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Quality SMD power inductor Microgate MPIH252012-3R3M-LF with Ag Ni Sn Cu terminals and Ni-Zn ferrite core material factory
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Quality SMD power inductor Microgate MPIH252012-3R3M-LF with Ag Ni Sn Cu terminals and Ni-Zn ferrite core material factory
>
Specifications
Current - Saturation (Isat):
1.5A
Mfr. Part #:
MPIH252012-3R3M-LF
Package:
1008
Key Attributes
Model Number: MPIH252012-3R3M-LF
Product Description

Product Overview

This specification applies to the MPIH252010 series of SMD power inductors. These inductors are designed for various electronic applications requiring reliable power handling and inductance characteristics.

Product Attributes

  • Brand: MICROGATE
  • Origin: Shenzhen, P.R.C.
  • Material: Ni-Zn Ferrite core, Enameled Copper Wire, Ag/Ni/Sn/Cu terminals, Epoxy resin and magnetic powder glue.
  • Certifications: Lead-free products (LF designation).

Technical Specifications

Microgate Part No.Inductance (uH)DCR () MaxIsat (A) TypIrms (A) Typ
MPIH252012-R24M-LF0.2420%0.0265.804.00
MPIH252012-R33M-LF0.3320%0.0305.055.25
MPIH252012-R47M-LF0.4720%0.0324.503.75
MPIH252012-R68M-LF0.6820%0.0454.003.50
MPIH252012-1R0M-LF1.020%0.0563.003.50
MPIH252012-1R5M-LF1.520%0.0722.302.25
MPIH252012-2R2M-LF2.220%0.1001.902.20
MPIH252012-3R3M-LF3.320%0.1441.701.60
MPIH252012-4R7M-LF4.720%0.2161.401.35
MPIH252012-6R8M-LF6.820%0.3001.201.05
MPIH252012-100M-LF1020%0.4621.000.90
MPIH252012-470M-LF4720%2.2500.420.35

Dimensions

Dimensions in mmABCDEfgh
Value2.500.202.000.201.20Max.0.800.20.800.20.80 Typ.2.50 Typ.2.00 Typ.

Operating Conditions

Product normal work ambient temperature: -40 ~ +125.

Recommended Soldering Conditions

Product can be applied to flow and reflow soldering. Use rosin-based flux. Dont use highly acidic flux with halide content exceeding 0.2wt%. Use Sn solder.

Flow Soldering Conditions

Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150 max. Cooling into solvent after soldering also should be in such a way that temperature difference is limited to 100 max.

Reflow Soldering Conditions

Profile Feature: Average Ramp-Up Rate (Ts max. to Tp): 3/second max. Preheat (Ts min. to Ts max.): 150 to 200, 60-180 seconds. Time maintained above Temperature (TL): 217, 60-150 seconds. Peak/Classification Temperature (Tp): 260, 3-4 seconds.


2410121250_microgate-MPIH252012-3R3M-LF_C490457.pdf

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