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Specifications
Current - Saturation (Isat):
1.2A
Mfr. Part #:
MPSM160808BE2R2M20-LF
Package:
0603
Key Attributes
Model Number:
MPSM160808BE2R2M20-LF
Product Description
Product Overview
The MPSM160808BE series of SMD power inductors are designed for various electronic applications. These inductors offer reliable performance and are compliant with ROHS+HS standards.
Product Attributes
- Brand: MICROGATE
- Manufacturing Name: SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
- Origin: Shenzhen, China
- Certifications: ROHS+HS COMPLIANT
Technical Specifications
| Microgate Part No. | Inductance L0 (uH) | DCR (m) Max. | DCR (m) Typ. | Isat (A) Max. | Isat (A) Typ. | Irms (A) Max. | Irms (A) Typ. | Rated Voltage (V) | Operating Temperature Range () |
| MPSM160808BE2R2M20-LF | 2.220% | 290 | 241 | 1.2 | 1.3 | 1.0 | 1.1 | 20 | -55 ~ +125 |
Reliability Testing
| Item | Requirements | Test Methods and Remarks | Reference | Sample Size |
| Solderability | Terminal area must have 95% min. solder coverage. | 8hours steam age test. Temperature:245 5, flux 5-10 s. Sample immersion tin furnace 5 0.5s. Immersed and in and out of speed: 25 6mm/s. | AEC-Q200 (J-STD-002) | 15 |
| Resistance to Soldering Heat | (1) No physical damage. (2)L0/L010% | The peak temperature: 260+5/-0. Reflow:3times. Temperature curve is as below: | AEC-Q200 (MIL-STD-20 2 Method 210) | 30 |
| High Temperature Storage | Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion. | AEC-Q200 (MIL-STD -202 Method 108) | 77 | |
| Low Temperature Storage | Temperature: -552. Time : 1000 hours. Measurement at 244 hours after test conclusion. | JESD22-A119 | 77 | |
| Thermal shock | First -40 for 15 minutes, last 125 15minutes as 1 cycle. Go through 300 cycles. Max transfer time is 20 second. Measurement at 244 hours after test conclusion. | MIL-STD -202 Method 107 | 30 | |
| Humidity Resistance | (1) No physical damage. (2)L0/L010% | 1000 hours, 85C/85%RH. Unpowered. Measurement at 244 hours after test conclusion. | AEC-Q200 (MIL-STD -202 Method 103) | 77 |
| Terminal Strength | No physical damage. | The test samples shall be soldered to the board. 5.0N, 100.5s. | MIL-STD-202 | 30 |
| Board Flex | (1) No physical damage. (2)L0/L010% | Part mounted on a 100mm*40mm FR4 PCB board, which is 1.60.2 mm thick and as a Layer-thickness 35 m 10 m. Bending speed is 1mm/s. Keeping the P.C Board 2 mm minimum for 60 seconds. | AEC-Q200 (AEC-Q200-0 05) | 30 |
| Drop | Height: 1 m, Free fall, 10times. Direction: 1 Angle, 1side, 2surface. | JESD22-B111 | 30 | |
| Vibration | Frequency range : 10~2000Hz. Amplitude: 1.5mm, 5g. Sweep time and duration: 10~2000~10Hz for 20 minutes. Each four hours(12 times) in X,Y,Z direction, 12 hours in total. | AEC-Q200 (MIL-STD-20 2 Method 204) | 30 | |
| Loading at High Temperature | (1) No physical damage. (2)L0/L010% | Temperature: 852. Time : 1000 hours. Rated current. Measurement at 244 hours after test conclusion. | AEC-Q200 (MIL-PRF-27) | 77 |
Recommended Soldering Conditions
| Method | Conditions |
| Reflow soldering | Refer to J-STD-0020D curve. |
| Iron soldering | Pre-heating: 150 1 minute Tip temperature: 350 max Soldering iron output: 30w max End of soldering iron tip diameter: 1mm max Soldering time: 3 seconds max |
Package Information
| Item | Dimension (mm) | Details |
| Tape Dimension | W: 8.00.1, A0: 1.150.05, B0: 1.950.05, K0: 0.980.1, E: 0.980.1, F: 1.750.1, P: 3.50.1, P0: 4.00.1, D0: 4.00.1, T: 1.5+0.1/-0.0, 0.180.02 | |
| Reel Dimension | A: 1782, B: 582, C: 13.50.2, G: 9.00.5 | |
| Taping Figure | Drawing direction | |
| Packaging Quantities | 3000PCS/Reel | |
| Peeling Strength of Cover Tape | 0.10N to 1.0N | Standard: EIA-481-D |
Products Storage
| Condition | Details |
| Storage Period | Products inspected over 12 months ago should be examined and used. Solderability should be checked if this period is exceeded. |
| Storage Conditions | Temperature: -10 ~+ 35 Humidity: Less than 70% relative humidity No rapid change on temperature and humidity. |
| Prohibited Storage | Do not keep products in corrosive gases such as sulfur, chlorine gas or acid. |
| Placement | Store on a palette for prevention from humidity, dust, etc. |
| Environmental Factors | Avoid heat shock, vibration, direct sunlight. |
| Packaging | Store under airtight packaged condition. |
2507241130_microgate-MPSM160808BE2R2M20-LF_C49274403.pdf
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