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Quality SMD power inductor microgate MPIE252010-1R0M-LF with 1.020 inductance and 2.30 amp saturation current factory
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Quality SMD power inductor microgate MPIE252010-1R0M-LF with 1.020 inductance and 2.30 amp saturation current factory
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Specifications
Current - Saturation (Isat):
2.3A
Mfr. Part #:
MPIE252010-1R0M-LF
Package:
1008
Key Attributes
Model Number: MPIE252010-1R0M-LF
Product Description

Product Overview

The MPIE252010 series is a range of SMD power inductors designed for various electronic applications. These inductors offer reliable performance and are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD.

Product Attributes

  • Brand: MICROGATE
  • Origin: Shenzhen, P.R.C.
  • Certifications: Lead-free products (LF)

Technical Specifications

Microgate Part No.Inductance (uH)DCR Max ()Isat Max (A)Irms Typ (A)
MPIE252010-R24M-LF0.2420%0.0304.004.30
MPIE252010-R33M-LF0.3320%0.0383.803.90
MPIE252010-R47M-LF0.4720%0.0383.703.90
MPIE252010-R68M-LF0.6820%0.0533.003.20
MPIE252010-1R0M-LF1.020%0.0722.302.60
MPIE252010-1R5M-LF1.520%0.1032.002.10
MPIE252010-2R2M-LF2.220%0.1301.502.00
MPIE252010-3R3M-LF3.320%0.2101.451.50
MPIE252010-4R7M-LF4.720%0.3181.201.20
MPIE252010-6R8M-LF6.820%0.4701.001.10
MPIE252010-100M-LF1020%0.6000.750.80
MPIE252010-150M-LF1520%0.9900.500.50

Dimensions

Dimensions in mmABCDEfgh
Value2.500.202.000.201.00Max.0.800.20.800.20.80 Typ.2.50 Typ.2.00 Typ.

Operating Conditions

Product normal work ambient temperature: -40 ~ +125.

Recommended Soldering Conditions

Product can be applied to flow and reflow soldering.

Flux

  • Use rosin-based flux. Dont use highly acidic flux with halide content exceeding 0.2wt% (chlorine conversion value).
  • Use Sn solder.

Flow Soldering Conditions

Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150 max. Cooling into solvent after soldering also should be in such a way that temperature difference is limited to 100 max. Unwrought pre-heating may cause cracks on the product, resulting in the deterioration of products quality.

Reflow Soldering Conditions

Profile Feature:

  • Average Ramp-Up Rate (Ts max. to Tp): 3/second max.
  • Preheat (Ts min. to Ts max.): 150 to 200 , 60-180 seconds.
  • Time maintained above Temperature (TL): 217 , 60-150 seconds.
  • Peak/Classification Temperature (Tp): 260 , 3-4 seconds.

2410121250_microgate-MPIE252010-1R0M-LF_C490466.pdf

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