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Quality Lead Free SMD Power Inductor Microgate MPIT4012-6R8M-LF Featuring Ni-Zn Ferrite Core and Copper Wire factory
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Quality Lead Free SMD Power Inductor Microgate MPIT4012-6R8M-LF Featuring Ni-Zn Ferrite Core and Copper Wire factory
>
Specifications
Current - Saturation (Isat):
1.25A
Mfr. Part #:
MPIT4012-6R8M-LF
Package:
SMD,4x4mm
Key Attributes
Model Number: MPIT4012-6R8M-LF
Product Description

Product Overview

The MPIT4012 series is a range of SMD power inductors designed for various electronic applications. These inductors offer reliable performance and are manufactured by Shenzhen Microgate Technology Co., Ltd.

Product Attributes

  • Brand: MICROGATE
  • Origin: Shenzhen, P.R.C.
  • Material: Ni-Zn Ferrite core, Enameled Copper Wire, Ag/Ni/Sn/Cu terminals, Epoxy resin and magnetic powder magnetic glue.
  • Certifications: Lead-free products (LF).

Technical Specifications

Microgate Part No.Inductance (uH)DCR () Max.DCR () Typ.Isat (A) Max.Isat (A) Typ.Irms (A) Max.Irms (A) Typ.
MPIT4012-R82M-LF0.8220%0.0650.0503.453.652.002.20
MPIT4012-1R0M-LF1.020%0.0650.0503.003.202.002.20
MPIT4012-1R5M-LF1.520%0.0780.0652.302.501.902.00
MPIT4012-2R2M-LF2.220%0.1040.0872.002.101.852.10
MPIT4012-3R3M-LF3.320%0.1430.1101.801.951.501.70
MPIT4012-4R7M-LF4.720%0.1820.1401.401.551.351.50
MPIT4012-5R6M-LF5.620%0.2150.1651.501.601.251.35
MPIT4012-6R8M-LF6.820%0.2570.1981.251.401.151.30
MPIT4012-100M-LF1020%0.3120.2400.901.050.951.05
MPIT4012-150M-LF1520%0.4940.3800.700.900.800.90
MPIT4012-220M-LF2220%0.7410.5700.600.700.670.75
MPIT4012-330M-LF3320%1.0500.8100.450.690.450.50
MPIT4012-470M-LF4720%1.7601.3500.400.450.400.45
MPIT4012-101M-LF10020%3.6003.0000.300.350.280.30

Testing Conditions

Unless otherwise specified: Temperature: 5 to 35, Humidity: 25 to 85% RH. In case of doubt: Temperature: 202, Humidity: 60 to 75% RH, Atmospheric Pressure: 86 to 106 kPa.

Electrical Characteristics Test Instruments

L and DCR tested with CHROMA 3302 meter. IDC tested with CHROMA 3302 and 1320 meter. Inductance test condition: 100KHz/1V. Saturation current: Based on inductance change (|LI-L|/L30%). Temperature rise current: Based on temperature rise (T:40 TYP).

Working Conditions

Product normal work ambient temperature: -40 ~ +125.

Reliability Testing

High temperature storage test: 1252 for 1000 hours. No case deformation, |L|/L10% after 244 hours at room temperature.

Low temperature storage test: -402 for 1000 hours. No case deformation, |L|/L10% after 244 hours at room temperature.

Humidity test: 25-85, 85% RH for 1000 hours. No case deformation, |L|/L10% after 244 hours at room temperature.

Thermal shock test: 1000 cycles of -40 for 30 min. and 125 for 30 min.

Solderability test: Terminal area must have 90% min. solder coverage after dipping in solder at 2455 for 50.1 seconds.

Heat endurance of reflow soldering: 3 reflow cycles. Peak temperature: 260+5/-0. No case deformation, |L|/L10%.

Vibration test: 10~55Hz, 1.5mm amplitude for 2 hours in each of 3 mutually perpendicular directions (total 6 hours).

Drop test: Drop 10 times on a concrete floor from a height of 1m.

Terminal strength push test: 17.64N force for 10 seconds.

Terminal strength bending test: Bend testing PCB at middle point with 2mm deflection. Pressurizing Speed: 0.5mm/sec, Keep time: 60 1s.

Loading at High Temperature: 852 for 1000 hours with rated current. No case deformation, |L|/L10% after 244 hours at room temperature.

Recommended Soldering Conditions

Product can be applied to flow and reflow soldering.

Flux & Solder: Use rosin-based flux. Dont use highly acidic flux with halide content exceeding 0.2wt%. Use Sn solder.

Flow soldering conditions: Temperature difference between solder and product surface limited to 150 max during pre-heating. Temperature difference during cooling limited to 100 max.

Reflow soldering conditions:

  • Average Ramp-Up Rate (Ts max. to Tp): 3/second max.
  • Preheat (Ts min. to Ts max.): 150 to 200, 60-180 seconds.
  • Time maintained above Temperature (TL): 217, 60-150 seconds.
  • Peak/Classification Temperature (Tp): 260, 3-4 seconds.
  • Time within 5 C of actual Peak Temperature (Tp): 20-40 seconds.
  • Ramp-Down Rate: 6/second max.

2410121252_microgate-MPIT4012-6R8M-LF_C281261.pdf

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