Product Overview
The AMGRC4532B series of Common Mode Choke Coils are designed for automotive electronics applications, specifically for CAN bus systems. These components offer common mode impedance and inductance to filter noise and ensure signal integrity. They are AEC-Q200 compliant, indicating suitability for demanding automotive environments. The series is manufactured by SHENZHEN MICROGATE TECHNOLOGY CO., LTD. and is RoHS compliant.
Product Attributes
- Brand: MICROGATE
- Manufacturer: SHENZHEN MICROGATE TECHNOLOGY CO., LTD.
- Product Type: Common Mode Choke Coil
- Compliance: RoHS Compliant, AEC-Q200
- Application: Automotive electronics, CAN bus
- Origin: Shenzhen, China
Technical Specifications
| Product Name | Model | Dimensions (LW) | Common Mode Impedance @10MHz (Min Typ Max) | Inductance @1MHz (Typ) | DC Resistance (Max) | Rated Current (mA) | Rated Voltage (VDC) | Insulation Resistance (M Min) | Operating Temperature Range |
|---|---|---|---|---|---|---|---|---|---|
| Winding Wire Common Mode Choke Coil | AMGRC4532B510T-2-LF | 4.5 3.2 mm | -30%~50% () | 51 uH | 1.0 | 200 mA | 50 V | 10 M | -40 to +125 |
Dimensions
| Model | A (mm) | B (mm) | C (mm) | D (mm) | Ref. E (mm) | Ref. F (mm) |
|---|---|---|---|---|---|---|
| AMGRC4532 Series | 4.5 0.2 | 3.2 0.2 | 2.8 0.2 | 0.8 | 0.7 | 1.1 |
Product Identification Breakdown
AMGRC 4532 B 510 T - 2 - LF
- AMGRC: Product Symbol (Automotive electronics products)
- 4532: Dimensions LW (4.53.2 mm)
- B: For CAN bus
- 510: Inductance (Example: 510 = 51uH)
- T: Packing Style (Taping)
- 2: Number of signal lines
- LF: Lead Free
Packaging Information
- Packaging Quantity: 1500 PCS/Reel
- Tape Dimensions: A: 330 mm, B: 100 mm, C: 13 mm, G: 13 mm
- Cover Tape Peeling Strength: 10 to 100 grams
Storage Conditions
- Temperature: -40 ~ +60
- Humidity: 5~85% RH
- Conditions: Store in airtight packaging, avoid corrosive gases, heat shock, vibration, and direct sunlight. Store on a palette.
Warning and Attentions
- General Handling: Wear static control bands, use grounded devices, use non-magnetic tweezers. Avoid excessive mechanical shocks.
- Soldering: Follow recommended soldering conditions. Avoid flux residue.
- Usage: Do not exceed rated current. Keep away from magnetic fields. Consider resin curing stress. Ensure proper land pattern design and adhesive application. Pay attention to heat radiation when mounting.
- PCB Design: Design PCB to avoid mechanical stress from board warp or deflection. Locate products sideways to mechanical stress.
- Cleaning: Limit cleaning temperature to 60 Max (40 Max for fluoride/alcohol). Ultrasonic cleaning parameters specified. Ensure no residual flux or cleaner.
2507231537_microgate-AMGRC4532B510T-2-LF_C7471403.pdf
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