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Specifications
Current - Saturation (Isat):
1.8A
Mfr. Part #:
MPSM201208BE2R2M-LF
Package:
0805
Key Attributes
Model Number:
MPSM201208BE2R2M-LF
Product Description
Product Overview
The MPSM201208BE series of SMD Power Inductors are designed for various electronic applications. These inductors offer reliable performance and are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
Product Attributes
- Brand: MICROGATE
- Origin: SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
- Certifications: ROHS+HS COMPLIANT
Technical Specifications
| Part Number | Inductance L0 (uH) | Tolerance | DCR Max. (m) | DCR Typ. (m) | Isat Max. (A) | Irms Max. (A) | Operating Temperature |
| MPSM201208BE2R2M-LF | 2.2 | 20% | 161 | 148 | 1.8 | 1.6 | -55 to +125 |
Dimensions
| Symbol | A | B | C | f | g | h |
| Dimensions (mm) | 2.000.20 | 1.200.20 | 0.80Max. | 0.60 Typ. | 0.50 Typ. | 2.10 Typ. |
Reliability
| Item | Requirements | Reference | Sample Size |
| Solderability | Terminal area must have 95% min. solder coverage. | AEC-Q200 (J-STD-002) | 15 |
| Resistance to Soldering Heat | (1) No physical damage. (2)L0/L010% | AEC-Q200 (MIL-STD-202 Method 210) | 30 |
| High Temperature Storage | (1) Temperature: 1252. (2) Time : 1000 hours. | AEC-Q200 (MIL-STD -202 Method 108) | 77 |
| Low Temperature Storage | (1) Temperature: -552. (2) Time : 1000 hours. | JESD22-A119 | 77 |
| Thermal shock | (1) First -40 for 15 minutes, last 125 15minutes as 1 cycle. Go through 300 cycles. (2) Max transfer time is 20 second. | MIL-STD -202 Method 107 | 30 |
| Humidity Resistance | (1) No physical damage. (2)L0/L010% | AEC-Q200 (MIL-STD -202 Method 103) | 77 |
| Terminal Strength | No physical damage. | AEC-Q200 (AEC-Q200-006) | 30 |
| Board Flex | (1) No physical damage. (2)L0/L010% | AEC-Q200 (AEC-Q200-005) | 30 |
| Drop | (1) Height: 1 m, Free fall, 10times. (2) Direction: 1 Angle, 1side, 2surface. | JESD22-B111 | 30 |
| Vibration | (1) Frequency range : 10~2000Hz. (2) Amplitude: 1.5mm, 5g. | AEC-Q200 (MIL-STD-202 Method 204) | 30 |
| Loading at High Temperature | (1) No physical damage. (2)L0/L010% | AEC-Q200 (MIL-PRF-27) | 77 |
Recommended Soldering Conditions
Reflow soldering conditions
Refer to J-STD-0020D standard.
Iron soldering
| Parameter | Condition |
| Pre-heating | 150 1 minute |
| Tip temperature | 350 max |
| Soldering iron output | 30w max |
| End of soldering iron | 1mm max |
| Soldering time | 3 seconds max |
Packaging
| Item | Dimension (mm) | Condition |
| Tape Dimension | W: 8.00.1, A0: 1.600.10, B0: 2.350.10, K0: 1.000.1, E: 1.750.1, F: 3.50.1, P: 4.00.1, P0: 4.00.1, D0: 1.60.1, T: 0.180.02 | |
| Reel Dimension | A: 1782, B: 582, C: 13.50.2, G: 9.00.5 | |
| Peeling strength of cover tape | 0.1N to 1.3N | EIA-481-D standard |
| Packaging quantities | 2000PCS/Reel |
Products Storage
| Condition | Specification |
| Storage period | Products over 12 months old should be examined. Solderability should be checked if this period is exceeded. |
| Storage conditions | Temperature: -10 ~+ 35, Humidity: Less than 70% RH. No rapid change in temperature and humidity. |
| Prohibited storage | Do not store in corrosive gases (sulfur, chlorine gas or acid). |
2507241130_microgate-MPSM201208BE2R2M-LF_C49274402.pdf
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