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Specifications
Current - Saturation (Isat):
1.2A
Mfr. Part #:
MTQH160808S4R7MBT
Package:
0603
Key Attributes
Model Number:
MTQH160808S4R7MBT
Product Description
Product Overview
The MTQH1608 Series Mini Molded Chip Power Inductors are designed for high-current applications with low loss, featuring a closed magnetic circuit for reduced leakage flux. Constructed with metal material and a vinyl thermal spray for enhanced surface compactness, these RoHS-compliant inductors are suitable for a wide operating temperature range of -55 to +125. They are ideal for use in smart phones, pads, notebooks, VR/AR devices, portable gaming devices, smart wearables, and Wi-Fi modules.
Product Attributes
- Brand: Metal-Lions (implied by URL www.metal-lions.com)
- Series: MTQH1608
- Type: Mini Molded Chip Power Inductor
- Material: Metal material
- Coating: Vinyl thermal spray
- Magnetic Circuit: Closed magnetic circuit design
- Compliance: RoHS compliant
- Coating Color: Black (B)
- Internal Code: A, B
- Packing: Tape Carrier Package
Technical Specifications
Dimensions and Land Pattern
| Series | L (mm) | W (mm) | T (mm) | A (mm) | B (mm) | C (mm) |
|---|---|---|---|---|---|---|
| MTQH160865B | 1.6 0.1 | 0.5 0.2 | 0.8 0.1 | 0.65 Max. | 1.70 | 0.40 |
| MTQH160865S | 1.6 0.2 | 0.5 0.2 | 0.8 0.2 | 0.65 Max. | 1.60 | 0.40 |
| MTQH160808S | 1.6 0.2 | 0.5 0.2 | 0.8 0.2 | 0.80 Max. | 1.70 | 0.40 |
Electrical Properties & Part Number Explanation
| Part Number | Series Name | Size Code (L*W*T) | Material Code | Initial Inductance Value (L0 @ 1MHz, 0A) (H) | Tolerance (M) | Coating Color (B) | Internal Code | Rdc (m) Typical | Rdc (m) Max | Heat Rating Current Irms (A) Typical | Heat Rating Current Irms (A) Max | Saturation Current Isat (A) Typical | Saturation Current Isat (A) Max |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| MTQH160865BR22MBT | Mini Molding Chip type power inductor | 1.6*0.8*0.65mm | B | 0.22 | 20% | Black | A | 35 | 43 | 3.8 | 3.5 | 4.7 | 4.3 |
| MTQH160865SR47MBT | Mini Molding Chip type power inductor | 1.6*0.8*0.65mm | S | 0.47 | 20% | Black | A | 66 | 82 | 2.3 | 2.0 | 3.3 | 3.0 |
| MTQH160808SR22MBT | Mini Molding Chip type power inductor | 1.6*0.8*0.8mm | S | 0.22 | 20% | Black | A | 33 | 40 | 3.4 | 3.0 | 5.5 | 5.0 |
| MTQH160808SR24MBT | Mini Molding Chip type power inductor | 1.6*0.8*0.8mm | S | 0.24 | 20% | Black | A | 34 | 41 | 3.3 | 2.9 | 5.3 | 4.8 |
| MTQH160808SR24MBTA | Mini Molding Chip type power inductor | 1.6*0.8*0.8mm | S | 0.24 | 20% | Black | A | 22 | 26 | 3.9 | 3.5 | 4.9 | 4.4 |
| MTQH160808SR47MBT | Mini Molding Chip type power inductor | 1.6*0.8*0.8mm | S | 0.47 | 20% | Black | A | 80 | 100 | 2.6 | 2.3 | 4.1 | 3.7 |
| MTQH160808SR47MBTA | Mini Molding Chip type power inductor | 1.6*0.8*0.8mm | S | 0.47 | 20% | Black | A | 38 | 45 | 3.8 | 3.4 | 4.0 | 3.5 |
| MTQH160808SR56MBT | Mini Molding Chip type power inductor | 1.6*0.8*0.8mm | S | 0.56 | 20% | Black | A | 85 | 110 | 2.2 | 1.9 | 4.0 | 3.5 |
| MTQH160808SR68MBT | Mini Molding Chip type power inductor | 1.6*0.8*0.8mm | S | 0.68 | 20% | Black | A | 110 | 130 | 2.1 | 1.9 | 3.3 | 3.0 |
| MTQH160808S1R0MBT | Mini Molding Chip type power inductor | 1.6*0.8*0.8mm | S | 1.0 | 20% | Black | A | 180 | 200 | 2.1 | 1.8 | 3.0 | 2.6 |
| MTQH160808S1R0MBTA | Mini Molding Chip type power inductor | 1.6*0.8*0.8mm | S | 1.0 | 20% | Black | A | 105 | 115 | 2.1 | 1.8 | 2.3 | 2.1 |
| MTQH160808S2R2MBT | Mini Molding Chip type power inductor | 1.6*0.8*0.8mm | S | 2.2 | 20% | Black | A | 220 | 260 | 1.4 | 1.2 | 1.5 | 1.3 |
| MTQH160808S4R7MBT | Mini Molding Chip type power inductor | 1.6*0.8*0.8mm | S | 4.7 | 20% | Black | A | 585 | 700 | 1.0 | 0.8 | 1.2 | 1.0 |
Operating Conditions
| Parameter | Value |
|---|---|
| Operating Temperature Range | -55 to +125 (Including self temp. rise) |
| Test Condition (Electrical) | 1MHz, 1.0Vrms at 25 ambient |
| Irms Definition | DC current that will cause an approximate T of 40 |
| Isat Definition | DC current that will cause L0 to drop approximately 30% |
| Maximum Part Temperature | 125 (ambient + temp rise) |
Reliability Testing
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Insulation Resistance | 100M | 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds. |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec. |
| Adhesion of teral electrode | Strong bond between the pad and the core, without come off PCB. | Inductors shall be subjected to (2605) for (205)s Soldering in the base with 0.3mm solder. And then apply electrode way plus tax 10 N for (101) seconds. |
| High temperature | No case deformation or change in appearance. Inductance change: Within 10%. | Temperature: 1252. Time: 1000 hours. Measurement at 244 hours after test conclusion. |
| Low temperature | No visible mechanical damage. Inductance change: Within 10%. | Temperature: -402. Time: 1000 hours. Measurement at 244 hours after test conclusion. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10%. | Sample placed at (-553) and (1253) for (303)s, conversion time 2~3 minutes. 32 cycles. Placed at room temperature for 2 hours, tested within 484 hours. |
| Temperature characteristic | Inductance change Pc-b, Pc-d: Within 20%. | a+20 b: -40 c: +20 d: +125 e: +20 . Calculation: P = (Lb - Lc)/Lc * 100%; P = (Ld - Lc)/Lc * 100%. |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10%. | Subjected to (953)%RH at (602) for (10004) h. Placed at room temperature for 2 hours, tested within 48 hours. |
| High Temperature Storage | No visible mechanical damage. Inductance change: Within 10%. | Stored at (852) for (10004) hours with Irms applied. Placed at room temperature for 2 hours, tested within 48 hours. |
Soldering Condition (Recommendation)
| Profile Feature | Parameter | Value | Unit |
|---|---|---|---|
| Preheat | Temperature Min (Tsmin) | 150 | |
| Temperature Max (Tsmax) | 200 | ||
| Time (Tsmin to Tsmax) (ts) | 60 -120 | seconds | |
| Average ramp-up rate (Ts max to Tp) | Max | 3 | / second |
| Time maintained above | Temperature (TL) | 217 | |
| Time (tL) | 60 -150 | seconds | |
| Peak Temperature (Tp) | Temperature | 260 | |
| Time within 5 of actual peak Temperature (tp) | 2 | 10 seconds | |
| Ramp-down Rate | Max | 6 | /second |
| Time 25 to Peak Temperature | Max | 8 | minutes |
| Allowed Re-flow times: 2 times. Remark: To avoid discoloration, use N2 Re-flow furnace. | |||
Packing Dimensions
| Type | A 0.5 | B 0.5 | C 0.5 | D 1 | Packing Quantity |
|---|---|---|---|---|---|
| Reel | 178 | 60 | 12 | 1.5 | 3000pcs/Reel |
Plastic Taping Dimensions (Unit: mm)
| Series | W 0.30 | A0 0.05 | B0 +0.1/-0 | D +0.1/-0 | D1 Min | E 0.10 | F 0.10 | K0 0.05 | P0 0.10 | P2 0.10 | P 0.10 | T 0.05 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1608065 | 8.00 | 1.10 | 1.95 | 1.50 | 0.6 | 1.75 | 3.50 | 0.80 | 4.00 | 2.00 | 4.00 | 0.23 |
| 160808 | 8.00 | 1.10 | 1.95 | 1.50 | 0.6 | 1.75 | 3.50 | 1.00 | 4.00 | 2.00 | 4.00 | 0.23 |
2410121758_MetalLions-MTQH160808S4R7MBT_C17701284.pdf
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