Wire Wound Chip Common Mode Filters
These wire wound chip common mode filters offer a compact and low-profile solution for preventing common mode noise at high frequencies. They feature excellent solderability and an operating temperature range of -40 to +125. Ideal for applications such as USB2.0 in PCs and peripheral equipment, small digital AV equipment, and LVDS lines in notebooks and LCDs.
Product Attributes
- Brand: Metal-Lions
- Certifications: Hazardous Substance Free Products (F)
Technical Specifications
| Part Number | Common-Mode Impedance Z() at 100MHz | Rated Voltage Vdc(V) | DC Resistance Rdc() Max. | Rated Current Idc(mA) Max. | Insulation Resistance (M)Min. |
| ACM2012-2P-300TF | 30 25% | 450 | 0.20 | 50 | 10 |
| ACM2012-2P-670TF | 67 25% | 400 | 0.25 | 50 | 10 |
| ACM2012-2P-900TF | 90 25% | 400 | 0.30 | 50 | 10 |
| ACM2012-2P-121TF | 12025% | 370 | 0.30 | 50 | 10 |
| ACM2012-2P-161TF | 16025% | 350 | 0.35 | 50 | 10 |
| ACM2012-2P-181TF | 18025% | 330 | 0.35 | 50 | 10 |
| ACM2012-2P-201TF | 20025% | 300 | 0.40 | 50 | 10 |
| ACM2012-2P-221TF | 22025% | 300 | 0.40 | 50 | 10 |
| ACM2012-2P-261TF | 26025% | 300 | 0.40 | 50 | 10 |
| ACM2012-2P-361TF | 36025% | 280 | 0.45 | 50 | 10 |
| ACM2012-2P-601TF | 60025% | 200 | 0.55 | 50 | 10 |
| ACM2012-2P-671TF | 67025% | 150 | 0.60 | 50 | 10 |
| ACM2012-2P-801TF | 80025% | 150 | 0.80 | 50 | 10 |
| ACM2012-2P-901TF | 90025% | 150 | 0.80 | 50 | 10 |
| ACM2012-2P-102TF | 100025% | 150 | 1.30 | 50 | 10 |
| ACM2012-2P-222TF | 220025% | 100 | 2.00 | 50 | 10 |
Dimensions
Shapes and Dimensions:
A : 2.0 0.2
B : 1.2 0.2
C : 1.2 0.2
Land Pattern:
Unit:mm
0.4
0.8
1.0
0.4
1.2
2.6
Explanation of Part Number
ACM 2012 -2P- 900 T F
1: Product Series: Wire Wound Chip Common Mode Filters
2: Dimensions
3: Number of Lines (2P=2 lines)
4: Common Mode Impedance()
5: Packing(Tape & Reel)
6: F: Hazardous Substance Free Products
Soldering Specifications
Solder Specifications: Dip pads in flux and dip in solder pot (96.5 Sn/3.5 Ag solder) at 255C 5C. The terminal electrode and the ferrite must not be damaged.
Strength on pc board bending ability: Solder a chip to test substrate, and then laterally apply a strength load 0.5Kg in the arrow direction. The terminal electrode and the ferrite must not be damaged.
Soldering condition: Solder a chip to a test substrate, bend the substrate by 2mm and then return. The terminal electrode and the ferrite must not be damaged.
Recommendation soldering condition: Apply cream solder to the test circuit board. It is mounted on the recommendation soldering condition.
Recommended Reflow Pattern: 150 (60sec. Min. 150sec Max.), 217 (10sec. Max.), 255 (5 seconds max. at 260). Natural cooling.
Iron Soldering: Use a solder iron of less than 30W when soldering, do not allow the soldering iron tip directly touch the ferrite body outside of terminal electrode.
Packaging
Packaging Form: There shall not be continuation more than two vacancies of the product. Material of carrier tape: Polystyrene. Material of cover tape: Polyester.
Cover Tape Peel Strength: The force for tearing off cover tape is 0.1~0.69(N) in the arrow direction at the following conditions: Temperature: 5 ~ 35, Humidity: 45 ~ 85%, Atmospheric pressure: 860 ~ 1060 hpa.
Packing Quantity: 2000 pcs./reel (180 mm reel, T type)
Reel dimensions: A: 180, B: 60, C: 13, D: 14.4, E: 8.4
Tapping figure: W: 8, P: 4, P0: 4, P1: 2, A0: 1.5, B0: 2.25, K0: 1.35, t: 0.24
2411212332_MetalLions-ACM2012-2P-222TF_C41364526.pdf
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