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Specifications
Current Rating:
1A
Inductance:
4.7uH
Tolerance:
±20%
Frequency - Self Resonant:
35MHz
Current - Saturation (Isat):
-
DC Resistance(DCR):
250mΩ
Type:
Multilayer Inductor
Ratings:
-
Q @ Frequency:
-
Mfr. Part #:
MGFL2012F4R7MT-LF
Package:
2012
Key Attributes
Model Number:
MGFL2012F4R7MT-LF
Product Description
Product Overview
The MGFL series of multilayer chip ferrite large current inductors are designed for high-performance applications. These inductors offer a compact form factor and excellent electrical characteristics.
Product Attributes
- Brand: SHENZHEN MICROGATE TECHNOLOGY CO., LTD
- Product Line: MGFL Series
- Origin: Shenzhen, China
- Materials: Ferrite (Ni-Cu-Zn series), Silver (Ag), Nickel-Tin (Ni-Sn)
- Certifications: RoHS compliant (indicated by -LF suffix)
Technical Specifications
| Customer Part No. | Microgate Part No. | Inductance (H) | L Test Freq. (MHz) | SRF (MHz) min | RDC () max | IR* (mA) max | Thickness (mm) |
| MGFL2012F1R0MT-LF | MGFL2012F1R0MT-LF | 1.020% | 1 | 75 | 0.15 | 1400 | 0.850.10 |
| MGFL2012F1R5MT-LF | MGFL2012F1R5MT-LF | 1.520% | 1 | 60 | 0.16 | 1300 | 0.850.10 |
| MGFL2012F2R2MT-LF | MGFL2012F2R2MT-LF | 2.220% | 1 | 50 | 0.20 | 1200 | 0.850.10 |
| MGFL2012F3R3MT-LF | MGFL2012F3R3MT-LF | 3.320% | 1 | 41 | 0.22 | 1100 | 0.850.10 |
| MGFL2012F4R7MT-LF | MGFL2012F4R7MT-LF | 4.720% | 1 | 35 | 0.25 | 1000 | 0.850.10 |
| MGFL2012F100MT-LF | MGFL2012F100MT-LF | 1020% | 1 | 24 | 0.32 | 500 | 1.150.10 |
| MGFL2012F220MT-LF | MGFL2012F220MT-LF | 2220% | 1 | 18 | 0.70 | 300 | 1.150.10 |
Dimensions
| Type | Dimensions (mm) [inch] | ||||
| L (Length) | W (Width) | T (Height) | a1, a2 | ||
| 2012 | 2.000.20 [0.0790.008] | 1.250.20 [0.0490.008] | 0.850.10 [0.0330.004] | 1.150.10 [0.0450.004] | 0.500.30 [0.020.012] |
Reliability Specifications
| NO. | Item | Specifications | Test Methods |
| 1 | Solder- Ability | More than 90% of termination should be covered with new solder. | Solder: Sn, Temperature: 255+5/-0, Flux: rosin, Duration: 3.50.5s |
| 2 | Leaching Resistance | More than 75% of termination Should be covered with new solder. | Solder: Sn, Temperature: 270+2/-0, Flux: rosin, Duration: 100.5s |
| 3 | Bending Strength | No mechanical damage should be noticed | When the board curve to 2mm (0.079 inch) |
| 4 | Body Strength | No mechanical damage should be noticed | Applied specified pull strength in axial direction |
| 5 | Terminal Strength | The terminal and body should be no damage | Applied specified pull strength in axial direction |
| 6 | Drop | 1. Appearance no mechanical damage 2. Inductance change rate: 10% (0.001H ~ 10H); 20% (10H ~ 220H) | Drop 10 times on a concrete floor from a height of 1m. |
| 7 | Vibration | Inductance change rate: 10% (0.001H ~ 10H); 20% (10H ~ 220H) | Frequency: 10 to 55Hz, Amplitude: 1.52mm, Direction and time: X, Y and Z directions for 2 hours each. |
| 8 | Humidity resistance | Inductance change rate: 10% (0.001H ~ 10H); 20% (10H ~ 220H) | Temp.: 602, Humidity: 90%~95%, Test time: 1000 h. Measurement after 24 hours stabilization at normal condition. |
| 9 | High temperature resistance | Inductance change rate: 10% (0.001H ~ 10H); 20% (10H ~ 220H) | Applied rated current, Temp.: 1252, Test time: 1000 h. Measurement after 24 hours stabilization at normal condition. |
| 10 | Low temperature resistance | Inductance change rate: 10% (0.001H ~ 10H); 20% (10H ~ 220H) | Temp.: -552, Test time: 1000 h. Measurement after 24 hours stabilization at normal condition. |
| 11 | Thermal shock | Inductance change rate: 10% (0.001H ~ 10H); 20% (10H ~ 220H) | -55 (303min) to +125 (303min), 100 cycles. Measurement after 24 hours stabilization at normal condition. |
2410121232_microgate-MGFL2012F4R7MT-LF_C281116.pdf
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