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Specifications
Insulation Resistance(IR):
10MΩ
Operating Temperature:
-40℃~+85℃
DC Resistance(DCR):
120mΩ
Voltage Rating - DC:
50V
Number of Lines:
2
Mfr. Part #:
MGRC3225L601T-2-LF
Package:
SMD
Key Attributes
Model Number:
MGRC3225L601T-2-LF
Product Description
Product Overview
The MGRC3225L601T-2-LF is a Common Mode Choke Coil designed for noise suppression in general electronic equipment. This wire-wound chip component offers reliable performance and is suitable for applications in office supply equipment, telecommunications systems, measuring equipment, and household equipment. It is RoHS compliant and manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
Product Attributes
- Brand: MICROGATE
- Manufacturer: SHENZHEN MICROGATE TECHNOLOGY CO., LTD
- Origin: Shenzhen, China
- Product Type: Wire Wound Chip Common Mode Choke Coil
- Series: MGRC3225
- Material Code: L (For Larger Current)
- Packing Style: T (Taping)
- Lead Free: Yes
- RoHS Compliant: Yes
Technical Specifications
| Part No. | Dimensions (LW) | Common-mode Impedance Z () at 100MHz | DC Resistance Rdc (m) Max | Rated Current Idc (mA) Max | Rated Voltage Vdc (V) Max | Insulation Resistance (M) Min | Operating Temperature Range |
|---|---|---|---|---|---|---|---|
| MGRC3225L601T-2-LF | 3.2 2.5 mm | 600 25% | 120 | 1000 | 50 | 10 | -40 to +85 |
Dimensions
| A (mm) | B (mm) | C (mm) | (mm) | (mm) | (mm) | (mm) |
|---|---|---|---|---|---|---|
| 3.2 0.2 | 2.5 0.2 | 2.1 0.2 | 0.90 | 0.90 | 0.60 | 0.60 |
Testing Conditions
- Ordinary Conditions: Temperature: 5 to 35, Humidity: 25 to 85% RH
- In Case of Doubt: Temperature: 202, Humidity: 60 to 75% RH, Atmospheric Pressure: 86 to 106 kPa
Reliable Performance
| No. | Item | Specifications | Test Methods |
|---|---|---|---|
| 1 | Solder-Ability | Terminal area shall be at least 95% covered. | Solder: 96.5% Sn +3.0%Ag+0.5%Cu, Temperature: 2455, Flux: rosin, Duration: 3.50.5s |
| 2 | Leaching Resistance | 1) No case deformation or change in appearance. 2) |Z/Z0| 20% | Peak temperature: 260+5/-0; Reflow: 2 times; Temperature curve as specified. |
| 3 | Terminal Strength | The terminal and body should be no damage. | Solder a chip to test substrate, then laterally apply a load 10N in the X, Y and Z directions. |
| 4 | Bending Strength | No mechanical damage should be noticed. | Soldering a chip to a test substrate, bend the substrate by 2mm and then return. |
| 5 | Vibration | 1) No mechanical damage shall be noticed. 2) |Z/Z0| 20% | Frequency: 10 to 55Hz, Amplitude: 1.5mm, Direction and time: X, Y and Z directions for 2 hours each. |
| 6 | Humidity resistance | - | Test condition: Temp.: 852, Humidity: 90%~95%, Test time: 100024 h. Measurement method: Stabilize at normal condition for (242) hours before test. |
| 7 | High temperature resistance | - | Test condition: Applied rated current. Temp.: 852, Test time: 100024 h. Measurement method: Stabilize at normal condition for (242) hours before test. |
| 8 | Low temperature resistance | - | Test condition: Temp.: -402, Test time: 100024 h. Measurement method: Stabilize at normal condition for (242) hours before test. |
| 9 | Thermal shock (Temperature cycle) | - | Test condition: 1) Temp.: -40, time: 303min; 2) Temp.: +85, time: 303min, 5 cycles. Measurement method: Stabilize at normal condition for (242) hours before test. |
Recommended Soldering Conditions
| Profile Feature | Lead-Free Assembly |
|---|---|
| Average Ramp-Up Rate (Tsmax to Tp) | 3 /second max. |
| Preheat Temperature Min (Tsmin) | 150 |
| Preheat Temperature Max (Tsmax) | 200 |
| Preheat Time (tsmin to tsmax) | 60-180 seconds |
| Time maintained above Temperature (TL) | 217 |
| Time maintained above Time (tL) | 60-150 seconds |
| Peak/Classification Temperature (Tp) | 255 |
| Peak/Classification Time (Tp) | 30 seconds max. |
| Time within 5 C of actual Peak Temperature (tp) | 20-40 seconds |
| Ramp-Down Rate | 6 /second max. |
| Time 25 C to Peak Temperature | 8 minutes max. |
Packaging
- Taping Style: T (Taping)
- Reel Diameter: 180 mm
- Packing Quantity (180 mm reel, T type): 1500pcs/reel
Storage Conditions
- Temperature: -10 to 40
- Humidity: 70% RH
- Avoid exposure to high temperature, high humidity, dust, and harmful gases.
- Keep packages sealed until use.
- Solderability guaranteed for 12 months from the date of delivery under specified storage conditions.
Transportation
- Cases shall not be damaged, destroyed, or exposed to rain.
Warning and Attentions
- Handling: Wear static control bands, use properly grounded devices, use non-magnetic tweezers.
- PCB Handling: Avoid stresses during board splitting. Use appropriate devices for board separation.
- Mechanical Considerations: Avoid excessive mechanical shocks. Do not apply shock or power during transportation.
- Pick-up Pressure: Do not apply pressure to winding parts or ferrite core exposure parts.
- Usage Precautions: Do not apply current in excess of rated current. Keep away from magnetic fields. Consider potential changes in electrical characteristics due to heat or resin coating stress. Ensure proper adhesive use if applicable. Pay attention to heat radiation when mounting components closely. Avoid magnetic coupling due to narrow component spacing.
- Soldering: Refer to recommended conditions. Avoid flux residue on wire parts.
- Cleaning: Max cleaning temperature 60 (40 for fluoride/alcohol). Ultrasonic cleaning power 20W/l, frequency 28-40 KHz, time 5 minutes. Use recommended cleaners. Ensure no residual flux/cleaner. Dry completely after rinsing.
Circuit Design
- Intended Use: General electronic equipment (office supply, telecommunications, measuring, household).
- Not Intended For: Mission-critical equipment or systems requiring special quality and high reliability (traffic, safety, aerospace, nuclear control, medical life-support systems). Contact sales department for such uses.
2507221720_microgate-MGRC3225L601T-2-LF_C49274407.pdf
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