Product Overview
The CA Series Thick Film Chip Array Resistors are Pb-free and halogen-free components designed for electronic applications. These resistors offer a wide resistance range and are available in various sizes and tolerances. They are constructed with a ceramic substrate, silver electrodes, and a ruthenium oxide resistive layer, protected by glass and epoxy resin. The CA series is suitable for reflow and wave soldering processes, with recommended soldering profiles provided.
Product Attributes
- Brand: LIZHI ELECTRONICS (KUNSHAN) CO., LTD.
- Origin: Kunshan City, Jiangsu Province, China
- Type: Thick Film Chip Array Resistors
- Compliance: Pb-free, Halogen-free (RoHS exempt for lead in glass)
Technical Specifications
| Model | Type | Size | Rated Power | Tolerance | Resistance Value | Packing Code | Dimensions (mm) L x W x H | Max Working Voltage | Max Overload Voltage | Dielectric Withstanding Voltage | Resistance of Jumper | Rated Current of Jumper | Operating Temperature Range | Storage Condition |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| CA034AJA0102G | Thick Film Chip Array Resistors | 8P4R (0603) | 1/10W | 5% | 1K | G (Reel) | 3.20 0.20 x 1.50 0.20 x 0.55 0.05 | 50V | 100V | 430V | <50m | 1A | -55 ~ +155 | 530, 3075%RH |
| CA024A | Thick Film Chip Array Resistors | 8P4R (0402) | 1/16W | 1%, 2%, 5% | 1 ~ 1M | G (Reel), V (Bulk), S (Double Standard Quantity) | 2.00 0.10 x 1.00 0.10 x 0.40 0.05 | 50V | 100V | 220V | <50m | 1A | -55 ~ +155 | 530, 3075%RH |
| CA034A | Thick Film Chip Array Resistors | 8P4R (0603) | 1/10W | 1%, 2%, 5% | 1 ~ 1M | G (Reel), V (Bulk), S (Double Standard Quantity) | 3.20 0.20 x 1.50 0.20 x 0.55 0.05 | 50V | 100V | 430V | <50m | 1A | -55 ~ +155 | 530, 3075%RH |
Performance Specifications
| Item | Test Method | Test Conditions | Specification |
|---|---|---|---|
| Temperature Coefficient | JIS C 5201 4.8 | R0: resistance at room temperature, R: resistance at 125 or -55, t0: room temperature, t: test temperature (125 or -55) | 200 PPM/ |
| Solderability | JIS C 5201 4.17 | Dip in flux, then into soldering bath at 2455 for 30.5 sec. | Min 95% coverage |
| Insulation Resistance | JIS C 5201 4.6 | Applied dielectric withstanding voltage on the center of body for 605 seconds. | >10G |
| Dielectric Withstanding Voltage | JIS C 5201 4.7 | Applied dielectric withstanding voltage on the center of body for 605 seconds. | No evidence of flashover, arcing or insulation breakdown |
| Short-time Overload | JIS C 5201 4.13 | Applied 2.5 times rated voltage for 5 seconds. Measure resistance variation. | (1.0% +0.05) Max |
| Temperature Cycling | JIS C 5201 4.19 | 1552 to -553, 5 cycles. Measure resistance variation. | (2.0%+0.05) Max |
| Humidity | JIS C 5201 4.24 | 402, 90~95% RH; rated voltage applied for 1.5h, rest for 0.5h, repeated for 1000 hours. Measure resistance variation. | (2.0%+0.05) Max |
| Load Life | JIS C 5201 4.25.1 | 702, ON TIME:1.5H, OFF TIME:0.5H, rated voltage applied for 1000 hours. Measure resistance variation. | (2.0%+0.05) Max |
| Terminal Bending | JIS C 5201 4.33 | Mount on test board, bend board for 201 sec. Bending distance 1 +0.2/0 mm. Measure resistance variation. | (1.0%+0.05) Max |
| Moisture Resistance | MIL-STD-202 METHOD 106 | Cycles of temperature and humidity variation for 10 cycles. Measurement at 244 hours after test conclusion. | (2.0% +0.05) Max |
Packaging Specifications
Tapping Specification
| Reel Dimension (mm) | CA024A | CA034A |
|---|---|---|
| A | 1782.0 | 1782.0 |
| B | 60.01.0 | 60.01.0 |
| C | 13.50.5 | 13.50.5 |
| F | 11.40.1 | 11.40.1 |
| W | 9.000.3 | 9.000.3 |
| Quantity per Reel | 10,000 pcs | 5,000 pcs |
Packing Dimension (Unit: mm)
| Dimension | CA024A | CA034A |
|---|---|---|
| A | 1.200.10 | 1.900.15 |
| B | 2.200.10 | 3.400.20 |
| D | 1.500.0 | 1.500.0 |
| F | 1.0 | 1.0 |
| P0 | 3.500.05 | 3.500.05 |
| P1 | 4.000.10 | 4.000.10 |
| P2 | 4.000.10 | 4.000.10 |
| W | 2.000.05 | 2.000.05 |
| Overall Width | 8.000.20 | 8.000.20 |
Peel Force of Top Cover Tape
Top cover tape is pulled at a speed of 200 mm/min at an angle of 165 to 180 degrees. Peel force of paper carrier tape: 0.1N to 0.7N (10 to 70 g). Peel force of plastic carrier tape: 0.15N to 0.80N (15 to 80 g).
Soldering
- Recommended Reflow Soldering Profile: (Profile details not provided in source text)
- Recommended Wave Soldering Profile: (Profile details not provided in source text)
- Hand Soldering Temperature: 35010 for less than 3 seconds. Avoid direct contact of solder iron tip with the component body.
2410121222_LIZ-CA034AJA0222G_C7432038.pdf
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