SMD Power Inductor

This specification applies to the MGSFD series of SMD power inductors, designed for various electronic applications requiring efficient power management.

Product Attributes

• Brand: MICROGATE
• Origin: Shenzhen, P.R.C.
• Material: Ni-Zn Ferrite Core, Polyurethane enameled copper wire, Epoxy Resin, Cu+Sn plating
• Certifications: Lead-free product

Technical Specifications

Operating Conditions

Operating temperature range: -40 ~ +125 (Including self-heating)

Recommended Soldering Conditions

Reflow soldering profile:

• Average Ramp-Up Rate: 3/second max.
• Preheat: 150 to 200 for 60-180 seconds
• Time maintained above 217: 60-150 seconds
• Peak/Classification Temperature: 260 for 10 seconds
• Time within 5 C of actual Peak Temperature: 20-40 seconds
• Ramp-Down Rate: 6C/second max.
• Time 25 C to Peak Temperature: 8 minutes max.

Re-work with soldering iron:

• Pre-heating: 150, 1 minute
• Tip temperature: 350 max
• Soldering iron output: 80w max
• End of soldering iron: 1mm max
• Soldering time: 3 seconds max

Package Information

Packaging quantities: 2000PCS/Reel.

Peeling strength of cover tape: 0.15N to 0.65N

Storage Conditions

• Storage period: Products inspected over 6 months ago should be examined. Solderability should be checked if this period is exceeded.
• Storage conditions: Temperature: -10 ~+ 40, Humidity: Less than 80% RH. Avoid rapid changes in temperature and humidity.
• Do not store in corrosive gases (sulfur, chlorine gas, acid).
• Store on palettes to prevent influence from humidity and dust.
• Avoid heat shock, vibration, and direct sunlight.
• Store under airtight packaged conditions.