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Quality SMD power inductor microgate MPSM160808BE2R2M20-LF with 2.2 microhenry inductance and 20 volt rating factory
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Quality SMD power inductor microgate MPSM160808BE2R2M20-LF with 2.2 microhenry inductance and 20 volt rating factory
>
Specifications
Current - Saturation (Isat):
1.2A
Mfr. Part #:
MPSM160808BE2R2M20-LF
Package:
0603
Key Attributes
Model Number: MPSM160808BE2R2M20-LF
Product Description

Product Overview

The MPSM160808BE series of SMD power inductors are designed for various electronic applications. These inductors offer reliable performance and are compliant with ROHS+HS standards.

Product Attributes

  • Brand: MICROGATE
  • Manufacturing Name: SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
  • Origin: Shenzhen, China
  • Certifications: ROHS+HS COMPLIANT

Technical Specifications

Microgate Part No.Inductance L0 (uH)DCR (m) Max.DCR (m) Typ.Isat (A) Max.Isat (A) Typ.Irms (A) Max.Irms (A) Typ.Rated Voltage (V)Operating Temperature Range ()
MPSM160808BE2R2M20-LF2.220%2902411.21.31.01.120-55 ~ +125

Reliability Testing

ItemRequirementsTest Methods and RemarksReferenceSample Size
SolderabilityTerminal area must have 95% min. solder coverage.8hours steam age test. Temperature:245 5, flux 5-10 s. Sample immersion tin furnace 5 0.5s. Immersed and in and out of speed: 25 6mm/s.AEC-Q200 (J-STD-002)15
Resistance to Soldering Heat(1) No physical damage. (2)L0/L010%The peak temperature: 260+5/-0. Reflow:3times. Temperature curve is as below:AEC-Q200 (MIL-STD-20 2 Method 210)30
High Temperature StorageTemperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion.AEC-Q200 (MIL-STD -202 Method 108)77
Low Temperature StorageTemperature: -552. Time : 1000 hours. Measurement at 244 hours after test conclusion.JESD22-A11977
Thermal shockFirst -40 for 15 minutes, last 125 15minutes as 1 cycle. Go through 300 cycles. Max transfer time is 20 second. Measurement at 244 hours after test conclusion.MIL-STD -202 Method 10730
Humidity Resistance(1) No physical damage. (2)L0/L010%1000 hours, 85C/85%RH. Unpowered. Measurement at 244 hours after test conclusion.AEC-Q200 (MIL-STD -202 Method 103)77
Terminal StrengthNo physical damage.The test samples shall be soldered to the board. 5.0N, 100.5s.MIL-STD-20230
Board Flex(1) No physical damage. (2)L0/L010%Part mounted on a 100mm*40mm FR4 PCB board, which is 1.60.2 mm thick and as a Layer-thickness 35 m 10 m. Bending speed is 1mm/s. Keeping the P.C Board 2 mm minimum for 60 seconds.AEC-Q200 (AEC-Q200-0 05)30
DropHeight: 1 m, Free fall, 10times. Direction: 1 Angle, 1side, 2surface.JESD22-B11130
VibrationFrequency range : 10~2000Hz. Amplitude: 1.5mm, 5g. Sweep time and duration: 10~2000~10Hz for 20 minutes. Each four hours(12 times) in X,Y,Z direction, 12 hours in total.AEC-Q200 (MIL-STD-20 2 Method 204)30
Loading at High Temperature(1) No physical damage. (2)L0/L010%Temperature: 852. Time : 1000 hours. Rated current. Measurement at 244 hours after test conclusion.AEC-Q200 (MIL-PRF-27)77

Recommended Soldering Conditions

MethodConditions
Reflow solderingRefer to J-STD-0020D curve.
Iron solderingPre-heating: 150 1 minute
Tip temperature: 350 max
Soldering iron output: 30w max
End of soldering iron tip diameter: 1mm max
Soldering time: 3 seconds max

Package Information

ItemDimension (mm)Details
Tape DimensionW: 8.00.1, A0: 1.150.05, B0: 1.950.05, K0: 0.980.1, E: 0.980.1, F: 1.750.1, P: 3.50.1, P0: 4.00.1, D0: 4.00.1, T: 1.5+0.1/-0.0, 0.180.02
Reel DimensionA: 1782, B: 582, C: 13.50.2, G: 9.00.5
Taping FigureDrawing direction
Packaging Quantities3000PCS/Reel
Peeling Strength of Cover Tape0.10N to 1.0NStandard: EIA-481-D

Products Storage

ConditionDetails
Storage PeriodProducts inspected over 12 months ago should be examined and used. Solderability should be checked if this period is exceeded.
Storage ConditionsTemperature: -10 ~+ 35
Humidity: Less than 70% relative humidity
No rapid change on temperature and humidity.
Prohibited StorageDo not keep products in corrosive gases such as sulfur, chlorine gas or acid.
PlacementStore on a palette for prevention from humidity, dust, etc.
Environmental FactorsAvoid heat shock, vibration, direct sunlight.
PackagingStore under airtight packaged condition.

2507241130_microgate-MPSM160808BE2R2M20-LF_C49274403.pdf

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