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Quality molded power inductors MetalLions MMPC0503H-100MT featuring lead free solder clip and halogen free ink factory
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Quality molded power inductors MetalLions MMPC0503H-100MT featuring lead free solder clip and halogen free ink factory
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Specifications
Current - Saturation (Isat):
3.5A
Mfr. Part #:
MMPC0503H-100MT
Package:
SMD,5.7x5.2mm
Key Attributes
Model Number: MMPC0503H-100MT
Product Description

Product Overview

The MMPC0503H Series High Current Molded Power Inductors are designed for high-current applications, offering a compact form factor with excellent efficiency. Utilizing carbonyl powder and a polyester wire, these inductors provide high current capability and low DCR. They are suitable for DC/DC converters and PC power systems, including IMVP-6, and operate effectively in a frequency range up to 5MHz. Key features include very low acoustic noise and minimal leakage flux noise, making them ideal for demanding electronic designs.

Product Attributes

  • Brand: Metal-Lions (implied by website mentions)
  • Core Material: Carbonyl Powder
  • Wire Material: Polyester Wire or equivalent
  • Clip Material: 100% Pb free solder (Ni+Sn---Plating)
  • Paint Material: Epoxy resin
  • Ink Material: Halogen-free ketone
  • Certifications: RoHS compliant
  • Operating Temperature Range: -40125 (Including self temp. rise)
  • Storage Temperature: -1040, 50~60%RH (Product without taping); -40125 (on board)

Technical Specifications

Part Number Inductance (uH) Tolerance Irms (A) Typ Isat (A) Typ DCR (m) Max
MMPC0503H-R10YT 0.10 30% 23.0 27.0 3.00
MMPC0503H-R15YT 0.15 30% 18.0 30.0 2.70
MMPC0503H-R22MT 0.22 20% 15.5 21.0 4.40
MMPC0503H-R33MT 0.33 20% 14.0 18.0 5.00
MMPC0503H-R47MT 0.47 20% 12.0 16.0 7.40
MMPC0503H-R56MT 0.56 20% 10.0 15.0 10.0
MMPC0503H-R68MT 0.68 20% 8.50 14.0 12.0
MMPC0503H-R82MT 0.82 20% 8.00 12.5 13.0
MMPC0503H-1R0MT 1.00 20% 7.00 11.0 14.0
MMPC0503H-1R5MT 1.50 20% 6.00 10.0 25.0
MMPC0503H-2R2MT 2.20 20% 5.50 9.00 35.0
MMPC0503H-3R3MT 3.30 20% 5.00 8.00 38.0
MMPC0503H-4R7MT 4.70 20% 4.60 6.00 53.0
MMPC0503H-5R6MT 5.60 20% 4.25 4.50 63.0
MMPC0503H-6R8MT 6.80 20% 4.00 4.30 76.2
MMPC0503H-100MT 10.0 20% 2.75 3.50 128
MMPC0503H-150MT 15.0 20% 2.10 2.60 190
MMPC0503H-220MT 22.0 20% 1.90 1.70 250
MMPC0503H-330MT 33.0 20% 1.60 1.60 440
Dimensions (mm) L G H A B C D E
Value 6.2 2.2 2.8 5.70.3 5.20.2 2.80.2 1.10.3 1.50.3
Reliability Test Item Performance Test Condition
Life Test Temperature: 1252 (Inductor, ambient + temp rise); Applied current: rated current; Duration: 100012hrs; Measured at room temperature after placing for 242 hrs.
Load Humidity Humidity: 852% RH, Temperature: 852; Duration: 1000hrs; Measured at room temperature after placing for 242 hrs.
Moisture Resistance Multiple steps involving baking, humidity exposure, and temperature cycling. Detailed conditions in source document.
Thermal shock Condition for 1 cycle: Step1: -402 305min; Step2: 1252 0.5min; Step3: 1252 305min. Number of cycles: 500. Measured at room temperature after placing for 242 hrs.
Vibration Oscillation Frequency: 10Hz2KHz10Hz for 20 minutes; Total Amplitude: 10g; Testing Time: 12 hours (20 minutes, 12 cycles each of 3 orientations).
Bending Component mounted on FR4 substrate. Bending depth: >=0805 inch(2012mm): 1.2mm, <0805 inch(2012mm): 0.8mm. Duration of 10 sec.
Shock 3 shocks in each direction along 3 perpendicular axes (18 shocks). Type: SMD, Peak value: 50g's, Normal duration (D): 11ms, Wave form: Half-sine, Velocity change (Vi): 11.3 ft/sec.
Resistance to Soldering Heat Test time: 5 +0/-0.5 seconds @ 255C5C (Method B1, 4 hrs @155C dry heat) OR Test time: 30 +0/-0.5 seconds @ 260C5C (Method D category 3, steam aging 8hours 15 min).
Terminal Strength With component mounted on PCB, apply a force (>0805inch(2012mm): 1kg, <=0805inch(2012 mm): 0.5kg) to the side of the device for 60 +1 seconds. Force applied gradually.
Packaging Information Dimension Quantity per Reel
Reel Dimension 13x12mm 2000
Tape Dimension (mm) A: 6.20.1, B: 5.50.1, C: 3.30.1, D: 8.00.1, W: 12.00.3, F: 5.50.1, T: 0.350.05, K0: 1.50.1 -
Tearing Off Force (Top cover tape) 165 to 180 -
Application Notice Condition
Storage Conditions (component level) MSL Level 1 (IPC/JEDEC J-STD-020D); Temperature: Less than 40; Humidity: Less than 60% RH; Recommended use within 12 months from delivery; Packaging material free from chlorine or sulfur.

2507081835_MetalLions-MMPC0503H-100MT_C49308499.pdf

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