SMD Chip Common Mode Filters - ACM3216 Series
These winding type common mode filters offer a compact and low-profile solution for preventing common mode noise at high frequencies. They are designed for excellent solderability and operate within a temperature range of -40 to +125. Ideal for applications such as USB2.0 in PCs and peripherals, small digital AV equipment, and LVDS/Audio lines in notebooks and LCDs.
Product Attributes
- Brand: Metal-Lions (implied by website URL)
- Product Series: ACM3216
- Certifications: Hazardous Substance Free Products (F)
- Polarity: No Polarity
Technical Specifications
| Part Number | Dimensions (A x B x C) [mm] | Number of Lines | Common Mode Impedance () @ 100MHz | DC Resistance () max. | Rated Current (mA) max. | Rated Voltage (Vdc) max. | Withstand Voltage (Vdc) max. | Insulation Resistance () min. |
|---|---|---|---|---|---|---|---|---|
| ACM3216-2P-900TF | 3.2 x 1.6 x 1.9 | 2P | 90 25% | 0.30 | 400 | 50 | 125 | 10M |
| ACM3216-2P-121TF | 3.2 x 1.6 x 1.9 | 2P | 120 25% | 0.30 | 350 | 50 | 125 | 10M |
| ACM3216-2P-161TF | 3.2 x 1.6 x 1.9 | 2P | 160 25% | 0.40 | 350 | 50 | 125 | 10M |
| ACM3216-2P-221TF | 3.2 x 1.6 x 1.9 | 2P | 220 25% | 0.45 | 300 | 50 | 125 | 10M |
| ACM3216-2P-261TF | 3.2 x 1.6 x 1.9 | 2P | 260 25% | 0.50 | 300 | 50 | 125 | 10M |
| ACM3216-2P-331TF | 3.2 x 1.6 x 1.9 | 2P | 330 25% | 0.60 | 300 | 50 | 125 | 10M |
| ACM3216-2P-361TF | 3.2 x 1.6 x 1.9 | 2P | 360 25% | 0.60 | 300 | 50 | 125 | 10M |
| ACM3216-2P-601TF | 3.2 x 1.6 x 1.9 | 2P | 600 25% | 0.80 | 300 | 50 | 125 | 10M |
| ACM3216-2P-801TF | 3.2 x 1.6 x 1.9 | 2P | 800 25% | 0.90 | 300 | 50 | 125 | 10M |
| ACM3216-2P-102TF | 3.2 x 1.6 x 1.9 | 2P | 1000 25% | 1.00 | 300 | 50 | 125 | 10M |
| ACM3216-2P-142TF | 3.2 x 1.6 x 1.9 | 2P | 1400 25% | 1.00 | 220 | 50 | 125 | 10M |
| ACM3216-2P-202TF | 3.2 x 1.6 x 1.9 | 2P | 2000 25% | 1.20 | 200 | 50 | 125 | 10M |
| ACM3216-2P-222TF | 3.2 x 1.6 x 1.9 | 2P | 2200 25% | 1.20 | 200 | 50 | 125 | 10M |
Dimensions
ACM3216 Series:
Dimensions in mm: A: 3.2 0.2, B: 1.6 0.2, C: 1.9 0.2
Recommended Footprint
(Diagram not provided in text, only dimensions)
Soldering Specifications
Solder Specifications: Dip pads in flux and dip in solder pot (96.5 Sn/3.5 Ag solder) at 255C 5C.
Strength on pc board bending ability: Terminal electrode and ferrite strength must not be damaged. Apply a load of 0.9Kg in the arrow direction. Bend the substrate by 2mm and return.
Recommended PC board pattern: (Diagram not provided in text)
Reliability Test Conditions
High temperature resistance: Temp: +1252, Humidity: 60%RH max., Applied current: Rated current, Testing time: 50012 hours.
Thermal cycle: Temp: -40,+125 (stabilized for 30 min each), Cycle: 100 cycles.
Vibration: Frequency: 10 to 50 Hz, Amplitude: 1.52 mm, Dimension and times: X, Y, Z directions for 2 hours each.
Low temperature resistance: Temp: -402, Testing time: 50012 hours.
Packaging
Reel dimensions (mm): A: 180, B: 60, C: 13, D: 14.4, E: 8.4
Tape dimensions (mm; Tolerance: 0.1): W: 8, P: 4, P0: 4, P1: 2, A0: 1.75, B0: 3.45, K0: 2.05, t: 0.23
Packaging Form: Material of carrier tape: Polystyrene, Material of cover tape: Polyester. No continuation of more than two vacancies of the product.
Cover Tape Peel Strength: 0.05~0.69(N) at 5 ~ 35, 45 ~ 85% Humidity, 860 ~ 1060 hpa.
Packing Quantity: 180 mm reel T type: 2000 pcs./reel
Recommended Reflow Pattern
Reflow: Until two times. Use a solder iron of less than 30W. Do not allow the soldering iron tip to directly touch the ferrite body outside of the terminal electrode. 5 seconds max. at 260.
Iron Soldering: 60sec. Min. 150sec Max. 150 217 255 10sec. Max. Natural cooling.
2411212332_MetalLions-ACM3216-2P-221TF_C41364539.pdf
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