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Specifications
Insulation Resistance(IR):
10MΩ
Operating Temperature:
-40℃~+125℃
DC Resistance(DCR):
15mΩ
Voltage Rating - DC:
80V
Number of Lines:
2
Mfr. Part #:
AMGRC7060M701T-2-LF
Package:
SMD
Key Attributes
Model Number:
AMGRC7060M701T-2-LF
Product Description
Product Overview
The AMGRC7060 series of Common Mode Choke Coils are designed for automotive electronics applications. These coils provide common mode impedance to suppress noise, ensuring reliable performance in demanding environments. They are AEC-Q200 compliant and RoHS compliant, manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
Product Attributes
- Brand: MICROGATE
- Manufacturer: SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
- Origin: Shenzhen, China
- Certifications: ROHS COMPLIANT, AEC-Q200
- Product Type: Common Mode Choke Coil
- Material Code: M (Indicates material type)
- Packing Style: T (Taping), B (Bulk)
- Lead Free: LF
Technical Specifications
| Model | Dimensions (LW) | Common Mode Impedance @100MHz (Min/Typ/Max) | DC Resistance (Max) | Rated Current (Min) | Rated Voltage (Min) | Insulation Resistance (Min) |
|---|---|---|---|---|---|---|
| AMGRC7060M701T-2-LF | 7.06.0 mm | 500 / 700 | 15 m | 4.0 A | 80 V | 10 M |
Dimensions (mm)
| Model | A | B | C (max) | D (Ref) | E | F | G |
|---|---|---|---|---|---|---|---|
| AMGRC7060Series | 7.00.5 | 6.00.5 | 3.8 | 3.50 | 1.50.2 | 1.50.2 | 1.750.2 |
Product Identification Breakdown
- AMGRC: Product Symbol (Automotive electronics products)
- 7060: Dimensions LW (7.06.0 mm)
- M: Material Code
- 701: Impedance (7010^1=700)
- T: Packing Style (Taping)
- 2: Number of signal lines
- LF: Lead Free
Operating Conditions
- Operating Temperature Range: -40 to +125
Testing Conditions
- Standard Conditions: Ambient Temperature: 5 to 35, Relative Humidity: 25 to 85% RH, Atmospheric Pressure: 86 to 106 kPa
- Doubtful Results Conditions: Ambient Temperature: 251, Relative Humidity: 60 to 70% RH, Atmospheric Pressure: 86 to 106 kPa
Reliability Testing (Selected)
| Item | Requirements | Test Methods and Remarks | Reference | Sample Size |
|---|---|---|---|---|
| High Temperature Storage | No case deformation or change in appearance. L/L010% | Temperature: 1252, Time: 1000(+48,0) hours | AEC-Q200 (MIL-STD -202 Method 108) | 77 |
| Low Temperature Storage | No case deformation or change in appearance. L/L010% | Temperature: -552, Time: 1000(+48,0) hours | JESD22-A119 | 77 |
| Thermal shock | No case deformation or change in appearance. L/L010% | -55 for 15 minutes, 125 for 15 minutes, 100 cycles. Max transfer time 20 seconds. | MIL-STD -202 Method 107 | 30 |
| Humidity Resistance | No case deformation or change in appearance. L/L010% | 1000(+48,0) hours, 85C/85%RH. Unpowered. | AEC-Q200 (MIL-STD -202 Method 103) | 77 |
| Board Flex | No case deformation or change in appearance. L/L010% | Part mounted on 100mm*40mm FR4 PCB (1.6mm thick). Bending speed 1mm/s. Keep board 2 mm minimum for 60 seconds. | AEC-Q200 (AEC-Q200-0 05) | 30 |
| Vibration | No case deformation or change in appearance. L/L010% | 10~2000Hz, 5g, 20min/Cycle, 4 hours in each 3 mutually perpendicular directions. | AEC-Q200 | 30 |
| Mechanical Shock | No case deformation or change in appearance. L/L010% | Half sine shock pulse, 100g, 6ms, 6 shocks in each 3 mutually perpendicular directions. | MIL-STD-202 Method213 | 30 |
| Loading at High Temperature | No case deformation or change in appearance. L/L010% | Temperature: 1252, Time: 1000(+48,0) hours, Proper current. | AEC-Q200 (MIL-PRF-27) | 77 |
| Loading at Damp Heat | No case deformation or change in appearance. L/L010% | Temperature: 602, Humidity: 90% to 95% RH; Duration: 1000(+48,0) hours, Applied current: Rated current. | AEC-Q200 | 77 |
Recommended Soldering Conditions
- Reflow Soldering: Refer to J-STD-020D curve.
- Iron Soldering: Pre-heating 150 (1 min), Tip temperature max 350, Soldering iron output max 30w, End of soldering iron 1mm max, Soldering time max 3 seconds.
Packaging
- Packaging Quantity: 1500 PCS/Reel
- Peeling strength of cover tape: 10 to 100 grams in the arrow direction.
Storage Conditions
- Storage Period: Products inspected over 12 months ago should be examined. Solderability should be checked if this period is exceeded.
- Conditions: Temperature: -40 ~+ 60, Humidity: 5~85%RH.
- Avoid corrosive gases (sulfur, chlorine gas, acid).
- Store on a palette to prevent influence from humidity, dust.
- Avoid heat shock, vibration, direct sunlight.
- Store under airtight packaged condition.
Cleaning Conditions
- Cleaning temperature: 60 Max. (40 Max. for fluoride and alcohol type cleaner.)
- Ultrasonic cleaning: Power: 20W/l Max., Frequency: 28 KHz to 40 KHz, Time: 5 minutes Max.
- Cleaners: Isopropyl alcohol (IPA), HCFC-225, Aqueous agents (Surface Active Agent Type, Hydrocarbon Type, Higher Alcohol Type, Alkali saponifier Type).
- Ensure no residual flux and cleaner after cleaning. Dry completely after rinsing with de-ionized water.
2507221720_microgate-AMGRC7060M701T-2-LF_C49274410.pdf
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