Product Overview
The MMPC0503 Series High Current Molded Power Inductors are designed for high-efficiency applications requiring compact solutions. Featuring carbonyl powder cores, these inductors offer high current capability, low DCR, and efficient operation up to 5MHz. They are particularly well-suited for PC power systems, including IMVP-6 DC/DC converters, and provide very low acoustic and leakage flux noise. The series is RoHS compliant and operates within a temperature range of -40 to +125 (including self-temperature rise).
Product Attributes
- Core Material: Carbonyl Powder
- Wire Material: Polyester Wire or equivalent
- Clip Material: 100% Pb free solder (Ni+Sn---Plating)
- Paint Material: Epoxy resin
- Ink Material: Halogen-free ketone
- Certifications: RoHS compliant
- Packing: Tape Carrier Package
Technical Specifications
| Part Number | Inductance (uH) 20% | Irms (A) Typ | Isat (A) Typ | DCR (m) Max |
|---|---|---|---|---|
| MMPC0503-R10YT | 0.10 30% | 24.0 | 40.0 | 2.60 |
| MMPC0503-R15YT | 0.15 30% | 22.0 | 37.0 | 3.00 |
| MMPC0503-R22MT | 0.22 | 19.0 | 32.0 | 3.80 |
| MMPC0503-R33MT | 0.33 | 15.0 | 20.0 | 5.00 |
| MMPC0503-R47MT | 0.47 | 13.0 | 18.0 | 7.10 |
| MMPC0503-R56MT | 0.56 | 12.0 | 17.0 | 8.60 |
| MMPC0503-R68MT | 0.68 | 11.0 | 15.5 | 9.00 |
| MMPC0503-R82MT | 0.82 | 10.0 | 14.0 | 10.0 |
| MMPC0503-1R0MT | 1.00 | 9.00 | 13.0 | 12.7 |
| MMPC0503-1R5MT | 1.50 | 8.00 | 11.5 | 16.6 |
| MMPC0503-2R2MT | 2.20 | 7.00 | 11.0 | 29.2 |
| MMPC0503-3R3MT | 3.30 | 6.00 | 9.00 | 38.0 |
| MMPC0503-4R7MT | 4.70 | 5.50 | 8.00 | 53.0 |
| MMPC0503-5R6MT | 5.60 | 4.70 | 7.30 | 62.0 |
| MMPC0503-6R8MT | 6.80 | 4.20 | 6.00 | 76.2 |
| MMPC0503-8R2MT | 8.20 | 3.80 | 5.00 | 97.0 |
| MMPC0503-100MT | 10.0 | 3.50 | 4.00 | 120 |
| MMPC0503-150MT | 15.0 | 2.70 | 3.20 | 190 |
| MMPC0503-220MT | 22.0 | 2.20 | 2.70 | 250 |
| Dimensions (mm) | L | G | H | A | B | C | D | E |
|---|---|---|---|---|---|---|---|---|
| Values | 6.2 | 2.2 | 2.8 | 5.70.3 | 5.20.2 | 2.80.2 | 1.10.3 | 2.50.3 |
| Operating Temperature Range | Test Condition |
|---|---|
| -40125 | (Including self temp. rise) |
| Reliability Test Item | Performance | Test Condition |
|---|---|---|
| Life Test | Appearance: No damage. Inductance: within10% of initial value. Q: Shall not exceed the specification value. RDC: within 15% of initial value and shall not exceed the specification value. | Preconditioning: Run through IR reflow for 3 times. Temperature: 1252 (Inductor, ambient + temp rise). Applied current: rated current. Duration: 100012hrs. Measured at room temperature after placing for 242 hrs. |
| Load Humidity | Inductance: with 100% rated current. | Preconditioning: Run through IR reflow for 3 times. Humidity: 852% RH, Temperature: 852. Duration: 1000hrs Min. |
| Moisture Resistance | Preconditioning: Run through IR reflow for 3 times. Cycle: Baked at 50 for 25hrs, measured at room temperature after placing for 4 hrs. Raise temperature to 65 2 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25 in 2.5hrs. Repeat cycle. Then keep at 25 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. | |
| Thermal shock | Preconditioning: Run through IR reflow for 3 times. Condition for 1 cycle: Step1: -402 305min, Step2: 1252 0.5min, Step3: 1252 305min. Number of cycles: 500. Measured at room temperature after placing for 242 hrs. | |
| Vibration | Preconditioning: Run through IR reflow for 3 times. Oscillation Frequency: 10Hz2KHz10Hz for 20 minutes. Total Amplitude: 10g. Testing Time: 12 hours (20 minutes, 12 cycles each of 3 orientations). | |
| Bending | Appearance: No damage. Inductance: within10% of initial value. Q: Shall not exceed the specification value. RDC: within 15% of initial value and shall not exceed the specification value. | Mounted on a FR4 substrate. Bending depth: >=0805 inch(2012mm):1.2mm, <0805 inch(2012mm):0.8mm. Duration of 10 sec. |
| Shock | 3 shocks in each direction along 3 perpendicular axes (18 shocks). Type: SMD. Peak value (gs): 50. Normal duration (D) (ms): 11. Wave form: Half-sine. Velocity change (Vi) ft/sec: 11.3. |
| Soldering Method | Parameters |
|---|---|
| Solder re-flow | Recommended temperature profiles for re-flow soldering in Figure 1. Reflow times: 3 times max. |
| Soldering Iron | Preheat circuit and products to 150. Never contact the ceramic with the iron tip. Use a 20 watt soldering iron with tip diameter of 1.0mm. 355 tip temperature (max). 1.0mm tip diameter (max). Limit soldering time to 4~5sec. Iron Soldering times: 1 times max. |
| Packaging Information | Reel Dimension (13x12mm) | Tape Dimension (mm) | Packaging Quantity | Tearing Off Force |
|---|---|---|---|---|
| Values | 12.4+2/-0 (A), 1002 (B), 13+0.5/-0.2 (C), 330 (D) | B0: 6.20.1, A0: 5.50.1, K0: 3.30.1, P: 8.00.1, W: 12.00.3, F: 5.50.1, T: 0.350.05, D: 1.50.1 | 2000 pcs / Reel | 10 to 130 grams (165 to 180). Room Temp. (5~35), Room Humidity (45~85%), Room atm (860~1060 hPa), Tearing Speed (300 mm/min). |
| Application Notice | Storage Conditions (component level) |
|---|---|
| To maintain the solderability of terminal electrodes: | 1. Products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40 and 60% RH. 3. Recommended products should be used within 12 months form the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. |
2504251720_MetalLions-MMPC0503-3R3MT_C48579566.pdf
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