SMD Power Inductor - MPIH201610 Series
This specification applies to the MPIH201610 series of SMD power inductors. These components are designed for various electronic applications requiring efficient power management.
Product Attributes
- Brand: SHENZHEN MICROGATE TECHNOLOGY CO.,LTD.
- Origin: P.R.C.
- Product Name: (SMD power inductor)
- Series: MPIH201610 Series
- Environmental Compliance: Lead free products (LF)
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () Max | Isat (A) Typ | Irms (A) Typ |
| MPIH201610-R24M-LF | 0.2420% | 0.032 | 4.20 | 4.30 |
| MPIH201610-R33M-LF | 0.3320% | 0.041 | 3.80 | 3.80 |
| MPIH201610-R47M-LF | 0.4720% | 0.041 | 3.00 | 3.00 |
| MPIH201610-R68M-LF | 0.6820% | 0.060 | 2.60 | 2.80 |
| MPIH201610-1R0M-LF | 1.020% | 0.072 | 2.00 | 2.25 |
| MPIH201610-2R2M-LF | 2.220% | 0.215 | 1.35 | 1.40 |
| MPIH201610-3R3M-LF | 3.320% | 0.380 | 1.30 | 1.05 |
| MPIH201610-4R7M-LF | 4.720% | 0.420 | 1.00 | 1.00 |
| MPIH201610-6R8M-LF | 6.820% | 0.660 | 0.80 | 0.80 |
| MPIH201610-100M-LF | 1020% | 0.820 | 0.65 | 0.70 |
Dimensions and Materials
Appearance and Dimensions (mm):
| A | B | C | D | E | f | g | h |
| 2.000.20 | 1.600.20 | 1.00Max. | 0.600.2 | 0.600.2 | 0.80 Typ. | 2.20 Typ. | 1.60 Typ. |
Material List:
| Item | Material |
| Core | Ni-Zn Ferrite |
| Wire | Enameled Copper Wire |
| Terminal | Ag/Ni/Sn/Cu |
| Magnetic Glue | Epoxy resin and magnetic powder |
Testing Conditions
Unless otherwise specified, testing is performed at ordinary temperature (5 to 35) and humidity (25 to 85% RH). In case of doubt, testing is performed at 202, 60 to 75% RH, and 86 to 106 kPa atmospheric pressure.
Electrical Characteristics Test Conditions
- Inductance Value: 1.0MHz/1V
- Saturation Current (Isat): Based on inductance change (|L|/L30%)
- Temperature Rise Current (Irms): Based on temperature rise (T:40 TYP)
Operating Conditions
The part is allowed to operate in an ambient temperature range of -40 to +125.
Recommended Soldering Conditions
Flux: Use rosin-based flux. Do not use highly acidic flux with halide content exceeding 0.2wt% (chlorine conversion value).
Solder: Use Sn solder.
Reflow Soldering Profile:
| Profile Feature | Value |
| Average Ramp-Up Rate (Ts max. to Tp) | 3/second max. |
| Preheat (Ts min. to Ts max.) | 150, 60-180 seconds |
| Temperature (TL) | 217 |
| Time (tL) | 60-150 seconds |
| Peak/Classification Temperature (Tp) | 260 |
| Peak Time (Tp) | 3-4 seconds |
| Time within 5 C of actual Peak Temperature | 20-40 seconds |
| Ramp-Down Rate | 6C/second max. |
2410121252_microgate-MPIH201610-3R3M-LF_C696469.pdf
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