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Quality Electronic component Microgate MPIT3010-1R5M-LF SMD power inductor suitable for various applications factory
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Quality Electronic component Microgate MPIT3010-1R5M-LF SMD power inductor suitable for various applications factory
>
Specifications
Current - Saturation (Isat):
1.5A
Mfr. Part #:
MPIT3010-1R5M-LF
Package:
SMD,3x3mm
Key Attributes
Model Number: MPIT3010-1R5M-LF
Product Description

Product Overview

The MPIT3010 series is a range of SMD power inductors designed for various electronic applications. These inductors offer reliable performance and are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD.

Product Attributes

  • Brand: MICROGATE
  • Origin: P.R.C.
  • Product Name: SMD power inductor
  • Series: MPIT3010 series
  • Version: Rev2.0
  • Environmental Compliance: Lead-free products

Technical Specifications

Microgate Part No.Inductance (uH)DCR () Max.DCR () Typ.Isat (A) Max.Isat (A) Typ.Irms (A) Max.Irms (A) Typ.
MPIT3010-R56M-LF0.5620%0.0480.0402.502.802.002.15
MPIT3010-R68M-LF0.6820%0.0480.0402.302.502.002.15
MPIT3010-1R0M-LF1.020%0.0660.0551.952.151.752.00
MPIT3010-1R5M-LF1.520%0.0780.0651.501.651.551.70
MPIT3010-2R2M-LF2.220%0.0960.0801.201.351.401.55
MPIT3010-3R3M-LF3.320%0.1450.1201.101.201.151.25
MPIT3010-4R7M-LF4.720%0.2220.1850.951.100.951.05
MPIT3010-6R8M-LF6.820%0.3300.2750.750.850.650.70
MPIT3010-8R2M-LF8.220%0.3480.2900.700.800.700.80
MPIT3010-100M-LF1020%0.4800.3800.650.700.650.70
MPIT3010-150M-LF1520%0.6240.5200.500.600.500.60
MPIT3010-220M-LF2220%1.0000.8000.400.500.400.50
MPIT3010-330M-LF3320%1.2001.0000.300.400.300.40

Dimensions

Dimensions in mmABCDEfgh
3.00.203.00.201.00Max.1.500.20.750.21.50 Typ.3.10 Typ.2.70 Typ.

Materials

ItemMaterial
CoreNi-Zn Ferrite
WireEnameled Copper Wire
Terminal ElectrodeAg/Ni/Sn/Cu
Magnetic GlueEpoxy resin and magnetic powder

Testing Conditions

  • Standard Conditions: Temperature: 5 to 35, Humidity: 25 to 85% RH
  • Doubt Conditions: Temperature: 202, Humidity: 60 to 75% RH, Atmospheric Pressure: 86 to 106 kPa

Reliability and Test Conditions

  • High temperature storage test: 1252 for 1000 hours.
  • Low temperature storage test: -402 for 1000 hours.
  • Humidity test: 25-85, 85% RH for 1000 hours.
  • Thermal shock test: 1000 cycles (-40 for 30 min to 125 for 30 min).
  • Solderability test: Dip pads in flux then dip in solder pot at 2455 for 50.1 second.
  • Heat endurance of reflow soldering: 3 times reflow soldering, peak temperature: 260+5/-0.
  • Vibration test: 10~55Hz, 1.5mm amplitude, 2 hours per direction, 3 directions (total 6 hours).
  • Drop test: 1 meter height, 10 times.
  • Terminal strength push test: 17.64N force for 10 seconds.
  • Terminal strength bending test: Bend 2mm at 0.5mm/sec speed.
  • Loading at High Temperature: 852 for 1000 hours with rated current.

Recommended Soldering Conditions

  • Flux: Rosin-based flux, no strong acidic flux with halide content exceeding 0.2wt%.
  • Solder: Sn solder.
  • Flow soldering conditions: Temperature difference between product surface and solder max 150 during pre-heating, max 100 during cooling.
  • Reflow soldering conditions: Preheat 150 (1 minute max), Peak 260 (3-4 seconds), Ramp-Up Rate max 3/sec, Ramp-Down Rate max 6/sec.

Packaging

Refer to section 9 of the original document.

Visual Inspection Standard

Refer to section 10 of the original document.

Storage

Refer to section 11 of the original document.


2410121252_microgate-MPIT3010-1R5M-LF_C281239.pdf

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