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Specifications
Current - Saturation (Isat):
8A
Mfr. Part #:
MMPC0503-4R7MT
Package:
SMD,5.7x5.2mm
Key Attributes
Model Number:
MMPC0503-4R7MT
Product Description
Product Overview
The MMPC0503 Series High Current Molded Power Inductors are designed for high-efficiency applications, featuring a compact construction with carbonyl powder cores. These inductors offer high current handling capabilities, low DCR, and operate efficiently up to 5MHz. They are particularly well-suited for PC power systems, including IMVP-6 DC/DC converters, and are characterized by very low acoustic and leakage flux noise. The series is RoHS compliant and operates within a temperature range of -40 to +125, including self-temperature rise.
Product Attributes
- Core Material: Carbonyl Powder
- Wire Material: Polyester Wire or equivalent
- Clip Material: 100% Pb free solder (Ni+Sn---Plating)
- Paint Material: Epoxy resin
- Ink Material: Halogen-free ketone
- Certifications: RoHS compliant
- Packing: Tape Carrier Package
Technical Specifications
| Part Number | Inductance (uH) 20% | I rmsA Typ | I satA Typ | DCRm Max |
|---|---|---|---|---|
| MMPC0503-R10YT | 0.1030% | 24.0 | 40.0 | 2.60 |
| MMPC0503-R15YT | 0.1530% | 22.0 | 37.0 | 3.00 |
| MMPC0503-R22MT | 0.22 | 19.0 | 32.0 | 3.80 |
| MMPC0503-R33MT | 0.33 | 15.0 | 20.0 | 5.00 |
| MMPC0503-R47MT | 0.47 | 13.0 | 18.0 | 7.10 |
| MMPC0503-R56MT | 0.56 | 12.0 | 17.0 | 8.60 |
| MMPC0503-R68MT | 0.68 | 11.0 | 15.5 | 9.00 |
| MMPC0503-R82MT | 0.82 | 10.0 | 14.0 | 10.0 |
| MMPC0503-1R0MT | 1.00 | 9.00 | 13.0 | 12.7 |
| MMPC0503-1R5MT | 1.50 | 8.00 | 11.5 | 16.6 |
| MMPC0503-2R2MT | 2.20 | 7.00 | 11.0 | 29.2 |
| MMPC0503-3R3MT | 3.30 | 6.00 | 9.00 | 38.0 |
| MMPC0503-4R7MT | 4.70 | 5.50 | 8.00 | 53.0 |
| MMPC0503-5R6MT | 5.60 | 4.70 | 7.30 | 62.0 |
| MMPC0503-6R8MT | 6.80 | 4.20 | 6.00 | 76.2 |
| MMPC0503-8R2MT | 8.20 | 3.80 | 5.00 | 97.0 |
| MMPC0503-100MT | 10.0 | 3.50 | 4.00 | 120 |
| MMPC0503-150MT | 15.0 | 2.70 | 3.20 | 190 |
| MMPC0503-220MT | 22.0 | 2.20 | 2.70 | 250 |
| Dimensions (mm) | L | G | H |
|---|---|---|---|
| 6.2 | 2.2 | 2.8 |
| Dimensions (mm) | A | B | C | D | E |
|---|---|---|---|---|---|
| 5.70.3 | 5.20.2 | 2.80.2 | 1.10.3 | 2.50.3 |
| Operating Temperature Range | -40125 (Including self temp. rise) |
|---|---|
| Test Frequency (L) | 100KHz /1.0V |
| Ambient Temperature for Testing | 25 |
| Heat Rated Current (Irms) Effect | Causes coil temperature rise approximately t of 40 (keep 1min.) |
| Saturation Current (Isat) Effect | Causes L0 to drop approximately 30% |
| Maximum Part Temperature | 125 (ambient + temp rise) |
| Rated DC Current | The lower value of Irms and Isat |
| Reliability Test Item | Performance Test Condition |
|---|---|
| Life Test | Temperature: 1252 (Inductor, ambient + temp rise), Applied current: rated current, Duration: 100012hrs. Measured at room temperature after placing for 242 hrs. |
| Load Humidity | Humidity: 852% RH, Temperature: 852, Duration: 1000hrs Min. Measured at room temperature after placing for 242 hrs. |
| Moisture Resistance | Complex multi-step process involving baking, humidity, and temperature cycling. Measured at room temperature after specified conditions. |
| Thermal shock | 500 cycles of temperature cycling between -402 and 1252. Measured at room temperature after placing for 242 hrs. |
| Vibration | Oscillation Frequency: 10Hz2KHz10Hz for 20 minutes, Total Amplitude: 10g, Testing Time: 12 hours (20 minutes, 12 cycles each of 3 orientations). |
| Bending | Component mounted on FR4 substrate, bending depth applied. Measured at room temperature. |
| Shock | 3 shocks in each direction along 3 perpendicular axes (18 shocks). Peak value: 50g's, Normal duration: 11ms, Wave form: Half-sine. |
| Terminal Strength | Force applied to the side of the device for 601 seconds. Force: (>0805inch: 1kg, <=0805inch: 0.5kg). |
| Soldering Method | Recommended Temperature Profile | Max Reflow Times | Max Iron Soldering Times |
|---|---|---|---|
| Solder re-flow | Refer to Figure 1 in source document. Preheat: 150, Soldering: 217, Peak: 260/10s max. | 3 times max. | N/A |
| Soldering Iron | Preheat: 150, Tip temperature: 355 (max), Tip diameter: 1.0mm (max), Soldering time: 4~5sec. | N/A | 1 time max. |
| Resistance to Soldering Heat Test | Condition | Test Time |
|---|---|---|
| Method B1 (dry heat) | 4 hrs @155C | 5 +0/-0.5 seconds |
| Method D (steam aging) | 8 hours 15 min @260C5C | 30 +0/-0.5 seconds |
| Packaging Information | Dimension | Quantity |
|---|---|---|
| Reel Dimension | 13x12mm (A: 12.4+2/-0, B: 1002, C: 13+0.5/-0, D: 330) | 2000 pcs/Reel |
| Tape Dimension (mm) | B0: 6.20.1, A0: 5.50.1, K0: 3.30.1, P: 8.00.1, W: 12.00.3, F: 5.50.1, T: 0.350.05, D: 1.50.1 | N/A |
| Tearing Off Force (Top cover tape) | 165 to 180, 10 to 130 grams | N/A |
| Application Notice | Details |
|---|---|
| Storage Conditions (component level) | Maintain solderability: MSL Level 1 (IPC/JEDEC J-STD-020D). Temperature & Humidity: < 40 and 60% RH. Recommended use within 12 months from delivery. Avoid air with chlorine or sulfur. |
| Transportation | Handle with care to avoid damage/contamination. Use tweezers or vacuum pick up. Minimize abrasion and mechanical shock for bulk handling. |
2504251720_MetalLions-MMPC0503-4R7MT_C48579913.pdf
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