Wire Wound Chip Common Mode Filters
These wire wound chip common mode filters are designed for high-frequency noise prevention, offering a small size and low profile due to their winding type. They provide excellent solderability and are suitable for demanding operating temperatures from -40 to +125. Ideal for applications such as USB2.0 in PCs and peripheral equipment, small digital AV devices, and LVDS and audio lines in notebook PCs and LCDs.
Product Attributes
- Brand: Not specified
- Origin: Not specified
- Material: Not specified
- Color: Not specified
- Certifications: Hazardous Substance Free Products (F)
Technical Specifications
| Part Number | Common-Mode Impedance Z() at 100MHz | Rated Voltage Vdc(V) | DC Resistance Rdc() Max. | Rated Current Idc(mA) Max. | Insulation Resistance (M)Min. |
| ACM2012-2P-300TF | 30 25% | 450 | 0.20 | 50 | 10 |
| ACM2012-2P-670TF | 67 25% | 400 | 0.25 | 50 | 10 |
| ACM2012-2P-900TF | 90 25% | 400 | 0.30 | 50 | 10 |
| ACM2012-2P-121TF | 12025% | 370 | 0.30 | 50 | 10 |
| ACM2012-2P-161TF | 16025% | 350 | 0.35 | 50 | 10 |
| ACM2012-2P-181TF | 18025% | 330 | 0.35 | 50 | 10 |
| ACM2012-2P-201TF | 20025% | 300 | 0.40 | 50 | 10 |
| ACM2012-2P-221TF | 22025% | 300 | 0.40 | 50 | 10 |
| ACM2012-2P-261TF | 26025% | 300 | 0.40 | 50 | 10 |
| ACM2012-2P-361TF | 36025% | 280 | 0.45 | 50 | 10 |
| ACM2012-2P-601TF | 60025% | 200 | 0.55 | 50 | 10 |
| ACM2012-2P-671TF | 67025% | 150 | 0.60 | 50 | 10 |
| ACM2012-2P-801TF | 80025% | 150 | 0.80 | 50 | 10 |
| ACM2012-2P-901TF | 90025% | 150 | 0.80 | 50 | 10 |
| ACM2012-2P-102TF | 100025% | 150 | 1.30 | 50 | 10 |
| ACM2012-2P-222TF | 220025% | 100 | 2.00 | 50 | 10 |
| Item | Test Conditions | Specifications |
| High temperature resistance | Temperature: +1252, Applied voltage: Rated voltage, Applied current: Rated current, Testing time: 50012 hours, Measurement: After placing for 24 hours min. | insulation resistance: >10(M), DC resistance: standard value inside. |
| Low temperature resistance | Temperature: -402, Testing time: 50012 hours, Measurement: After placing for 24 hours min. | Appearance: Ferrite shall not be damaged. |
| Thermal cycle | Temperature: -40,+125 kept stabilized for 30 minutes each. Cycle: 100 cycle, Measurement: After placing for 24 hours min. | Appearance: Ferrite shall not be damaged. |
| Vibration | Frequency: 10 to 50 Hz, Amplitude: 1.52 mm, Dimension and times: X ,Y and Z directions for 2 hours each. | Appearance: Ferrite shall not be damaged. |
| Strength on pc board bending ability | Test conditions: 100 length, Width side 45 45 40 20 10 Force | The terminal electrode and the ferrite must not be damaged. |
| Solderability | Dip pads in flux and dip in solder pot( 96.5 Sn/3.5 Ag solder) at 255C 5C. 5 seconds max. at 260. | The terminal electrode and the ferrite must not be damaged. |
2411212332_MetalLions-ACM2012-2P-900TF_C41364533.pdf
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