Wire Wound Chip Common Mode Filters
These wire wound chip common mode filters are designed for small size and low profile applications, offering effective prevention of common mode noise at high frequencies. They feature excellent solderability and an operating temperature range of -40 to +125 (including self-temperature rise). Ideal for USB2.0 interfaces in PCs and peripheral equipment, small digital AV equipment, and LVDS lines in Note PCs and LCDs, as well as audio lines.
Product Attributes
- Brand: Metal-Lions (inferred from URL)
- Certifications: Hazardous Substance Free Products (F in part number)
Technical Specifications
| Part Number | Common-Mode Impedance Z() at 100MHz | Rated Voltage Vdc(V) | DC Resistance Rdc() Max. | Rated Current Idc(mA) Max. | Insulation Resistance (M) Min. |
| ACM2012-2P-300TF | 30 25% | 450 | 0.20 | 50 | 10 |
| ACM2012-2P-670TF | 67 25% | 400 | 0.25 | 50 | 10 |
| ACM2012-2P-900TF | 90 25% | 400 | 0.30 | 50 | 10 |
| ACM2012-2P-121TF | 12025% | 370 | 0.30 | 50 | 10 |
| ACM2012-2P-161TF | 16025% | 350 | 0.35 | 50 | 10 |
| ACM2012-2P-181TF | 18025% | 330 | 0.35 | 50 | 10 |
| ACM2012-2P-201TF | 20025% | 300 | 0.40 | 50 | 10 |
| ACM2012-2P-221TF | 22025% | 300 | 0.40 | 50 | 10 |
| ACM2012-2P-261TF | 26025% | 300 | 0.40 | 50 | 10 |
| ACM2012-2P-361TF | 36025% | 280 | 0.45 | 50 | 10 |
| ACM2012-2P-601TF | 60025% | 200 | 0.55 | 50 | 10 |
| ACM2012-2P-671TF | 67025% | 150 | 0.60 | 50 | 10 |
| ACM2012-2P-801TF | 80025% | 150 | 0.80 | 50 | 10 |
| ACM2012-2P-901TF | 90025% | 150 | 0.80 | 50 | 10 |
| ACM2012-2P-102TF | 100025% | 150 | 1.30 | 50 | 10 |
| ACM2012-2P-222TF | 220025% | 100 | 2.00 | 50 | 10 |
Dimensions
Shapes and Dimensions [Dimensions in mm]
A: 2.0 0.2
B: 1.2 0.2
C: 1.2 0.2
Land Pattern: [mm]
Unit:mm
0.4 0.8 1.0 0.4 1.2 2.6
Packaging
Packaging Form
Material of carrier tape: Polystyrene
Material of cover tape: Polyester
Cover Tape Peel Strength: 0.1~0.69(N)
Packing Quantity
180 mm reel T type: 2000 pcs./reel
Reel dimensions (Dimensions in mm)
A: 180
B: 60
C: 13
D: 14.4
E: 8.4
Soldering Specifications
Solder Specifications
Dip pads in flux and dip in solder pot (96.5 Sn/3.5 Ag solder) at 255C 5C.
The terminal electrode and the ferrite must not be damaged.
Strength on pc board bending ability
Test conditions: -40,+125 30 min. each, 1 cycle
Force: 0.5Kg
Recommended Reflow Pattern
Reflow: until two times
Peak temperature: 255 (10sec. Max.)
Preheating temperature: 150 (60sec. Min.)
Time above 217: 150sec Max.
Iron Soldering
Use a solder iron of less than 30W when soldering, do not allow the soldering iron tip directly touch the ferrite body outside of terminal electrode.
5 seconds max. at 260.
2411212332_MetalLions-ACM2012-2P-181TF_C41364524.pdf
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