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Quality electronic inductors microgate MPIE252010-4R7M-LF power inductors with epoxy resin coating and low DCR factory
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Quality electronic inductors microgate MPIE252010-4R7M-LF power inductors with epoxy resin coating and low DCR factory
>
Specifications
Current - Saturation (Isat):
1.2A
Mfr. Part #:
MPIE252010-4R7M-LF
Package:
1008
Key Attributes
Model Number: MPIE252010-4R7M-LF
Product Description

Product Overview

The MPIE252010 series is a range of SMD power inductors designed for various electronic applications. These inductors offer reliable performance and are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD.

Product Attributes

  • Brand: MICROGATE
  • Origin: Shenzhen, P.R.C.
  • Material: Ni-Zn Ferrite core, Enameled Copper Wire, Ag/Ni/Sn/Cu terminals, Epoxy resin and magnetic powder.
  • Certifications: Lead-free products (LF)

Technical Specifications

Microgate Part No.Inductance (uH)DCR () MaxIsat (A) TypIrms (A) Typ
MPIE252010-R24M-LF0.2420%0.0305.504.30
MPIE252010-R33M-LF0.3320%0.0384.053.90
MPIE252010-R47M-LF0.4720%0.0383.903.90
MPIE252010-R68M-LF0.6820%0.0533.503.20
MPIE252010-1R0M-LF1.020%0.0722.602.60
MPIE252010-1R5M-LF1.520%0.1032.202.10
MPIE252010-2R2M-LF2.220%0.1301.702.00
MPIE252010-3R3M-LF3.320%0.2101.601.50
MPIE252010-4R7M-LF4.720%0.3181.301.20
MPIE252010-6R8M-LF6.820%0.4701.101.10
MPIE252010-100M-LF1020%0.6000.800.80
MPIE252010-150M-LF1520%0.9900.600.50

Dimensions

Dimensions in mmABCDEfgh
Value2.500.202.000.201.00Max.0.800.20.800.20.80 Typ.2.50 Typ.2.00 Typ.

Testing Conditions

Ordinary Conditions: Temperature: 5 to 35, Humidity: 25 to 85% RH

Doubtful Conditions: Temperature: 202, Humidity: 60 to 75% RH, Atmospheric Pressure: 86 to 106 kPa

Operating Conditions

Ambient Temperature: -40 to +125

Recommended Soldering Conditions

Flux: Rosin-based flux. Avoid highly acidic flux with halide content exceeding 0.2wt%.

Solder: Use Sn solder.

Flow Soldering: Temperature difference between solder and product surface should not exceed 150 during pre-heating and 100 during cooling.

Reflow Soldering: Peak temperature: 260+5/-0, Peak time: 3-4 seconds.


2410121250_microgate-MPIE252010-4R7M-LF_C490470.pdf

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