Product Overview
The MPIT5040 series is a range of SMD power inductors designed for various electronic applications. These inductors offer reliable performance and are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
Product Attributes
- Brand: MICROGATE
- Origin: Shenzhen, P.R.C.
- Material: Ni-Zn Ferrite core, Enameled Copper Wire, Ag/Ni/Sn/Cu terminals, Epoxy resin and magnetic powder for magnetic glue.
- Certifications: Lead-free products (LF)
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () Max. | Isat (A) Max. | Irms (A) Max. | SRF (MHz) Min. |
|---|---|---|---|---|---|
| MPIT5040-1R0N-LF | 1.0 30% | 0.012 | 7.35 | 4.90 | 117 |
| MPIT5040-1R5N-LF | 1.530% | 0.015 | 6.30 | 4.30 | 86 |
| MPIT5040-2R2N-LF | 2.230% | 0.019 | 4.90 | 3.80 | 50 |
| MPIT5040-2R7N-LF | 2.730% | 0.022 | 4.30 | 3.60 | 37 |
| MPIT5040-3R3N-LF | 3.3 30% | 0.024 | 3.95 | 3.40 | 32 |
| MPIT5040-3R9N-LF | 3.9 30% | 0.027 | 3.55 | 3.20 | 29 |
| MPIT5040-4R7N-LF | 4.730% | 0.030 | 3.50 | 3.00 | 28 |
| MPIT5040-6R8M-LF | 6.820% | 0.043 | 2.90 | 2.50 | 21 |
| MPIT5040-100M-LF | 1020% | 0.064 | 2.35 | 2.10 | 18 |
| MPIT5040-150M-LF | 1520% | 0.086 | 2.00 | 2.00 | 13 |
| MPIT5040-220M-LF | 2220% | 0.129 | 1.60 | 1.50 | 11 |
| MPIT5040-330M-LF | 3320% | 0.188 | 1.30 | 1.20 | 9 |
| MPIT5040-470M-LF | 4720% | 0.272 | 1.10 | 1.00 | 7 |
| MPIT5040-680M-LF | 6820% | 0.400 | 0.90 | 0.80 | 6 |
| MPIT5040-101M-LF | 10020% | 0.560 | 0.75 | 0.70 | 5 |
Dimensions
| Dimensions | A | B | C | D | E | F | G | H |
|---|---|---|---|---|---|---|---|---|
| Values (mm) | 5.00.2 | 5.00.2 | 4.1Max. | 2.00.3 | 1.50.3 | 4.0Typ. | 1.5 Typ. | 3.6 Typ. |
Operating Conditions
Ambient Temperature: -40 ~ +125
Recommended Soldering Conditions
Flux: Rosin-based flux. Do not use highly acidic flux with halide content exceeding 0.2wt% (chlorine conversion value).
Solder: Use Sn solder.
Flow Soldering: Temperature difference between product surface and solder during pre-heating should not exceed 150. Temperature difference during cooling should not exceed 100.
Reflow Soldering Profile:
- Average Ramp-Up Rate: 3/second max.
- Preheat (Ts min. to Ts max.): 150 to 200, 60-180 seconds.
- Time maintained above 217 (tL): 60-150 seconds.
- Peak/Classification Temperature (Tp): 260, 3-4 seconds.
- Time within 5 C of actual Peak Temperature: 20-40 seconds.
- Ramp-Down Rate: 6C/second max.
- Time from 25 C to Peak Temperature: 8 minutes max.
Note: All temperatures are measured on the product surface.
Storage Conditions
Refer to Section 11 of the original document for detailed storage information.
2410121250_microgate-MPIT5040-3R3M-LF_C696479.pdf
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