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Specifications
Current - Saturation (Isat):
4A
Mfr. Part #:
MMPC0503-100MT
Package:
SMD,5.7x5.2mm
Key Attributes
Model Number:
MMPC0503-100MT
Product Description
Product Overview
The MMPC0503 Series High Current Molded Power Inductors are designed with carbonyl powder for a compact form factor, enabling high current handling with low DCR and high efficiency. These inductors operate across a frequency range up to 5MHz and are suitable for PC power systems, including IMVP-6 DC/DC converters. They offer very low acoustic noise and very low leakage flux noise, ensuring reliable performance in demanding applications. The series is RoHS compliant and operates within a temperature range of -40 to +125, including self-temperature rise.
Product Attributes
- Core Material: Carbonyl Powder
- Wire Material: Polyester Wire or equivalent
- Clip Material: 100% Pb free solder (Ni+Sn---Plating)
- Paint Material: Epoxy resin
- Ink Material: Halogen-free ketone
- Certifications: RoHS compliant
- Packing: Tape Carrier Package
Technical Specifications
| Part Number | Inductance (uH) ± 20% | Irms (A) Typ | Isat (A) Typ | DCR (m) Max |
|---|---|---|---|---|
| MMPC0503-R10YT | 0.10±30% | 24.0 | 40.0 | 2.60 |
| MMPC0503-R15YT | 0.15±30% | 22.0 | 37.0 | 3.00 |
| MMPC0503-R22MT | 0.22 | 19.0 | 32.0 | 3.80 |
| MMPC0503-R33MT | 0.33 | 15.0 | 20.0 | 5.00 |
| MMPC0503-R47MT | 0.47 | 13.0 | 18.0 | 7.10 |
| MMPC0503-R56MT | 0.56 | 12.0 | 17.0 | 8.60 |
| MMPC0503-R68MT | 0.68 | 11.0 | 15.5 | 9.00 |
| MMPC0503-R82MT | 0.82 | 10.0 | 14.0 | 10.0 |
| MMPC0503-1R0MT | 1.00 | 9.00 | 13.0 | 12.7 |
| MMPC0503-1R5MT | 1.50 | 8.00 | 11.5 | 16.6 |
| MMPC0503-2R2MT | 2.20 | 7.00 | 11.0 | 29.2 |
| MMPC0503-3R3MT | 3.30 | 6.00 | 9.00 | 38.0 |
| MMPC0503-4R7MT | 4.70 | 5.50 | 8.00 | 53.0 |
| MMPC0503-5R6MT | 5.60 | 4.70 | 7.30 | 62.0 |
| MMPC0503-6R8MT | 6.80 | 4.20 | 6.00 | 76.2 |
| MMPC0503-8R2MT | 8.20 | 3.80 | 5.00 | 97.0 |
| MMPC0503-100MT | 10.0 | 3.50 | 4.00 | 120 |
| MMPC0503-150MT | 15.0 | 2.70 | 3.20 | 190 |
| MMPC0503-220MT | 22.0 | 2.20 | 2.70 | 250 |
| Dimensions (mm) | L | G | H | A | B | C | D | E |
|---|---|---|---|---|---|---|---|---|
| Value | 6.2 | 2.2 | 2.8 | 5.7±0.3 | 5.2±0.2 | 2.8±0.2 | 1.1±0.3 | 2.5±0.3 |
| Operating Temperature Range | Test Condition |
|---|---|
| -40125 (Including self temp. rise) |
| Item | Performance | Test Condition |
|---|---|---|
| Operating temperature | -40~+125(Including self - temperature rise) | |
| Storage temperature | 1. -10~+40,50~60%RH (Product without taping) 2. -40~+125(on board) | |
| Electrical Performance Test Inductance | Refer to standard electrical characteristics list. | |
| DCR | ||
| Saturation Current (Isat) | Approximately L30% | Saturation DC Current (Isat) will cause L0 to drop L(%) |
| Heat Rated Current (Irms) | Approximately T40 | Heat Rated Current (Irms) will cause the coil temperature rise T(). |
| 1. Applied the allowed DC current 2. Temperature measured by digital surface thermometer | ||
| Life Test | AppearanceNo damage. Inductancewithin±10% of initial value QShall not exceed the specification value. RDCwithin ±15% of initial value and shall not exceed the specification value | Preconditioning: Run through IR reflow for 3times. ( IPC/JEDECJ-STD-020E Classification Reflow Profiles) Temperature125±2(Inductor, ambient + temp rise) Applied currentrated current Duration1000±12hrs Measured at room temperature after placing for 24±2 hrs. |
| Load Humidity | Preconditioning: Run through IR reflow for 3times. ( IPC/JEDECJ-STD-020E Classification Reflow Profiles) Humidity85±2R.H, Temperature85±2 Duration1000hrs Min. Bead:with 100% rated current, Inductancewith 100% rated current Measured at room temperature after placing for 24±2 hrs. | |
| Moisture Resistance | Preconditioning: Run through IR reflow for 3 times. ( IPC/JEDECJ-STD-020E Classification Reflow Profiles) 1. Baked at50for 25hrs, measured at room temperature after placing for 4 hrs. 2. Raise temperature to 65± 2 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25in 2.5hrs. 3. Raise temperature to 65± 2 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25in 2.5hrs,keep at 25for 2 hrs then keep at -10for 3 hrs 4. Keep at 25 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. | |
| Thermal shock | Preconditioning: Run through IR reflow for 3 times. ( IPC/JEDECJ-STD-020E Classification Reflow Profiles) Condition for 1 cycle Step1-40±230±5min Step2125±2<=0.5min Step3125±230±5minNumber of cycles500 Measured at room fempraturc after placing for 24±2 hrs. | |
| Vibration | Preconditioning: Run through IR reflow for 3 times. ( IPC/JEDECJ-STD-020E Classification Reflow Profiles) Oscillation Frequency: 10Hz2KHz10Hz for 20 minutes EquipmentVibration checker Total Amplitude: 10g Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations) | |
| Bending | AppearanceNo damage. Inductancewithin±10% of initial value QShall not exceed the specification value. RDCwithin ±15% of initial value and shall not exceed the specification value | Shall be mounted on a FR4 substrate of the following dimensions: >=0805 inch(2012mm):40x100x1.2mm <0805 inch(2012mm):40x100x0.8mm Bending depth: >=0805 inch(2012mm):1.2mm <0805 inch(2012mm):0.8mm duration of 10 sec. |
| Shock | 3 shocks in each direction along 3 perpendicular axes(18 shocks). Type Peak value (g’s) Normal duration (D) (ms) Wave form Velocity change (Vi)ft/sec SMD 50 11 Half-sine 11.3 Lead 50 11 Half-sine 11.3 | |
| Soldering | (1) Solder re-flow: Recommended temperature profiles for re-flow soldering in Figure 1. (2) Soldering Iron: Mildly activated rosin fluxes are preferred. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended precautions: Preheat circuit and products to 150, Never contact the ceramic with the iron tip, Use a 20 watt soldering iron with tip diameter of 1.0mm, 355 tip temperature (max), 1.0mm tip diameter (max), Limit soldering time to 4~5sec. | |
| Solderability | More than 95% of the terminal electrode should be covered with solder | a. Method B1, 4 hrs @155C dry heat @255C±5C Test time:5 +0/-0.5 seconds. b. Method D category 3. (steam aging 8hours ± 15 min)@ 260C±5C Test time: 30 +0/-0.5 seconds. |
| Resistance to Soldering Heat | AppearanceNo damage. Inductancewithin±10% of initial value QShall not exceed the specification value. RDCwithin ±15% of initial value and shall not exceed the specification value | e Depth: completely cover the termination Temperature(C) Time(s) Temperature ramp/immersion and emersion rate Number of heat cycles 260 ±5 (solder temp) 10 ±1 25mm/s ±6 mm/s |
| Terminal Strength | Preconditioning: Run through IR reflow for 3 times.( IPC/JEDEC J-STD-020E Classification Reflow Profiles With the component mounted on a PCB with the device to be tested,applyaforce(>0805inch(2012mm):1kg,<=0805inch(2012 mm):0.5kg)to the side of a device being tested. This force shall be applied for 60 +1 seconds. Also the force shall be applied gradually as not to apply a shock to the component being tested. |
| Packaging Information | Reel Dimension (13x12mm) | Tape Dimension (mm) | Packaging Quantity | Tearing Off Force (10 to 130 grams) |
|---|---|---|---|---|
| 12.4+2/-0 | A(mm): 6.2±0.1, B(mm): 5.5±0.1, C(mm): 3.3±0.1, D(mm): 8.0±0.1, W(mm): 12.0±0.3, F(mm): 5.5±0.1, T(mm): 0.35±0.05, P(mm): 1.5±0.1 | 2000 pcs / Reel | Room Temp. (5~35), Room Humidity (%) 45~85, Room atm (hPa) 860~1060, Tearing Speed mm/min 300 |
| Application Notice | Storage Conditions (component level) | Transportation |
|---|---|---|
| To maintain the solderability of terminal electrodes: | 1. Metal-lions products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40 and 60% RH. 3. Recommended products should be used within 12 months form the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. | 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. |
2504251720_MetalLions-MMPC0503-100MT_C48579915.pdf
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