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Specifications
Current - Saturation (Isat):
6.3A
Mfr. Part #:
MTQH404030S6R8MBT
Package:
SMD,4x4mm
Key Attributes
Model Number:
MTQH404030S6R8MBT
Product Description
Product Overview
The MTQH4040 Series Mini Molded Chip Power Inductors are designed for high-current, low-loss applications. Featuring a metal material construction, vinyl thermal spray for improved surface compactness, and a closed magnetic circuit design to minimize leakage flux, these inductors are RoHS compliant. They are ideal for use in smart phones, pads, notebooks, VR/AR devices, portable gaming devices, smart wearables, and Wi-Fi modules.
Product Attributes
- Brand: Metal Lions (implied by website URL)
- Series Name: MTQH4040 Series
- Type: Mini Molding Chip type power inductor
- Material: Metal
- Coating: Vinyl thermal spray
- Compliance: RoHS compliant
- Operating Temperature Range: -55125 (Including self temp. rise)
- Coating Color: Black (for specific models)
Technical Specifications
| Series | Part Number | Dimensions (L*W*T) [mm] | Inductance (L0) [H] @ 1MHz, 0A | Rdc (m) Typical | Rdc (m) Max | Heat Rating Current (Irms) [A] Typical | Heat Rating Current (Irms) [A] Max | Saturation Current (Isat) [A] Typical | Saturation Current (Isat) [A] Max |
|---|---|---|---|---|---|---|---|---|---|
| MTQH404010S | 4.0*4.0*1.0 | MTQH404010S100MBT | 10 | 220 | 280 | 2.5 | 2.0 | 2.2 | 2.0 |
| MTQH404012S | 4.0*4.0*1.2 | MTQH404012S1R0MBT | 1.0 | 21 | 25 | 6.3 | 5.5 | 11 | 10 |
| MTQH404012S | 4.0*4.0*1.2 | MTQH404012S1R5MBT | 1.5 | 29 | 34.5 | 6.0 | 5.0 | 8.0 | 7.0 |
| MTQH404020S | 4.0*4.0*2.0 | MTQH404020S2R2MBT | 2.2 | 30 | 36 | 6.5 | 6.0 | 9.5 | 8.5 |
| MTQH404020S | 4.0*4.0*2.0 | MTQH404020S4R7MBT | 4.7 | 47 | 58 | 5.0 | 4.0 | 6.3 | 5.5 |
| MTQH404020S | 4.0*4.0*2.0 | MTQH404020S100MBT | 10 | 113 | 135 | 3.7 | 3.0 | 4.9 | 4.0 |
| MTQH404020S | 4.0*4.0*2.0 | MTQH404020S150MBT | 15 | 210 | 250 | 2.3 | 1.7 | 3.5 | 3.0 |
| MTQH404020S | 4.0*4.0*2.0 | MTQH404020S220MBT | 22 | 275 | 330 | 1.8 | 1.3 | 2.9 | 2.3 |
| MTQH404030S | 4.0*4.0*3.0 | MTQH404030SR68MBT | 0.68 | 8.3 | 10 | 9.5 | 8.0 | 17 | 15 |
| MTQH404030S | 4.0*4.0*3.0 | MTQH404030S1R5MBT | 1.5 | 15 | 18 | 6.5 | 6.0 | 12.5 | 11 |
| MTQH404030S | 4.0*4.0*3.0 | MTQH404030S4R7MBT | 4.7 | 41 | 46 | 4.3 | 4.0 | 7.0 | 6.0 |
| MTQH404030S | 4.0*4.0*3.0 | MTQH404030S6R8MBT | 6.8 | 51 | 62 | 4.2 | 3.8 | 6.3 | 5.1 |
Land Pattern Dimensions [mm]
| Series | L | G | W | T |
|---|---|---|---|---|
| MTQH404010S | 4.10.2 | 1.20.2 | 4.10.2 | 1.00Max. |
| MTQH404012S | 4.10.2 | 1.20.2 | 4.10.2 | 2.00Max. |
| MTQH404020S | 4.10.2 | 1.20.2 | 4.10.2 | 3.00Max. |
| MTQH404030S | 4.10.2 | 1.20.2 | 4.10.2 | 3.90 |
Explanation of Part Number
MTQH 4040 10 S 2R2 M B T
- MTQH: Series Name (Mini Molding Chip type power inductor)
- 4040: Size Code (L*W)
- 10, 12, 20, 30: Thickness (T)
- S: Material Code (D Type)
- 2R2 (e.g.): Initial inductance value (2.2uH)
- M: Tolerance of Inductance (20%)
- B: Coating color (Black)
- T: Packing (Tape Carrier Package)
Test Remarks
- All test data is referenced to 25 ambient.
- Test Condition: 1MHz, 1.0Vrms.
- Irms: DC current (A) that will cause an approximate T of 40 .
- Isat: DC current (A) that will cause L0 to drop approximately 30%.
- Operating Temperature Range: -55 to +125.
- The part temperature (ambient + temp rise) should not exceed 125 under the worst case operating conditions.
- The rated current as listed is either the saturation current or the heating current depending on which value is lower.
Reliability Item Requirements
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Insulation Resistance | 100M | 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds. |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec. |
| Adhesion of teral electrode | Strong bond between the pad and the core, without come off PCB. | Inductors shall be subjected to (2605)for (205)s Soldering in the base whit 0.3mm solder. And then aplombelectrode way plus tax 10 N for (101) seconds. |
| High temperature | No case deformation or change in appearance. Inductance change: Within 10%. | Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Low temperature | No visible mechanical damage. Inductance change: Within 10%. | Temperature: -402. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10%. | The test sample shall be placed at (-553) and (1253) for (303) min, different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing. |
| Temperature characteristic | Inductance change Pc-b,Pc-d: Within 20% | a+20 b: -40 c: +20 d: +125 e: +20 . 100% Pc-b = (Lb-Lc)/Lc * 100%; Pc-d = (Ld-Lc)/Lc * 100%. |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10%. | Inductors shall be subjected to (953)%RH at (602) for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing. |
| High temp. load life | No visible mechanical damage. Inductance change: Within 10%. | Inductors shall be store at (852) for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing. |
Recommended Reflow Soldering Profile
Solder: Sn96.5 / Ag3 / Cu0.5 (Lead-Free)
| Profile Feature | Temperature | Time |
|---|---|---|
| Preheat (Tsmin to Tsmax) | 150 to 200 | 60 -120 seconds |
| Average ramp-up rate (Ts max to Tp) | 3/ second max. | - |
| Time maintained above TL | 217 | 60-150 seconds |
| Peak Temperature (Tp) | 260 | Time within 5 of actual peak Temperature (tp): 10 seconds |
| Ramp-down Rate | 6/second max. | - |
| Time 25 to Peak Temperature | - | 8 minutes max. |
Allowed Re-flow times: 2 times
Remark: To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace.
Packing Dimension of Plastic Taping [mm]
| Type | A 0.5 | B 0.5 | C 0.5 | D 1 | All |
|---|---|---|---|---|---|
| Reel | 178 | 60 | 12 | 1.5 | - |
Packing Quantity:
3000pcs/Reel
Taping Dimensions [mm]
| Series | W 0.30 | A0 0.05 | B0 +0.1/-0 | D +0.1/-0 | D1 Min | E 0.10 | F 0.10 | K0 0.05 | P0 0.10 | P2 0.10 | P 0.10 | T 0.05 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 404012 | 12.0 | 4.40 | 4.40 | 1.50 | 1.0 | 1.75 | 5.50 | 1.40 | 4.00 | 2.00 | 8.00 | 0.35 |
| 404020 | 12.0 | 4.50.1 | 4.50.1 | 1.5 | 1.5 | 1.75 | 5.5 | 2.40.1 | 4.00 | 2.00 | 8.00 | 0.30 |
| 404030 | 12.0 | 4.40 | 4.40 | 1.50 | 1.0 | 1.75 | 5.50 | 3.40 | 4.00 | 2.00 | 8.00 | 0.35 |
2309080936_MetalLions-MTQH404030S6R8MBT_C17701307.pdf
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