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Specifications
Mfr. Part #:
MPIM201610H1R0M-LF
Package:
0806
Key Attributes
Model Number:
MPIM201610H1R0M-LF
Product Description
Product Overview
The MPIM201610H series is a range of SMD power inductors designed for various electronic applications. These components are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD. and are RoHS compliant.
Product Attributes
- Brand: MICROGATE
- Origin: SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
- Material: Core - Mixed Alloy Material, Wire - Enameled Copper Wire, Terminal - Tin Covered Copper
- Certifications: RoHS Compliant
Technical Specifications
| Microgate Part No. | Inductance L0 (uH) | DCR () Max. | DCR () Typ. | Isat (A) Max. | Isat (A) Typ. | Irms (A) Max. | Irms (A) Typ. |
| MPIM201610HR22M-LF | 0.2420% | 0.026 | 0.022 | 5.40 | 6.00 | 3.80 | 4.15 |
| MPIM201610HR33M-LF | 0.3320% | 0.034 | 0.029 | 4.70 | 5.20 | 3.50 | 3.85 |
| MPIM201610HR47M-LF | 0.4720% | 0.040 | 0.036 | 4.00 | 4.50 | 3.10 | 3.40 |
| MPIM201610HR68M-LF | 0.6820% | 0.054 | 0.048 | 3.60 | 4.00 | 2.60 | 2.90 |
| MPIM201610H1R0M-LF | 1.020% | 0.070 | 0.064 | 3.10 | 3.40 | 2.20 | 2.60 |
| MPIM201610H1R5M-LF | 1.520% | 0.110 | 0.100 | 2.40 | 2.70 | 1.80 | 2.05 |
| MPIM201610H2R2M-LF | 2.220% | 0.168 | 0.154 | 1.80 | 2.15 | 1.40 | 1.60 |
Dimensions
| Dimensions | A | B | C | D | f | g | h |
| Value (mm) | 2.000.20 | 1.600.20 | 1.00Max. | 0.500.20 | 0.70 Typ. | 2.00 Typ. | 1.60 Typ. |
Operating Conditions
| Condition | Value |
| Operating Temperature Range | -55 ~ +125 (Including self-heating) |
| Maximum Rated Voltage | DC 20 V |
Reliability Testing
| Item | Requirements | Test Methods and Remarks | Reference Sample Size |
| Solderability | (1) No case deformation or change in appearance. (2) Terminal area must have 95% min. solder coverage. | Temperature:255 5, flux 5-10 s. Sample immersion tin furnace 5 0.5s. Immersed and in and out of speed: 25 6mm/s. AEC-Q200 (J-STD-002) | 15 |
| Resistance to Soldering Heat | (1) No case deformation or change in appearance. (2)L0/L010% | The peak temperature: 260+5/-0. Reflow:3times. Temperature curve is as below: AEC-Q200 (MIL-STD-20 2 Method 210) | 30 |
| High Temperature Storage | Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion. | AEC-Q200 (MIL-STD -202 Method 108) | 77 |
| Low Temperature Storage | Temperature: -552. Time : 1000 hours. Measurement at 244 hours after test conclusion. | JESD22-A119 | 77 |
| Thermal shock | First -40 for 15 minutes, last 125 15minutes as 1 cycle. Go through 300 cycles. Max transfer time is 20 second. Measurement at 244 hours after test conclusion. | MIL-STD -202 Method 107 | 30 |
| Humidity Resistance | (1) No case deformation or change in appearance. (2)L0/L010% | 1000 hours, 85C/85%RH. Unpowered. Measurement at 244 hours after test conclusion. AEC-Q200 (MIL-STD -202 Method 103) | 77 |
| Terminal Strength | No case deformation or change in appearance. | The test samples shall be soldered to the board. 17.64N, 60s,X,Ydirect. AEC-Q200 (AEC-Q200-0 06) | 30 |
| Board Flex | (1) No case deformation or change in appearance. (2)L0/L010% | Part mounted on a 100mm*40mm FR4 PCB board, which is 1.60.2 mm thick and as a Layer-thickness 35 m 10 m. Bending speed is 1mm/s. Keeping the P.C Board 2 mm minimum for 60 seconds. AEC-Q200 (AEC-Q200-0 05) | 30 |
| Drop | Height: 1 m, Free fall, 10times. Direction: 1 Angle, 1side, 2surface. | JESD22-B111 | 30 |
| Vibration | Frequency range : 10~2000Hz. Amplitude: 1.5mm or 20 G. Sweep time and duration: 10~2000~10Hz for 20 minutes. Each four hours(12 times) in X,Y,Z direction, 12 hours in total. | AEC-Q200 (MIL-STD-20 2 Method 204) | 30 |
| Loading at High Temperature | (1) No case deformation or change in appearance. (2)L0/L010% | Temperature: 852. Time : 1000 hours. Applied Current : Rated current. Measurement at 244 hours after test conclusion. AEC-Q200 (MIL-PRF-27) | 77 |
Recommended Soldering Conditions
Reflow soldering conditions: Refer to J-STD-020D.
Iron soldering:
- Pre-heating: 150, 1 minute
- Tip temperature: 350 max
- Soldering iron output: 30w max
- End of soldering iron tip: 1mm max
- Soldering time: 3 seconds max
Package Information
Packaging quantities: 2000PCS/Reel.
Peeling strength of cover tape: 0.10N to 1.0N (EIA-481-D standard).
2511110935_microgate-MPIM201610H1R0M-LF_C490597.pdf
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