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Specifications
Current - Saturation (Isat):
3.5A
Mfr. Part #:
MTQH252008S1R5MBT
Package:
1008
Key Attributes
Model Number:
MTQH252008S1R5MBT
Product Description
MTQH2520 Series Mini Molded Chip Power Inductors
Product Overview
The MTQH2520 Series Mini Molded Chip Power Inductors are designed for high current and low loss applications. Featuring a closed magnetic circuit design to minimize leakage flux and a vinyl thermal spray for improved surface compactness, these inductors are ideal for a wide range of electronic devices. They are RoHS compliant and operate within an extended temperature range of -55 to +125 (including self-temperature rise). Key applications include smartphones, tablets, notebooks, VR/AR devices, portable gaming devices, smart wearables, and Wi-Fi modules.
Product Attributes
- Brand: Metal-Lions (implied by URL)
- Series Name: MTQH2520
- Type: Mini Molding Chip type power inductor
- Material Code: S Type
- Coating Color: Black (B)
- Certifications: RoHS compliant
Technical Specifications
Dimensions and Land Pattern
Dimensions: [mm]
Land Pattern: [mm]
| Series | L (mm) | G (mm) | W (mm) | T (mm) | A (mm) | B (mm) | C (mm) |
|---|---|---|---|---|---|---|---|
| MTQH 252008S | 2.50.2 | 0.70.2 | 2.00.2 | 0.80Max. | 2.60 | 0.70 | 2.10 |
| MTQH 252010S | 2.50.2 | 0.70.2 | 2.00.2 | 1.00Max. | 2.60 | 0.70 | 2.10 |
| MTQH 252075S | 2.50.2 | 0.70.2 | 2.00.2 | 0.75Max. | 2.60 | 0.70 | 2.10 |
| MTQH 252012S | 2.50.2 | 0.70.2 | 2.00.2 | 1.20Max. | 2.60 | 0.70 | 2.10 |
Electrical Properties
Test Remarks:
- Note 1: All test data is referenced to 25 ambient.
- Note 2: Test Condition: 1MHz, 1.0Vrms.
- Note 3: Irms: DC current (A) that will cause an approximate T of 40.
- Note 4: Isat: DC current (A) that will cause L0 to drop approximately 30%.
- Note 5: Operating Temperature Range -55 to +125.
- Note 6: The part temperature (ambient + temp rise) should not exceed 125 under the worst case operating conditions. Part temperature should be verified in the end application.
- Note 7: The rated current as listed is either the saturation current or the heating current depending on which value is lower.
MTQH252008S Series
| P/N | L0(H) @ (0A) 1MHz | Rdc(m | Heat rating current Irms(A) | Saturation current Isat(A) | |||
|---|---|---|---|---|---|---|---|
| Typical | Max | Typical | Max | Typical | Max | ||
| MTQH252008SR47MBT | 0.47 | 22 | 27 | 6.5 | 6.0 | 6.0 | 5.3 |
| MTQH252008S1R0MBT | 1.0 | 34 | 40 | 4.3 | 4.0 | 4.5 | 4.0 |
| MTQH252008S1R5MBT | 1.5 | 64 | 75 | 3.4 | 3.0 | 3.5 | 3.0 |
| MTQH252008S2R2MBT | 2.2 | 69 | 77 | 3.0 | 2.6 | 3.0 | 2.6 |
| MTQH252008S3R3MBT | 3.3 | 150 | 180 | 2.5 | 2.1 | 2.5 | 2.1 |
| MTQH252008S100MBT | 10 | 500 | 600 | 1.4 | 1.2 | 1.1 | 0.9 |
MTQH252010S Series
| P/N | L0(H) @(0A) 1MHz | Rdc(m | Heat rating current Irms(A) | Saturation current Isat(A) | |||
|---|---|---|---|---|---|---|---|
| Typical | Max | Typical | Max | Typical | Max | ||
| MTQH252010SR22MBT | 0.22 | 12 | 17 | 6.8 | 6.5 | 8.6 | 7.9 |
| MTQH252010SR24MBT | 0.24 | 12 | 17.5 | 6.7 | 6.4 | 8.5 | 7.8 |
| MTQH252010SR33MBT | 0.33 | 13 | 19 | 6.5 | 6.2 | 7.6 | 7.2 |
| MTQH252010SR47MBT | 0.47 | 15 | 22 | 6.1 | 5.6 | 6.9 | 6.5 |
| MTQH252010SR47MBTA | 0.47 | 13 | 15 | 6.5 | 6.0 | 6.6 | 6.0 |
| MTQH252010SR68MBT | 0.68 | 23 | 27 | 5.6 | 5.0 | 5.9 | 5.5 |
| MTQH252010S1R0MBT | 1.0 | 25 | 30 | 4.5 | 4.1 | 5.3 | 4.8 |
| MTQH252010S1R5MBT | 1.5 | 45 | 55 | 3.4 | 3.0 | 4.3 | 3.9 |
| MTQH252010S2R2MBT | 2.2 | 62 | 70 | 2.4 | 2.1 | 3.3 | 3.0 |
| MTQH252010S3R3MBT | 3.3 | 86 | 100 | 2.5 | 2.1 | 2.8 | 2.5 |
| MTQH252010S4R7MBT | 4.7 | 160 | 180 | 2.0 | 1.6 | 2.6 | 2.0 |
| MTQH252010S4R7MBTA | 4.7 | 145 | 160 | 2.0 | 1.6 | 2.6 | 2.0 |
| MTQH252010S2R2MBTA | 2.2 | 62 | 70 | 4.0 | 3.2 | 3.4 | 3.1 |
| MTQH252010S6R8MBT | 6.8 | 270 | 320 | 1.6 | 1.4 | 2.4 | 1.9 |
| MTQH252010S100MBT | 10.0 | 500 | 560 | 1.05 | 0.95 | 1.55 | 1.4 |
| MTQH252010S220MBT | 22.0 | 1100 | 1300 | 0.85 | 0.6 | 1.1 | 0.9 |
MTQH252012S Series
| P/N | L0(H) @(0A) 1MHz | Rdc(m | Heat rating current Irms(A) | Saturation current Isat(A) | |||
|---|---|---|---|---|---|---|---|
| Typical | Max | Typical | Max | Typical | Max | ||
| MTQH252012SR10MBT | 0.1 | 6 | 10 | 12 | 10.5 | 13.5 | 12.5 |
| MTQH252012SR15MBT | 0.15 | 7 | 11 | 11.5 | 10 | 13.0 | 12.0 |
| MTQH252012SR22MBT | 0.22 | 9 | 14 | 8.2 | 7.6 | 9.6 | 9.0 |
| MTQH252012SR24MBT | 0.24 | 10 | 15 | 8.0 | 7.5 | 9.3 | 8.8 |
| MTQH252012SR33MBT | 0.33 | 11 | 17 | 6.8 | 6.4 | 8.3 | 7.8 |
| MTQH252012SR47MBT | 0.47 | 13 | 19 | 6.5 | 6.0 | 7.5 | 7.0 |
| MTQH252012SR47MBTA | 0.47 | 11 | 13 | 8.0 | 7.5 | 8.5 | 8.0 |
| MTQH252012SR68MBT | 0.68 | 17 | 23 | 6.3 | 5.5 | 6.5 | 6.0 |
| MTQH252012S1R0MBT | 1.0 | 35 | 42 | 4.0 | 3.6 | 5.6 | 5.0 |
| MTQH252012S1R0MBTA | 1.0 | 16 | 22 | 5.2 | 4.5 | 6.5 | 6.0 |
| MTQH252012S1R5MBT | 1.5 | 44 | 50 | 3.7 | 3.2 | 4.5 | 4.1 |
| MTQH252012S1R5MBTA | 1.5 | 27 | 32 | 4.6 | 4.2 | 4.7 | 4.4 |
| MTQH252012S2R2MBT | 2.2 | 55 | 65 | 3.0 | 2.7 | 3.8 | 3.3 |
| MTQH252012S3R3MBT | 3.3 | 80 | 97 | 2.3 | 1.8 | 3.0 | 2.7 |
| MTQH252012S4R7MBT | 4.7 | 150 | 170 | 1.8 | 1.5 | 2.4 | 2.1 |
| MTQH252012S6R8MBT | 6.8 | 245 | 270 | 1.6 | 1.4 | 2.0 | 1.7 |
| MTQH252012S100MBT | 10.0 | 330 | 400 | 1.2 | 1.05 | 1.6 | 1.45 |
| MTQH252012SR68MBTA | 0.68 | 15 | 18 | 7.5 | 7.0 | 6.7 | 6.0 |
| MTQH252012SR82MBT | 0.82 | 19 | 24 | 5.8 | 5.3 | 6.5 | 5.8 |
MTQH252075S Series
| P/N | L0(H) @ (0A) 1MHz | Rdc(m | Heat rating current Irms(A) | Saturation current Isat(A) | |||
|---|---|---|---|---|---|---|---|
| Typical | Max | Typical | Max | Typical | Max | ||
| MTQH252075S2R2MBT | 2.2 | 78 | 90 | 2.3 | 2.0 | 2.6 | 2.4 |
| MTQH252075S100MBT | 10.0 | 487 | 530 | 1.1 | 0.9 | 1.1 | 0.9 |
Reliability
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Insulation Resistance | 100M | 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds. |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec. |
| Adhesion of teral electrode | Strong bond between the pad and the core, without come off PCB. | Inductors shall be subjected to (2605)for (205)s Soldering in the base whit 0.3mm solder. And then aplombelectrode way plus tax 10 N for (101) seconds. |
| High temperature | No case deformation or change in appearance. Inductance change: Within 10% | Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Low temperature | No visible mechanical damage. Inductance change: Within 10% | Temperature: -402. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10% | The test sample shall be placed at (-553)and (1253)for (303) min, different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing. |
| Temperature characteristic | Inductance change Pc-b,Pc-d: Within 20% | a+20 30~45 b: -40 30~45 c: +20 30~45 d: +125 30~45 e: +20 30~45 100% c-b c c P Lb L L c-d 100% c c P Ld L L |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10% | Inductors shall be subjected to (953)%RH . at(602)for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing. |
| No visible mechanical damage. Inductance change: Within 10% | Inductors shall be store at (852)for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing |
Soldering Condition (Recommendation)
Recommend Reflow Soldering Profile: (solder : Sn96.5 / Ag3 / Cu0.5)
| Profile Feature | Lead (Pb)-Free solder |
|---|---|
| Preheat: Temperature Min (Tsmin) | 150 |
| Preheat: Temperature Max (Tsmax) | 200 |
| Preheat: Time (Tsmin to Tsmax ) (ts) | 60 -120 seconds |
| Average ramp-up rate (Ts max to Tp) | 3/ second max. |
| Time maintained above : Temperature (TL) | 217 |
| Time maintained above : Time (tL) | 60 -150 seconds |
| Peak Temperature (Tp) | 260 |
| Time within +/5 of actual peak Temperature (tp) | 10 seconds |
| Ramp-down Rate | 6/second max. |
| Time 25 to Peak Temperature | 8 minutes max. |
| Allowed Re-flow times | 2 times |
| Remark | To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace. |
Packing Dimension
Dimension of plastic taping: (Unit: mm)
| Type | A 0.5 | B 0.5 | C 0.5 | D 1 |
|---|---|---|---|---|
| All | 178 | 60 | 12 | 1.5 |
Packing Quantity: 3000pcs/Reel
Dimension of Reel: (Unit: mm)
| Series | W 0.30 | A0 0.05 | B0 +0.1/-0 | D +0.1/-0 | D1 Min | E 0.10 | F 0.10 | K0 0.05 | P0 0.10 | P2 0.10 | P 0.10 | T 0.05 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 252010 | 8.00 | 2.40 | 2.80 | 1.50 | 1.0 | 1.75 | 3.50 | 1.20 | 4.00 | 2.00 | 4.00 | 0.23 |
| 252012 | 8.00 | 2.40 | 2.80 | 1.50 | 1.0 | 1.75 | 3.50 | 1.40 | 4.00 | 2.00 | 4.00 | 0.23 |
| 252008 | 8.00 | 2.40 | 2.80 | 1.50 | 1.0 | 1.75 | 3.50 | 1.00 | 4.00 | 2.00 | 4.00 | 0.23 |
2410122030_MetalLions-MTQH252008S1R5MBT_C17701185.pdf
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