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Specifications
Insulation Resistance(IR):
10MΩ
Operating Temperature:
-25℃~+85℃
DC Resistance(DCR):
300mΩ
Voltage Rating - DC:
50V
Number of Lines:
2
Mfr. Part #:
MGRC2012M900T-2-LF
Package:
SMD-4P,2x1.2mm
Key Attributes
Model Number:
MGRC2012M900T-2-LF
Product Description
Product Overview
The MGRC series of Common Mode Choke Coils are designed for effective noise suppression. These components are manufactured by Shenzhen Microgate Technology Co., Ltd. and are suitable for various electronic applications requiring reliable performance and signal integrity.
Product Attributes
- Brand: MICROGATE
- Series Name: MGRC
- Origin: Shenzhen, P.R.C.
- Material: Ni-Zn Ferrite Core, Copper Wire (P180-G1, 0.045mm)
- Environmental Compliance: Lead Free
Technical Specifications
| Part No. | Series Name | Dimensions (LW mm) | Common Mode Impedance () /100MHz | IR (mA) /max | RDC() /max | Rated Voltage(V) /max | Operating Temperature Range | Material Code | Packing Style | Number of Signal Lines |
|---|---|---|---|---|---|---|---|---|---|---|
| MGRC2012M900T-2-LF | MGRC | 2.0 1.2 | 90 25% | 370 | 0.30 | 50 | -25 to +85 | M900 | T (Taping) | 2 |
Reliability Testing
| Item | Specifications | Test Methods | Conditions |
|---|---|---|---|
| Solder- Ability | Can be connected on the Recommendation soldering condition. | Solder: 96.5Sn/3.5 Ag, Temperature: 2555, Flux: rosin, Duration: 3.50.5s | - |
| Leaching Resistance | More than 75% of termination Should be covered with new solder. | Solder: 96.5Sn/3.5 Ag, Temperature: 2702, Flux: rosin, Duration: 100.5s | - |
| Terminal Strength | The terminal and body should be no damage. | Apply a lateral load of 7.5N in the arrow direction. | - |
| Bending Strength | No mechanical damage should be noticed. | When the board curves to 2mm (0.079 inches). | - |
| Vibration | 1. No mechanical damage. 2. Impedance within 20% of initial value. 3. Insulation resistance: >10 M DC. | Frequency: 10 to 55Hz, Amplitude: 1.52mm, Directions: X, Y, Z for 2 hours each. | - |
| Humidity resistance | - | - | Temperature: 852, Humidity: 90%~95%, Test time: 50012 h. Stabilize for (242) hours after test. |
| High temperature resistance | - | Applied rated current. | Temperature: 852, Test time: 5012 h. Stabilize for (242) hours after test. |
| Low temperature resistance | - | - | Temperature: -252, Test time: 4812 h. Stabilize for (242) hours after test. |
| Thermal shock (Temperature cycle) | - | - | -25 for 303min, +85 for 303min, 5 cycles. Stabilize for (242) hours after test. |
Recommended Soldering Conditions
Recommended Footprint
(Diagram not provided in source text)
Recommended Reflow Soldering Conditions (Lead-Free Assembly)
| Profile Feature | Specification |
|---|---|
| Average Ramp-Up Rate (Tsmax to Tp) | 3/second max. |
| Preheat Temperature Min (Tsmin) | 150 |
| Preheat Temperature Max (Tsmax) | 200 |
| Preheat Time (tsmin to tsmax) | 60-180 seconds |
| Time maintained above: Temperature (TL) | 217 |
| Time maintained above: Time (tL) | 60-150 seconds |
| Peak/Classification Temperature (Tp) | 255 |
| Peak/Classification Time (Tp) | 3-4 seconds |
| Time within 5 C of actual Peak Temperature (tp) | 20-40 seconds |
| Ramp-Down Rate | 6C/second max. |
| Time 25 C to Peak Temperature | 8 minutes max. |
| Note 1: All temperatures refer to topside of the package, measured on the package body surface. | |
Reworking with Soldering Iron
| Condition | Specification |
|---|---|
| Pre-heating | 150, 1 minute |
| Tip temperature | 260 max |
| Soldering iron output | 30w max |
| End of soldering iron tip size | 1mm max |
| Soldering time | 5 seconds max |
Packaging
Tape Dimensions
(Diagram not provided in source text)
Reel Dimensions
| Dimension | Size (mm) |
|---|---|
| A | 180 |
| B | 60 |
| C | 13 |
| D | 14.4 |
| E | 8.4 |
Taping Strength
| Component | Strength |
|---|---|
| Carrier tape | 10N or more (1kgf or more) |
| Cover tape | 5N or more (1kgf or more) |
Peeling Strength of Cover Tape
0.05~0.69N
Packing Quantity
T type: 2000pcs/reel (180 mm reel)
Tape Material
- Base tape: Polystyrene
- Cover tape: Polyester
Taping Figure and Drawing Direction
(Diagram not provided in source text)
Test Conditions for Taping Strength
- Temperature: 5~35
- Humidity: 45~85%
- Atmospheric pressure: 860~1060 hpa.
2409271432_microgate-MGRC2012M900T-2-LF_C20606769.pdf
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