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Specifications
Current - Saturation (Isat):
1.25A
Mfr. Part #:
MPIH252012-4R7M-LF
Package:
1008
Key Attributes
Model Number:
MPIH252012-4R7M-LF
Product Description
Product Overview
The MPIH252012 series SMD power inductors are designed for various electronic applications. They offer reliable performance and are manufactured by SHENZHEN MICROGATE TECHNOLOGY CO.,LTD.
Product Attributes
- Brand: MICROGATE
- Origin: Shenzhen, P.R.C.
- Material: Ni-Zn Ferrite core, Enameled Copper Wire, Ag/Ni/Sn/Cu terminals, Epoxy resin and magnetic powder glue.
- Certifications: Lead-free products (LF)
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () Max | DCR () Typ | Isat (A) Max | Isat (A) Typ | Irms (A) Max | Irms (A) Typ |
| MPIH252012-R24M-LF | 0.2420% | 0.026 | 0.022 | 5.40 | 5.80 | 3.80 | 4.00 |
| MPIH252012-R33M-LF | 0.3320% | 0.030 | 0.025 | 4.95 | 5.05 | 4.95 | 5.25 |
| MPIH252012-R47M-LF | 0.4720% | 0.032 | 0.027 | 4.20 | 4.50 | 3.40 | 3.75 |
| MPIH252012-R68M-LF | 0.6820% | 0.045 | 0.037 | 3.50 | 4.00 | 3.20 | 3.50 |
| MPIH252012-1R0M-LF | 1.020% | 0.056 | 0.045 | 2.60 | 3.00 | 2.70 | 3.50 |
| MPIH252012-1R5M-LF | 1.520% | 0.072 | 0.060 | 2.10 | 2.30 | 2.10 | 2.25 |
| MPIH252012-2R2M-LF | 2.220% | 0.100 | 0.085 | 1.60 | 1.90 | 2.08 | 2.20 |
| MPIH252012-3R3M-LF | 3.320% | 0.144 | 0.120 | 1.50 | 1.70 | 1.50 | 1.60 |
| MPIH252012-4R7M-LF | 4.720% | 0.216 | 0.180 | 1.25 | 1.40 | 1.20 | 1.35 |
| MPIH252012-6R8M-LF | 6.820% | 0.300 | 0.250 | 1.10 | 1.20 | 0.95 | 1.05 |
| MPIH252012-100M-LF | 1020% | 0.462 | 0.385 | 0.90 | 1.00 | 0.80 | 0.90 |
| MPIH252012-470M-LF | 4720% | 2.250 | 1.850 | 0.40 | 0.42 | 0.32 | 0.35 |
Dimensions
| Dimensions in mm | A | B | C | D | E | f | g | h |
| Value | 2.500.20 | 2.000.20 | 1.20Max. | 0.800.2 | 0.800.2 | 0.80 Typ. | 2.50 Typ. | 2.00 Typ. |
Operating Conditions
Product normal work ambient temperature: -40 ~ +125.
Reliability and Test Conditions
| Item | Required Characteristics | Test Method/Condition |
| High temperature storage test | 1.No case deformation or change in appearance. 2.Inductance change 10% |L|/L10% | Temperature: 1252, Time: 1000 hours. Measurement after 244 hours at room temperature. |
| Low temperature storage test | Inductance change 10% |L|/L10% | Temperature: -402, Time: 1000 hours. Measurement after 244 hours at room temperature. |
| Humidity test | Inductance change 10% |L|/L10% | Temperature: 25-85, Humidity: 85% RH, Time: 1000 hours. Measurement after 244 hours at room temperature. |
| Thermal shock test | Inductance change 10% |L|/L10% | 1000 cycles of -40 for 30min and 125 for 30min. |
| Solderability test | Terminal area must have 90% min. solder coverage. | Dip pads in flux then dip in solder pot at 2455 for 50.1 second. Solder: Sn96.5%Ag3%Cu0.5%. Flux: rosin flux. |
| Heat endurance of reflow soldering | 1.No case deformation or change in appearance. 2.Inductance change 10% |L|/L10% | Refer to reflow curve, 3 times. Peak temperature: 260+5/-0. |
| Vibration test | No case deformation or change in appearance. | 10~55Hz, 1.5mm amplitude, 2 hours in each of 3 mutually perpendicular directions (total 6 hours). |
| Drop test | No case deformation or change in appearance. | Drop 10 times on a concrete floor from a height of 1m. |
| Terminal strength push test | Terminal should not pull off. | Apply 17.64N force for 10s. |
| Loading at High Temperature | 1. No case deformation or change in appearance. 2. |L|/L10% | Temperature: 852, Time: 1000 hours, Apply rated current. Measurement after 244 hours at room temperature. |
Recommended Soldering Conditions
Product can be applied to flow and reflow soldering.
- Flux: Use rosin-based flux. Dont use highly acidic flux with halide content exceeding 0.2wt%.
- Solder: Use Sn solder.
Packaging
Refer to Packaging section in the original document for details.
2410121250_microgate-MPIH252012-4R7M-LF_C490458.pdf
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