Product Overview
The MAPM series of SMD Power Inductors are designed for various electronic applications. They offer reliable performance and are manufactured by Shenzhen Microgate Technology Co., Ltd.
Product Attributes
- Brand: Microgate
- Origin: Shenzhen, P.R.C.
- Material: Core: Carbonyl Iron Powder, Wire: Polyester-Imide, Terminal: Tin Covered Copper
- Certifications: Lead-Free
Technical Specifications
| Microgate Part No. | Inductance (uH) | DCR (m) Typ. | Max Irms (A) | Isat (A) Typ. | Operating Temperature |
| MAPM0420F-R22M-LF | 0.2220% | 8 | 9.0 | 12.0 | -55 to +125 |
| MAPM0420F-R36M-LF | 0.3620% | 15 | 7.0 | 10.0 | -55 to +125 |
| MAPM0420F-R47M-LF | 0.4720% | 14 | 6.0 | 9.0 | -55 to +125 |
| MAPM0420F-R56M-LF | 0.5620% | 18 | 5.0 | 8.0 | -55 to +125 |
| MAPM0420F-1R0M-LF | 1.020% | 27 | 4.5 | 7.0 | -55 to +125 |
| MAPM0420F-1R5M-LF | 1.520% | 45 | 4.0 | 6.0 | -55 to +125 |
| MAPM0420F-2R2M-LF | 2.220% | 58 | 3.0 | 4.0 | -55 to +125 |
| MAPM0420F-3R3M-LF | 3.320% | 87 | 2.0 | 3.0 | -55 to +125 |
| MAPM0420F-4R7M-LF | 4.720% | 150 | 2.0 | 3.0 | -55 to +125 |
| MAPM0420F-100M-LF | 1020% | 200 | 1.5 | 1.8 | -55 to +125 |
Dimensions
| Model | A (Max.) | B (Max.) | C (Max.) | D (0.3) | E (0.5) | F | G | H |
| MAPM0420F | 4.9 | 4.4 | 2.0 | 1.0 | 1.5 | 2.30 | 4.95 | 2.16 |
Recommended Soldering Conditions
Flow Soldering Conditions: Pre-heating: temperature difference between solder and product surface 150. Cooling into solvent: temperature difference 100.
Reflow Soldering Conditions:
| Profile Feature | Lead-Free Assembly |
| Average Ramp-Up Rate (Ts max. to Tp) | 3 C/second max. |
| Preheat Temperature Min (Ts min.) | 150 |
| Preheat Temperature Max (Ts max.) | 200 |
| Preheat Time ( ts min to ts max.) | 60-180 seconds |
| Time maintained above Temperature (TL) | 217 |
| Time maintained above Time (tL) | 60-150 seconds |
| Peak/Classification Temperature (Tp) | 260 |
| Peak/Classification Time (Tp) | 3-4 seconds |
| Time within 5 C of actual Peak Temperature (tp) | 20-40 seconds |
| Ramp-Down Rate | 6C/second max. |
| Time 25 C to Peak Temperature | 8 minutes max. |
Rework with Soldering Iron: Pre-heating: 150, 1 minute min. Tip temperature: 280 max. Soldering iron output: 20w max. End of soldering iron: 1mm max. Soldering time: 3 seconds max.
Packaging
Packaging Quantities: 3000PCS/Reel.
Peeling Strength of Cover Tape: 0.1N to 1.3 N.
Products Storage
Storage Period: Products inspected over 6 months ago should be examined. Solderability should be checked if this period is exceeded.
Storage Conditions: Temperature: -10 ~+ 40. Humidity: Less than 80% relative. No rapid change in temperature and humidity. Avoid corrosive gases, heat shock, vibration, and direct sunlight. Store in airtight packaged condition on a palette.
2410121317_microgate-MAPM0420F-R47M-LF_C280918.pdf
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