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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Operating Temperature:
-40℃~+85℃
Load Capacitance:
20pF
Equivalent Series Resistance(ESR):
60Ω
Frequency:
8MHz
Mfr. Part #:
L538G080U11L
Package:
SMD5032-2P
Key Attributes
Model Number:
L538G080U11L
Product Description
Product Overview
This specification applies to a SMD quartz crystal unit with a nominal frequency of 8.000MHz. It is designed for applications requiring stable frequency and reliable performance.
Product Attributes
- Brand: LUCK I
- Manufacturer: (Zhejiang Lucki Microelectronics Co., Ltd.)
- Origin: China
- Certifications: RoHS compliant
Technical Specifications
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit | |
| Normal Frequency Range | Fn | - | 8.000 | - | MHz | ||
| Order of vibration | - | Fundamental | - | ||||
| Load capacitance | CL | - | 20 | - | pF | ||
| Initial Frequency Accuracy | FL | -10 | - | 10 | ppm | ||
| Resonance resistance | RR | - | - | 80 | |||
| Drive level | DL | - | 100 | 300 | W | ||
| Shunt capacitance | C0 | - | - | 5 | pF | ||
| Insulation resistance | IR | DC 100V | 500 | - | - | M | |
| DLD | DLD2 | 0.01~100 uW 10STEPS | - | - | - | ||
| FDLD | - | - | - | ppm | |||
| RLD2 | - | - | - | ||||
| DLDH2 | - | - | - | ||||
| FDLDH | - | - | - | ppm | |||
| Motional capacitance | C1 | - | - | - | fF | ||
| Inductance | L | - | - | - | mH | ||
| Trim sensitivity | TS | - | - | - | ppm/pF | ||
| Autoeciousness | SPDB | 5300PPM of nominal Freq | - | -3.0 | - | dB | |
| Operating temperature range | T1 | 30PPM | -40 | - | 85 | ||
| Storage temperature range | -55 | - | 125 | ||||
| Aging | - | -3 | 3 | ppm | |||
| Crystal enclosure seal | Seam seal | resistance weld | cold weld | ||||
| Crystal enclosure medium | nitrogen | vacuum | dry air | ||||
| Inside Structure - Can | Ceramic | ||||||
| Inside Structure - Base | Ceramic | ||||||
| Inside Structure - Blank | Quartz | ||||||
| Inside Structure - Electrode | Ag | ||||||
| Inside Structure - Epoxy | Silicon based | ||||||
| Inside Structure - Soldering Pads | Au plated | ||||||
| Solderability | Solder bath temperature:260 , dwell time:5 seconds, Solder: 100% tin | A new uniform coating of solder shall cover a minimum of 95% of the surface being immersed. | |||||
| Resistance to soldering heat | Solder temperature 260+/-3,Immersion time:10 S, Solder bath composition:100% tin | F+/-5ppm R+/-15%+3 | |||||
| Vibration | The entire frequency range: 10Hz to 55Hz ,Amplitude:1.5mm, 2 h in each of 3 mutually perpendicular axes | F+/-5ppm R+/-15%+3 | |||||
| Drop test | Drop from 75cm height on 3cm hard wooden board for 6 times | F+/-5ppm R+/-15%+3 | |||||
| Cold Storage | Stored at -40+/-3 for 1000 h, then standard atmospheric conditions for 1h | F+/-5ppm R+/-15%+3 | |||||
| High temperature high humidity storage (steady state) | Stored at 40+/-2 with 95% RH for 1000h, then standard atmospheric conditions for 2h | F+/-5ppm R+/-15%+3 | |||||
| Thermal shock | 50 successive Change of temperature cycles (-40+/-3 for 15min, 100+/-2 for 15min, Transition time within 10 seconds), then standard atmospheric conditions for 1h | F+/-5ppm R+/-15%+3 | |||||
| Sealing | Helium leakage detector, Pressure:500Kpa, duration:120 minutes | Leakage rate1*10-9Pa.m3/S | |||||
| High temperature Life test | Stored at 85+/-3 for 720h, then standard atmospheric condition for 1h | F+/-5ppm R+/-15%+3 | |||||
| Reflow Profile - Preheat Temperature Min | Ts Min | 150 | |||||
| Reflow Profile - Preheat Temperature Typical | TsTyp | 175 | |||||
| Reflow Profile - Preheat Temperature Max | Ts Max | 200 | |||||
| Reflow Profile - Time (ts) | ts | 60-180 | seconds | ||||
| Reflow Profile - Ram-up Rate (TL to Tp) | 3/second max | ||||||
| Reflow Profile - Temperature (TL) | TL | Time Maintained Above | 217 | ||||
| Reflow Profile - Time (TL) | TL | Time Maintained Above | 60-150 | seconds | |||
| Reflow Profile - Peak Temperature (Tp) | Tp | - | - | 260 | Max for 10 seconds | ||
| Reflow Profile - Time within 5 of actual peak | tp | 20-40 | seconds | ||||
| Reflow Profile - Ramp-down Rate | 6/seconds Max | ||||||
| Reflow Profile - Time to Peak Temperature | t | Tune 25 to Peak Temperature | - | - | 8 | minutes Max | |
| Reflow Profile - Moisture Sensitivity Level | Level 1 | ||||||
| Manual Soldering - Max Temperature | - | - | 260 | Max for 10 seconds Max, 4 times Max | |||
2410121956_Lucki-L538G080U11L_C7502107.pdf
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