Product Overview
The MPIA201610 series of SMD power inductors are designed for various electronic applications. They offer reliable performance with specific electrical characteristics and are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
Product Attributes
- Brand: MICROGATE
- Origin: P.R.C.
- Material: Core: Mixed Alloy Material, Wire: Enameled Copper Wire, Terminal: Ag/Ni/Sn/Cu, Magnetic Glue: Epoxy resin and magnetic powder
- Certifications: Lead free products (LF)
Technical Specifications
| Microgate Part No. | Inductance (uH) | Tolerance | DCR () Max | DCR () Typ | Isat (A) Max | Isat (A) Typ | Irms (A) Max | Irms (A) Typ |
| MPIA201610-R24N-LF | 0.2430% | N (30%) | 0.032 | 0.028 | 5.00 | 5.50 | 3.65 | 4.30 |
| MPIA201610-R33N-LF | 0.3330% | N (30%) | 0.032 | 0.028 | 4.00 | 4.60 | 4.00 | 4.80 |
| MPIA201610-R47N-LF | 0.4730% | N (30%) | 0.035 | 0.029 | 3.50 | 4.00 | 3.80 | 4.50 |
| MPIA201610-R68N-LF | 0.6830% | N (30%) | 0.057 | 0.048 | 3.00 | 3.40 | 2.60 | 3.00 |
| MPIA201610-1R0N-LF | 1.030% | N (30%) | 0.090 | 0.075 | 2.70 | 3.15 | 2.10 | 2.40 |
| MPIA201610-1R5N-LF | 1.530% | N (30%) | 0.130 | 0.110 | 2.00 | 2.20 | 1.70 | 2.00 |
| MPIA201610-2R2N-LF | 2.230% | N (30%) | 0.165 | 0.138 | 1.75 | 2.10 | 1.25 | 1.45 |
| MPIA201610-4R7N-LF | 4.730% | N (30%) | 0.430 | 0.375 | 1.00 | 1.30 | 0.90 | 1.00 |
Dimensions
| Dimensions in mm | A | B | C | D | E | f | g | h |
| Value | 2.000.20 | 1.600.20 | 1.00Max. | 0.600.2 | 0.600.2 | 0.80 Typ. | 2.20 Typ. | 1.60 Typ. |
Testing Conditions
Temperature: Ordinary Temperature (5 to 35), Humidity: Ordinary Humidity (25 to 85% RH). In case of doubt: Temperature: 202, Humidity: 60 to 75% RH, Atmospheric Pressure: 86 to 106 kPa.
Operating Conditions
The part normal work be allowed ambient temperature: -40 ~ +125.
Recommended Soldering Conditions
Flux: Use rosin-based flux. Dont use highly acidic flux with halide content exceeding 0.2wt% (chlorine conversion value). Solder: Use Sn solder.
Flow Soldering Conditions: Pre-heating temperature difference between product surface and solder should not exceed 150. Cooling temperature difference after soldering should not exceed 100.
Reflow Soldering Profile:
- Preheat: 150, 1 minute max.
- Peak Temperature: 350, 3 seconds max.
Profile Features (Lead-Free Assembly):
- Average Ramp-Up Rate (Ts max. to Tp): 3/second max.
- Preheat (Ts min. to Ts max.): 150 to 200, 60-180 seconds.
- Time maintained above Temperature (TL) 217: 60-150 seconds.
- Peak/Classification Temperature (Tp): 260, 3-4 seconds.
- Time within 5 C of actual Peak Temperature (Tp): 20-40 seconds.
- Ramp-Down Rate: 6C/second max.
- Time 25 C to Peak Temperature: 8 minutes max.
Note: All temperatures are measured on the product surface.
2410121252_microgate-MPIA201610-R47N-LF_C486261.pdf
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