Product Overview
The MPIH252010 series of SMD power inductors from SHENZHEN MICROGATE TECHNOLOGY CO., LTD. are designed for various electronic applications. These inductors are manufactured using high-quality materials including Ni-Zn Ferrite cores, Enameled Copper Wire, and Ag/Ni/Sn/Cu terminals, with epoxy resin and magnetic powder for magnetic glue. They are suitable for lead-free applications.
Product Attributes
- Brand: MICROGATE
- Origin: Shenzhen, P.R.C.
- Manufacturing Company: SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
- Environmental Compliance: Lead-free products
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR () Max | DCR () Typ | Isat (A) Max | Isat (A) Typ | Irms (A) Max | Irms (A) Typ |
| MPIH252010-R47M-LF | 0.4720% | 0.042 | 0.035 | 3.40 | 3.60 | 3.20 | 3.50 |
| MPIH252010-R68M-LF | 0.6820% | 0.058 | 0.045 | 2.80 | 3.20 | 2.75 | 3.20 |
| MPIH252010-1R0M-LF | 1.020% | 0.072 | 0.055 | 2.00 | 2.70 | 2.45 | 2.70 |
| MPIH252010-1R5M-LF | 1.520% | 0.108 | 0.090 | 1.80 | 2.00 | 1.80 | 2.00 |
| MPIH252010-2R2M-LF | 2.220% | 0.142 | 0.115 | 1.55 | 1.70 | 1.55 | 1.75 |
| MPIH252010-3R3M-LF | 3.320% | 0.270 | 0.225 | 1.45 | 1.50 | 1.15 | 1.25 |
| MPIH252010-4R7M-LF | 4.720% | 0.330 | 0.275 | 1.15 | 1.25 | 1.00 | 1.10 |
Dimensions (mm): A: 2.500.20, B: 2.000.20, C: 1.00Max., D: 0.800.2, E: 0.800.2, f: 0.80 Typ., g: 2.50 Typ., h: 2.00 Typ.
Material List: Core: Ni-Zn Ferrite; Wire: Enameled Copper Wire; Terminal: Ag/Ni/Sn/Cu; Magnetic Glue: Epoxy resin and magnetic powder.
Testing Conditions: Temperature: Ordinary Temperature (5 to 35), Humidity: Ordinary Humidity (25 to 85% RH). For doubtful results: Temperature: 202, Humidity: 60 to 75% RH, Atmospheric Pressure: 86 to 106 kPa.
Test Instruments: L: CHROMA 3302; DCR: Tonghui TH2516B; IDC: CHROMA 3302 and 1320. L test condition: 1.0MHz/1V. Isat: Based on inductance change (|LI-L|/L30%). Irms: Based on temperature rise (T:40 TYP).
Operating Conditions: Ambient temperature: -40 ~ +125.
Reliability Test Conditions: High temperature storage (1252, 1000h), Low temperature storage (-402, 1000h), Humidity test (25-85, 85% RH, 1000h), Thermal shock (-40 to 125, 1000 cycles), Solderability (2455, 50.1s), Heat endurance of reflow soldering (Peak temp: 260+5/-0, 3 times), Vibration (10~55Hz, 1.5mm, 2h/direction), Drop test (1m height, 10 times), Terminal strength (17.64N pull, 10s), Loading at High Temperature (852, 1000h, rated current).
Recommended Soldering Conditions: Suitable for flow and reflow soldering. Flux: Rosin-based flux. Solder: Sn solder. Flow soldering: Temperature difference between product surface and solder 150 (preheating), 100 (cooling). Reflow soldering profile: Preheat (150, 1 min max), Peak temp (350, 3 sec max). Reflow curve profile: Average Ramp-Up Rate (3/sec max), Preheat (Ts min: 150, Ts max: 200, Time: 60-180s), Liquidus (TL: 217, Time: 60-150s), Peak/Classification Temp (Tp: 260, Time: 3-4s), Time within 5C of Peak (20-40s), Ramp-Down Rate (6C/sec max), Time 25C to Peak (8 min max). All temperatures measured on product surface.
2410121252_microgate-MPIH252010-R47M-LF_C490443.pdf
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