Product Overview

SAMXON Aluminum Electrolytic Capacitors offer a comprehensive range of miniature, large can, and V-Chip types designed for various electronic and industrial applications. These capacitors are engineered for reliability, featuring extended load life, high ripple current capabilities, and low impedance characteristics. They are suitable for use in power supplies, audio equipment, communication devices, and high-density assembly applications.

Product Attributes

• Brand: SAMXON
• Origin: China (Manufacturing Plants in Dongguan and Wuxi)

Technical Specifications

Miniature Aluminum Electrolytic Capacitors

Large Can Aluminum Electrolytic Capacitors

Screw Terminal Type Aluminum Electrolytic Capacitors

V-Chip Aluminum Electrolytic Capacitors

Application Guidelines

1. Circuit Design:

• Ensure operating conditions (temperature, ripple current) are within catalog specifications.
• Select capacitors compliant with the required product life.
• Aluminum electrolytic capacitors are polarized; avoid reverse or AC voltage. Use non-polar types for circuits with potential polarity reversal. Non-polar types are not for AC voltage.
• Avoid circuits requiring rapid/frequent charge/discharge; use special design capacitors for extended life.
• Do not exceed rated voltage; pay attention to peak voltage. For series connections, use balancing resistors.
• Outer sleeve is not guaranteed as an insulator. For applications requiring special insulation, contact sales.
• Do not connect blank terminals of snap-in type products to other circuits to prevent short circuits.
• Avoid water, brine, oil, toxic gases (HS, SO, NO, Cl, NH), ozone, UV, radiation, and severe vibration/shock exceeding specifications.
• When designing PCBs, ensure hole spacing matches lead spacing. No circuit patterns above the safety vent. Maintain required clearance above the vent based on case diameter. For end-seal vented parts, make holes on the PCB for gas release.
• Do not install screw terminal capacitors with the end seal side down. For horizontal mounting, the positive terminal must be in the upper position.
• Electrolyte and separator paper are combustible; electrolyte is conductive. Avoid circuit patterns beneath the end seal to prevent corrosion or short circuits.
• Do not place heat-generating components near aluminum capacitors or on the reverse side of the PCB under the capacitor.
• Consider variations in electrical characteristics due to temperature and frequency.
• On double-sided PCBs, do not place capacitors over circuit patterns or unused holes.
• Torque for terminal/bracket screws must be within specified values.
• When connecting capacitors in parallel, consider current balance.

2. Mounting:

• Do not reuse a capacitor after assembly and power application in another circuit.
• Discharge capacitors using a 1k resistor before handling.
• Leakage current may increase after storage exceeding 6 months; perform voltage treatment with a 1k resistor if necessary.
• Confirm ratings and polarity before installation.
• Do not drop capacitors or use dropped ones.
• Avoid deforming capacitors during installation.
• Ensure lead spacing matches PCB hole spacing.
• Snap-in type capacitors (JIS 692, 693, 694, 695) must be installed tightly to the PCB.
• Be cautious of clinch force during automatic insertion.
• Avoid mechanical shock from insertion machines or checkers.
• Soldering conditions must be within SAMXON specifications (Pb/Sn and Pb-free types).
• Do not tilt, lay down, or twist the capacitor body after soldering.
• Do not carry PCBs by grasping soldered capacitors.
• Prevent anything from touching the capacitor after soldering. Ensure stacked PCBs do not cause contact. Avoid radiated heat from other components affecting the capacitor.
• Do not clean capacitors with halogenated cleaning agents.
• For fixing/coating materials, avoid halogen ingredients. Remove flux and contamination from the end seal gap before coating. Apply coating partially, not around the entire capacitor body. Consult sales for curing conditions.
• Do not install screw terminal capacitors with the end seal side down. For horizontal mounting, the positive terminal must be in the upper position.

3. Storage:

• Store at 5C to 35C, humidity <75% RH, out of direct sunlight.
• Capacitors stored for over one year may require voltage aging treatment to reform the oxide dielectric. Apply rated voltage gradually for 30-60 minutes.

4. Disposal:

• Dispose of as industrial waste through professional waste disposal specialists.

5. Printed Circuit Board Cleaning:

• Halogen type organic solvents can permeate capacitors and cause corrosion due to free chlorine ions.
• Recommended cleaning agents: water or alcohol. Halogen type agents are not recommended due to corrosiveness.
• Penetration channels: clearance between rubber and case, clearance between rubber and lead wires, permeation through rubber end seal. Tight sealing and solvent-resistant rubber are crucial.

6. Basic Electrical Characteristics:

• Capacitance: Measured as AC capacitance at 120Hz, 0.5Vrms AC, with 1.5-2.0V DC bias. Decreases with increasing frequency and decreasing temperature.
• Tan (Dissipation Factor): Ratio of resistive to capacitive reactance. Increases with frequency and decreases with temperature.
• Equivalent Series Resistance (ESR): Affected by oxide layer, electrolyte, foil length, and surface area. Increases as temperature decreases. Decreases with increasing frequency, stabilizing at a value mainly due to electrolyte/separator combination.
• Impedance (Z): Opposition to AC current. Predominantly capacitive reactance at low frequencies, ESR at mid-frequencies, and inductive reactance at high frequencies. Varies with electrolyte temperature.
• Leakage Current: Small DC current flowing to reform the oxide layer. High initially, then stabilizes. Increases with temperature and voltage. Measured at 20C with rated voltage through a 1,000 resistor.

7. Quality Policy:

• Commitment to total quality and customer satisfaction.
• Adherence to stringent international quality management standards.
• Focus on process mastery, continuous improvement, enhanced productivity, and innovation.
• Quality assurance measures documented in operational instructions and procedures.
• Project-oriented improvement programs for zero defects.
• Process assurance from planning and development, utilizing FMEA and SVP. Documentation, personnel training, and SPC are key.
• Incoming inspection for raw materials and parts.
• In-process inspection integrated into process steps for prevention.
• Final inspection verifies major properties, including parameter testing, identification, and documentation checks.

8. Manufacturing and Quality Assurance Procedures:

• Covers prefabrication (foil etching, forming), winding, impregnation, assembly, sealing, marking, aging, visual inspection, and final testing.
• Includes sampling and SPC at various stages to ensure quality.

9. Environmental Policy:

• Commitment to minimizing environmental impact, reducing energy and resource consumption.
• Prevention of environmental hazards and assessment of potential impacts in product and process planning.
• Environmentally conscious actions required from all employees.
• Seeking cooperation from business associates and providing information on environmentally friendly product use.

10. Compliance with RoHS Directive:

• Products comply with EU RoHS Directive (2011/65/EU), with specified limits for Lead (Pb), Mercury (Hg), Cadmium (Cd), Hexavalent Chromium (Cr VI), PBBs, and PBDEs.

11. Halogen Free Compliant:

• Products comply with halogen-free requirements, with specified maximum limits for Bromine (Br) and Chlorine (Cl).

12. Part Number System:

• Details the structure of part numbers including Series, Capacitance, Tolerance, Voltage, Case Size, Type, Product Line, and Sleeve Material.

13. Taping Specifications:

• Provides dimensions and tolerances for taped components in carrier tape, sprocket holes, and hold-down tape.

14. Packing Specifications:

• Lists packing quantities for taping and bulk types, including inner and outer box quantities based on component dimensions.

15. Lead Forming Specifications:

• Details various lead forming codes (CB, HE, FD, KD, EC, PC) with corresponding dimensions (F, H, H1, H2, E) and lead diameter (d).