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Specifications
Current - Saturation (Isat):
15A
Mfr. Part #:
MTQH303020BR50MBT
Package:
1212
Key Attributes
Model Number:
MTQH303020BR50MBT
Product Description
Product Overview
The MTQH3030 Series Mini Molded Chip Power Inductors are designed for high current and low loss applications. Featuring a closed magnetic circuit design that minimizes leakage flux and a vinyl thermal spray for enhanced surface compactness, these RoHS-compliant inductors are suitable for demanding applications. They operate within a temperature range of -55 to +125 (including self-temperature rise).
Key applications include smartphones, tablets, notebooks, VR/AR devices, portable gaming devices, smart wearables, and Wi-Fi modules.
Product Attributes
- Series Name: MTQH3030 Series Mini Molding Chip type power inductor
- Material Code: B Type
- Coating Color: Black (B)
- Certifications: RoHS compliant
- Operating Temperature Range: -55125 (Including self temp. rise)
Technical Specifications
| Series | L (mm) | W (mm) | T (mm) | Part Number (P/N) | Inductance (L0) (H) @ 1MHz (0A) | Rdc (m) Typical | Rdc (m) Max | Heat Rating Current (Irms) (A) Typical | Heat Rating Current (Irms) (A) Max | Saturation Current (Isat) (A) Typical | Saturation Current (Isat) (A) Max |
|---|---|---|---|---|---|---|---|---|---|---|---|
| MTQH303012B | 3.0 0.1 | 1.0 0.2 | 3.0 0.1 | MTQH303012B100MBT | 10.0 | 192 | 220 | 2.3 | 2.0 | 2.3 | 2.0 |
| MTQH303015B | 3.0 0.1 | 1.0 0.2 | 3.0 0.1 | MTQH303015B220MBT | 22.0 | 580 | 700 | 1.2 | 1.0 | 1.6 | 1.2 |
| MTQH303018B | 3.0 0.1 | 1.0 0.2 | 3.0 0.1 | MTQH303018BR22MBT | 0.22 | 5.5 | 7.0 | 10.0 | 9.0 | 17 | 16 |
| MTQH303018B | 3.0 0.1 | 1.0 0.2 | 3.0 0.1 | MTQH303018B1R5MBT | 1.5 | 20 | 26 | 6.8 | 6.4 | 8.0 | 7.0 |
| MTQH303018B | 3.0 0.1 | 1.0 0.2 | 3.0 0.1 | MTQH303018B4R7MBT | 4.7 | 72 | 87 | 3.4 | 3.0 | 4.7 | 4.2 |
| MTQH303020B | 3.0 0.1 | 1.0 0.2 | 3.0 0.1 | MTQH303020BR33MBT | 0.33 | 7.5 | 9 | 10.0 | 9.0 | 17 | 15 |
| MTQH303020B | 3.0 0.1 | 1.0 0.2 | 3.0 0.1 | MTQH303020BR50MBT | 0.5 | 9.0 | 12 | 9.0 | 8.0 | 15 | 13 |
| MTQH303020B | 3.0 0.1 | 1.0 0.2 | 3.0 0.1 | MTQH303020BR68MBT | 0.68 | 13 | 16 | 8.5 | 7.8 | 13 | 11 |
| MTQH303020B | 3.0 0.1 | 1.0 0.2 | 3.0 0.1 | MTQH303020B1R0MBT | 1.0 | 14 | 20 | 6.5 | 6.0 | 8.0 | 7.3 |
| MTQH303020B | 3.0 0.1 | 1.0 0.2 | 3.0 0.1 | MTQH303020B1R5MBT | 1.5 | 19 | 25 | 6.3 | 5.8 | 7.0 | 6.5 |
| MTQH303020B | 3.0 0.1 | 1.0 0.2 | 3.0 0.1 | MTQH303020B2R2MBT | 2.2 | 37 | 45 | 4.7 | 4.3 | 6.0 | 5.5 |
| MTQH303020B | 3.0 0.1 | 1.0 0.2 | 3.0 0.1 | MTQH303020B3R3MBT | 3.3 | 52 | 63 | 4.5 | 4.0 | 5.9 | 5.4 |
| MTQH303020B | 3.0 0.1 | 1.0 0.2 | 3.0 0.1 | MTQH303020B4R7MBT | 4.7 | 60 | 73 | 4.2 | 3.8 | 4.8 | 4.0 |
| MTQH303020B | 3.0 0.1 | 1.0 0.2 | 3.0 0.1 | MTQH303020B6R8MBT | 6.8 | 107 | 135 | 3.2 | 3.0 | 4.5 | 3.8 |
| MTQH303020B | 3.0 0.1 | 1.0 0.2 | 3.0 0.1 | MTQH303020B100MBT | 10.0 | 135 | 160 | 2.5 | 2.2 | 3.8 | 3.3 |
Test Conditions & Remarks
- All test data is referenced to 25 ambient.
- Test Condition: 1MHz, 1.0Vrms.
- Irms: DC current (A) that will cause an approximate T of 40 .
- Isat: DC current (A) that will cause L0 to drop approximately 30%.
- Operating Temperature Range: -55 to +125.
- The part temperature (ambient + temp rise) should not exceed 125 under the worst-case operating conditions. Part temperature should be verified in the end application.
- The rated current as listed is either the saturation current or the heating current depending on which value is lower.
Reliability Test
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Insulation Resistance | 100M | 100 VDC between inductor coil and the middle of the top surface of the body for 60 seconds. |
| Solderability | 90% or more of electrode area shall be coated by new solder. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2455. Immersion Time: (51) s. |
| Resistance to Soldering Heat | No visible mechanical damage. Inductance change: Within 10%. | Dip pads in flux. Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free). Solder Temperature: 2605. Immersion Time: 101sec. |
| Adhesion of teral electrode | Strong bond between the pad and the core, without come off PCB. | Inductors shall be subjected to (2605)for (205)s Soldering in the base whit 0.3mm solder. And then aplombelectrode way plus tax 10 N for (101) seconds. |
| High temperature | No case deformation or change in appearance. Inductance change: Within 10% | Temperature: 1252. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Low temperature | No visible mechanical damage. Inductance change: Within 10% | Temperature: -402. Time : 1000 hours. Measurement at 244 hours after test conclusion. |
| Thermal shock | No visible mechanical damage. Inductance change: Within 10% | The test sample shall be placed at (-553)and (1253)for (303) min, different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 484 hours of testing. |
| Temperature characteristic | Inductance change Pc-b,Pc-d: Within 20% | a+20 30~45 b: -40 30~45 c: +20 30~45 d: +125 30~45 e: +20 30~45 100% c-b c c P Lb L L c-d 100% c c P Ld L L |
| Static Humidity | No visible mechanical damage. Inductance change: Within 10% | Inductors shall be subjected to (953)%RH . at(602)for (10004) h. Placed at room temperature for 2 hours, within 48 hours of testing. |
| Operating Humidity | No visible mechanical damage. Inductance change: Within 10% | Inductors shall be store at (852)for (10004) hours with Irms applied. Placed at room temperature for 2 hours, within 48 hours of testing. |
Soldering Condition (Recommendation)
Recommended Reflow Soldering Profile (solder: Sn96.5 / Ag3 / Cu0.5)
| Profile Feature | Lead (Pb)-Free solder |
|---|---|
| Preheat: Temperature Min (Tsmin) | 150 |
| Preheat: Temperature Max (Tsmax) | 200 |
| Preheat: Time (Tsmin to Tsmax) (ts) | 60 -120 seconds |
| Average ramp-up rate: (Ts max to Tp) | 3/ second max. |
| Time maintained above: Temperature (TL) | 217 |
| Time maintained above: Time (tL) | 60-150 seconds |
| Peak Temperature (Tp) | 260 |
| Time within +/5 of actual peak Temperature (tp) | 2 - 10 seconds |
| Ramp-down Rate | 6/second max. |
| Time 25 to Peak Temperature | 8 minutes max. |
| Allowed Re-flow times | 2 times |
| Remark | To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace. |
Packing Dimension of Plastic Taping (Unit: mm)
| Type | A 0.5 | B 0.5 | C 0.5 | D 1 |
|---|---|---|---|---|
| All | 178 | 60 | 12 | 1.5 |
Dimension of Reel (Unit: mm)
| Series | W 0.30 | A0 0.05 | B0 +0.1/-0 | D 0.1/-0 | D1 Min | E 0.10 | F 0.10 | K0 0.05 | P0 0.10 | P2 0.10 | P 0.10 | T 0.05 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 303012 | 8.00 | 3.35 | 3.45 | 1.50 | 1.0 | 1.75 | 3.50 | 1.35 | 4.00 | 2.00 | 4.00 | 0.23 |
| 303015 | 12.0 | 3.40 | 3.45 | 1.50 | 1.0 | 1.75 | 5.50 | 1.70 | 4.00 | 2.00 | 8.00 | 0.35 |
| 303018 | 12.0 | 3.40 | 3.45 | 1.50 | 1.0 | 1.75 | 5.50 | 2.00 | 4.00 | 2.00 | 8.00 | 0.35 |
| 303020 | 12.0 | 3.40 | 3.40 | 1.50 | 1.0 | 1.75 | 5.50 | 2.20 | 4.00 | 2.00 | 8.00 | 0.35 |
Packing Quantity: 3000pcs/Reel
2410121928_MetalLions-MTQH303020BR50MBT_C17701229.pdf
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