SAMXON Aluminum Electrolytic Capacitors

Product Overview

SAMXON Aluminum Electrolytic Capacitors are designed for a wide range of electronic and industrial applications. They offer a variety of series tailored to specific needs, including miniature, large can, and V-chip types. These capacitors are known for their performance characteristics such as high ripple current, low impedance, long life, and high temperature operation. They are suitable for applications in communication equipment, switching power supplies, industrial measuring instruments, automotive electronics, audio equipment, and power supplies for various electronic devices.

Product Attributes

• Brand: SAMXON
• Origin: PRC (Manufacturing Plants in Dongguan and Wuxi)
• Compliance: RoHS Directive, Halogen Free Compliant

Technical Specifications

Series Overview:

Part Number System Example: E KF 336 M 1C E 05 RR

Taping Specifications:

Packing Specifications (Taping Type):

Packing Specifications (Bulk Type):

Packing Specifications (Snap-in Type):

Lead Forming Specifications:

Reflow Soldering for Chip Capacitors Allowable Range of Peak Temperature:

Recommended Land Size (mm):

Application Guidelines Summary:

• Ensure operating environment and conditions are within catalog specifications.
• Operating temperature and ripple current must not exceed SAMXON's specifications.
• Select capacitors compliant with product life requirements.
• Aluminum electrolytic capacitors are polarized; avoid reverse or AC voltage. Use non-polar types for circuits with potential reversed polarity.
• Avoid circuits requiring rapid/frequent charge/discharge without special design capacitors.
• Do not apply excess voltage; ensure peak voltage does not exceed rated voltage.
• Outer sleeve is not guaranteed as electrical insulator; use special insulation when required.
• Do not connect blank terminals of snap-in type products to other circuits.
• Avoid water, brine, oil, toxic gases (HS, SO, NO, Cl, NH), ozone, UV, and radiation.
• Avoid severe vibration and physical shock exceeding SAMXON's specifications.
• Ensure proper hole spacing on PC boards for lead spacing.
• Do not place circuit patterns or wires above the capacitor safety vent.
• Provide clearance above the safety vent based on case diameter.
• For snap-in type with end seal vented parts, make a hole on the PC board for gas release.
• Do not install screw terminal capacitors with end seal side down; positive terminal must be upper when horizontal.
• Electrolyte and separator paper are combustible; electrolyte is conductive. Avoid circuit patterns beneath end seals.
• Do not place heat-generating components near aluminum capacitors or on the reverse side of the PC board under the capacitor.
• Consider temperature and frequency variations on electrical characteristics.
• Do not place capacitors on circuit patterns or over unused holes on double-sided PC boards.
• Torque for terminal screws must be within specified values.
• Consider current balance when installing capacitors in parallel.
• Do not reuse a capacitor in other circuits after assembly and power application.
• Discharge capacitors using a 1k resistor before handling.
• Leakage current may increase after storage; perform voltage treatment with a 1k resistor if necessary.
• Confirm ratings and polarity before installation.
• Do not drop capacitors or use dropped ones.
• Avoid deforming capacitors during installation.
• Ensure lead spacing matches PC board hole spacing.
• Snap-in capacitors should be installed tightly to the PC board.
• Avoid excessive clinch force during automatic insertion.
• Be careful of mechanical shock from automatic insertion equipment.
• Soldering conditions must be within SAMXON's specifications.
• Do not tilt, lay down, or twist the capacitor body after soldering.
• Do not carry PC boards by grasping soldered capacitors.
• Prevent anything from touching capacitors after soldering; ensure stacked boards or components do not touch capacitors.
• Capacitors shall not be affected by radiated heat from soldered PC boards or other components.
• Do not clean capacitors with halogenated cleaning agents.
• Avoid fixing/coating materials containing halogens.
• Remove flux and contamination from the gap between the end seal and PC board before coating.
• Apply coating material partially, not all around the capacitor body.
• Storage: 5C to 35C, <75% RH, out of direct sunlight.
• Capacitors stored for over one year require voltage aging treatment.
• Dispose of capacitors as industrial waste via professional specialists.
• Halogen type organic solvents can permeate capacitors, causing corrosion due to chlorine ions. Use water or alcohol-based cleaning agents, or mount on pre-cleaned boards, or use epoxy end seals.
• Capacitance is AC capacitance measured at 120Hz, 0.5Vrms, with 1.5-2.0V DC bias. Capacitance decreases with increasing frequency and decreasing temperature.
• Tan (dissipation factor) increases with measuring frequency and decreases with measuring temperature.
• ESR is affected by temperature and frequency; it increases with decreasing temperature and decreases with increasing frequency.
• Impedance (Z) is frequency-dependent, with capacitive reactance (Xc) dominating at low frequencies, ESR at mid-frequencies, and inductive reactance (XL) at high frequencies.
• Leakage current is a small DC current that flows to reform the oxide layer; it decreases with time and is affected by temperature and voltage.
• Quality Policy: Total customer satisfaction, mastery of processes, continuous improvement, enhanced productivity, promotion of innovation.
• Quality Assurance: Measures and regulations documented in operational instructions and procedures.
• Quality Programs: Project-oriented improvement programs for zero defects.
• Process Assurance: FMEA, SVP, documentation, personnel training, SPC, preventive maintenance.
• Incoming Inspection: Raw materials, parts, and consumables are inspected.
• In-process Inspection: Integrated into process steps for error prevention.
• Final Inspection/Approval for Shipment: Batch testing of major properties, parameter testing, identification checks, visual assessment, documentation review.
• Manufacturing and Quality Assurance Procedures: Covers prefabrication, winding, impregnation, assembly, sealing, marking, aging, final inspection, and dispatch.
• Environmental Policy: Minimize environmental burden, reduce energy/resource consumption, prevent environmental hazards, assess environmental impact.

Environmental Compliance:

• RoHS Directive Compliant (Pb 1000ppm, Hg 1000ppm, Cd 100ppm, Cr6+ 1000ppm, PBBs 1000ppm, PBDEs 1000ppm).
• Halogen Free Compliant (Br 900 ppm, Cl 900 ppm, Total Cl+Br 1500 ppm).