Product Overview
The Microsemi MPC8010-MPC8300 series of surface mount capacitors utilizes advanced monolithic MMSM technology, integrating the package and device at the wafer fabrication level. This approach, employing precision photolithographic techniques instead of wire bonds, tightly controls parasitic package inductance, ensuring smooth, non-resonant functionality through X-Band. These capacitors are designed with high-quality dielectric materials to achieve exceptional Quality Factor (Q) and low loss, with typical insertion loss less than 0.2 dB over the working frequency range. They are RoHS compliant and suitable for RF circuits as DC blocks, for capacitive coupling, RF bypass, and for fixed capacitive tuning of oscillators, multipliers, or filter elements.
Product Attributes
- Brand: Microsemi
- Technology: MMSM
- Certifications: RoHS Compliant (per EU Directive 2002/95/EC)
- Terminations: Gold
- Sensitivity: ESD sensitive
Technical Specifications
| Model Number | VB (V) (Min) | CT(pF) (at 1 MHz) | Tolerance (+/-%) | LP (nH) Typical | CP (pF) Typical |
|---|---|---|---|---|---|
| MPC8010 | 100 | 1.0 | 15 | 0.02 | 0.04 |
| MPC8020 | 100 | 2.0 | 10 | 0.02 | 0.04 |
| MPC8050 | 100 | 5.0 | 10 | 0.02 | 0.04 |
| MPC8100 | 100 | 10.0 | 10 | 0.02 | 0.04 |
| MPC8200 | 100 | 20.0 | 10 | 0.02 | 0.04 |
| MPC8300 | 100 | 30.0 | 10 | 0.02 | 0.04 |
| Rating | Symbol | Value | Unit |
|---|---|---|---|
| Maximum Leakage Current @80% of minimum Rated V B | IR | 10 | nA |
| Operating Temperature | TOP | -55 to +125 | C |
| Storage Temperature | TSTG | -55 to +125 | C |
2411271955_MICROCHIP-MPC8020-206-TR_C1513053.pdf
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