1) No case deformation or change in appearance. (2)L0/L010% | HBM ESD discharge waveform,8KV | AEC-Q200 (AEC-Q200- 002) | 15 |
| 8 | Biased Humidity | (1) No case deformation or change in appearance. (2)L0/L010% | 1000(+48,0) hours, 85C/85%RH. Unpowered. Measurement at 244 hours after test conclusion. | AEC-Q200 (MIL-STD -202 Method 103) | 77 |
| 9 | Terminal Strength | (1) No case deformation or change in appearance. (2)L0/L010% | The test samples shall be soldered to the board. 17.64N, 601s | AEC-Q200 (AEC-Q200-006) | 30 |
| 10 | Board Flex | (1) No case deformation or change in appearance. (2)L0/L010% | Part mounted on a 100mm*40mm FR4 PCB board, which is 1.60.2 mm thick and as a Layer-thickness 35 m 10 m. Bending speed is 1mm/s. Keeping the P.C Board 2 mm minimum for 60 seconds. | AEC-Q200 (AEC-Q200-005) | 30 |
| 11 | Vibration | (1) No case deformation or change in appearance. (2)L0/L010% | Frequency range : 10~2000Hz. Amplitude: 1.5mm ,5g. Sweep time and duration: 10~2000~10Hz for 20 minutes. Each four hours(12 times) in X,Y,Z direction, 12 hours in total. | AEC-Q200 (MIL-STD-202 Method 204) | 30 |
| 12 | Mechanical Shock | (1) No case deformation or change in appearance. (2)L0/L010% | Half sine shock pulse,100g,6ms,6 shocks in each 3 mutually perpendicular directions (total of 18 shocks) | AEC-Q200 (MIL-STD-202 Method 213) | 30 |
| 13 | Loading at High Temperature | (1) No case deformation or change in appearance. (2)L0/L010% | Temperature: 1502. Time : 1000 (+48,0) hours. Applied Current : Rated current. Measurement at 244 hours after test conclusion. | AEC-Q200 (MIL-PRF-27) | 77 |
| 14 | Loading at Damp Heat | (1) No case deformation or change in appearance. (2)L0/L010% | Temperature: 602, Humidity: 90% to 95% RH. Time : 1000 (+48,0) hours. Applied Current : Rated current. Measurement at 244 hours after test conclusion. | AEC-Q200 | 77 |
| 15 | Drop | (1) No case deformation or change in appearance. (2)L0/L010% | Height: 1 m, Free fall, 10times. Direction: 1 Angle, 1side, 2surface. | AEC-Q200 | 30 |
| 16 | Flammability (External Flame) | (1) No case deformation or change in appearance. (2)L0/L010% | Method111/UL94 | AEC-Q200 | 15 |
| 17 | Random Vibration | (1) No case deformation or change in appearance. (2)L0/L010% | Three Times reflow pretreatment (reflow TMAX265 + | AEC-Q200 |
2507231538_microgate-AMPIT3015-2R2M-LF_C49274412.pdf
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