Product Overview
The Microsemi MPC8010-MPC8300 series of surface mount capacitors utilize advanced monolithic MMSM technology, integrating the package and device at the wafer fabrication level. This approach, employing precision photolithographic techniques instead of wire bonds, tightly controls parasitic package inductance, enabling smooth, non-resonant functionality through X-Band. These capacitors are manufactured with high-quality dielectric materials, ensuring exceptional Quality Factor (Q) and minimal loss, with typical insertion loss less than 0.2 dB across the working frequency range. They are designed for RF circuits, serving as DC blocks, capacitive coupling elements, and RF bypass components, as well as for fixed capacitive tuning of oscillators, multipliers, and filter elements. These devices meet RoHS requirements per EU Directive 2002/95/EC and are supplied with gold terminations.
Product Attributes
- Brand: Microsemi
- Technology: MMSM
- Footprint: Small, SOD 323
- Terminations: Gold
- Certifications: RoHS Compliant (EU Directive 2002/95/EC)
- ESD Sensitivity: Yes
Technical Specifications
| Model Number | VB (V) (Min) | CT(pF) (at 1 MHz) | Tolerance (+/-%) | LP (nH) (Typical) | CP (pF) (Typical) |
|---|---|---|---|---|---|
| MPC8010 | 100 | 1.0 | 15 | 0.02 | 0.04 |
| MPC8020 | 100 | 2.0 | 10 | 0.02 | 0.04 |
| MPC8050 | 100 | 5.0 | 10 | 0.02 | 0.04 |
| MPC8100 | 100 | 10.0 | 10 | 0.02 | 0.04 |
| MPC8200 | 100 | 20.0 | 10 | 0.02 | 0.04 |
| MPC8300 | 100 | 30.0 | 10 | 0.02 | 0.04 |
| Rating | Symbol | Value | Unit |
|---|---|---|---|
| Maximum Leakage Current @80% of minimum Rated V B | IR | 10 | nA |
| Operating Temperature | TOP | -55 to +125 | C |
| Storage Temperature | TSTG | -55 to +125 | C |
2411272108_MICROCHIP-MPC8100-206-TR_C3776259.pdf
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