SMD Chip Common Mode Filters - ACM3216 Series
These high-frequency common mode filters are designed with a winding type to achieve a small size and low profile, making them ideal for compact electronic devices. They effectively prevent common mode noise in high-frequency applications, offering excellent solderability and a wide operating temperature range of -40 to +125. Applications include USB2.0 interfaces for PCs and peripherals, small digital AV equipment, and LVDS and audio lines in notebook PCs and LCDs.
Product Attributes
- Brand: Metal-Lions (implied by website URL)
- Product Series: ACM3216 Series
- Hazardous Substance Free: Yes (indicated by 'F' in part number)
Technical Specifications
| Part Number | Dimensions (A x B x C) [mm] | Number of Lines | Common Mode Impedance (Ω) @ 100MHz (±25%) | DC Resistance (Ω) max. | Rated Current (mA) max. | Rated Voltage (Vdc) max. | Withstand Voltage (Vdc) max. | IR (Ω) min. |
|---|---|---|---|---|---|---|---|---|
| ACM3216-2P-900TF | 3.2 x 1.6 x 1.9 | 2P | 90 | 0.30 | 400 | 50 | 125 | 10M |
| ACM3216-2P-121TF | 3.2 x 1.6 x 1.9 | 2P | 120 | 0.30 | 350 | 50 | 125 | 10M |
| ACM3216-2P-161TF | 3.2 x 1.6 x 1.9 | 2P | 160 | 0.40 | 350 | 50 | 125 | 10M |
| ACM3216-2P-221TF | 3.2 x 1.6 x 1.9 | 2P | 220 | 0.45 | 300 | 50 | 125 | 10M |
| ACM3216-2P-261TF | 3.2 x 1.6 x 1.9 | 2P | 260 | 0.50 | 300 | 50 | 125 | 10M |
| ACM3216-2P-331TF | 3.2 x 1.6 x 1.9 | 2P | 330 | 0.60 | 300 | 50 | 125 | 10M |
| ACM3216-2P-361TF | 3.2 x 1.6 x 1.9 | 2P | 360 | 0.60 | 300 | 50 | 125 | 10M |
| ACM3216-2P-601TF | 3.2 x 1.6 x 1.9 | 2P | 600 | 0.80 | 300 | 50 | 125 | 10M |
| ACM3216-2P-801TF | 3.2 x 1.6 x 1.9 | 2P | 800 | 0.90 | 300 | 50 | 125 | 10M |
| ACM3216-2P-102TF | 3.2 x 1.6 x 1.9 | 2P | 1000 | 1.00 | 300 | 50 | 125 | 10M |
| ACM3216-2P-142TF | 3.2 x 1.6 x 1.9 | 2P | 1400 | 1.00 | 220 | 50 | 125 | 10M |
| ACM3216-2P-202TF | 3.2 x 1.6 x 1.9 | 2P | 2000 | 1.20 | 200 | 50 | 125 | 10M |
| ACM3216-2P-222TF | 3.2 x 1.6 x 1.9 | 2P | 2200 | 1.20 | 200 | 50 | 125 | 10M |
Packaging
| Reel Diameter (φ) | Quantity | Carrier Tape Material | Cover Tape Material | Cover Tape Peel Strength |
|---|---|---|---|---|
| 180 mm | 2000 pcs./reel (T type) | Polystyrene | Polyester | 0.05~0.69 N (at 5~35, 45~85% RH, 860~1060 hpa) |
Soldering and Reliability
| Test Condition | Description |
|---|---|
| Solder Specifications | Dip pads in flux and dip in solder pot (96.5 Sn/3.5 Ag solder) at 255°C ±5°C. Terminal electrode and ferrite strength must not be damaged. |
| Strength on pc board bending ability | Solder a chip to test substrate, then laterally apply a load 0.9Kg in the arrow direction. Terminal electrode and ferrite must not be damaged. Bend substrate by 2mm and return. |
| High temperature resistance | +125±2°C, Rated voltage, Rated current, 500±12 hours. Insulation resistance: >10(MΩ), DC resistance: standard value. |
| Low temperature resistance | -40±2°C, 500±12 hours. |
| Thermal cycle | -40°C, +125°C (30 min. each), 100 cycles. |
| Vibration | Frequency: 10 to 50 Hz, Amplitude: 1.52 mm. X, Y, Z directions for 2 hours each. Appearance: Ferrite shall not be damaged. |
| Recommended Reflow Pattern | Iron Soldering: Use a solder iron of less than 30W, do not allow tip directly touch ferrite body outside terminal electrode. 5 seconds max. at 260°C. Reflow: 60sec. Min. 150sec Max. @ 150°C, 217°C, 255°C (10sec. Max.). Natural cooling. |
2411212332_MetalLions-ACM3216-2P-142TF_C41364536.pdf
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