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quality Metal Current Sensing Chip Resistors LIZ RM2512FBR080GM Pb Free Halogen Free AEC Q200 Compliant factory
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quality Metal Current Sensing Chip Resistors LIZ RM2512FBR080GM Pb Free Halogen Free AEC Q200 Compliant factory
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Specifications
Power(Watts):
2W
Resistance:
80mΩ
Mounting Type:
SMD
Type:
Current Sense Resistor
Tolerance:
±1%
Mfr. Part #:
RM2512FBR080GM
Package:
2512
Key Attributes
Model Number: RM2512FBR080GM
Product Description

Metal Current Sensing Chip Resistors - RM Series

This specification applies to Pb-free and halogen-free Metal Current Sensing Chip Resistors, RM Series, which comply with AEC-Q200 standards. These resistors are designed for current sensing applications.

Product Attributes

  • Manufacturer: (LIZHI ELECTRON CO., LTD.)
  • Material: Metal Alloy
  • Certifications: AEC-Q200
  • Lead Free: Yes
  • Halogen Free: Yes

Technical Specifications

Part Number Example Type Size Rated Power Tolerance Resistance Value Packing Code Material Dimensions (mm) Operating Temperature Range Storage Condition Shelf Life
RM2512FBR010GM RM (Metal current sensing chip resistors) 2512 2W 1% 10m G (reel) M (MnCu) L: 6.40.2, W: 3.20.2, T: 0.600.20 (R2m) / 0.90.2 (R>2m) -55~+170 535, 4075%RH 2 years
(Example for RM1206) RM (Metal current sensing chip resistors) 1206 1/2W 1% 3m~30m G (reel) M (MnCu) L: 3.20.20, W: 1.60.20, T: 0.600.20 (3mR30m) -55~+170 535, 4075%RH 2 years

Resistance Range and Electrical Characteristics

Type Rated Power Resistance Range TCR (ppm/) Insulation Resistance
RM1206 1/2W, 1W 3m~30m +25~+125: 50
+25~+155: 65
>100M
RM2512 1W, 1.5W, 2W 1m~50m +25~+125: 50
+25~+155: 65
>100M
RM2512 3W 1m~3 m +25~+125: 50
+25~+155: 65
>100M

Performance Specifications

Item Specification Limits Test Methods
Temperature Coefficient As Spec. +25~+125: 50ppm/
+25~+155: 65 ppm/
High Temperature Exposure <1% MIL-STD-202 Method 108
Low Temperature operation <0.5% IEC60115-1 4.23.4
Temperature cycling <0.5% JESD22 Method JA-104
Short-time overload <0.5% IEC60115-1 4.13
Biased Humidity <0.5% MIL-STD-202 METHOD 103
Operational life <1% MIL-STD-202 METHOD 108
Solderability Min 95% coverage J-STD-002B test B
Resistance to soldering heat <0.5% IEC60115-1 4.18
Mechanical Shock <0.5% MIL-STD-202 METHOD 213
Resistance to vibration <0.5% MIL-STD-202 METHOD 204
Board Flex <0.5% AEC-Q200-005
Terminal Strength <1% AEC-Q200-006
Thermal shock <0.5% MIL-STD-202 METHOD 107
Flammability V-0 or V-1 acceptable UL-94
ESD test <1% AEC-Q200-002

Packaging Specifications

Reel Dimensions

Size Dimension A (mm/inch) B (mm/inch) C (mm/inch) F (mm/inch) W (mm/inch) Quantity per Reel
RM1206 mm 1782.00 60.001.00 13.500.50 11.400.10 9.000.30 5,000 pcs
RM1206 Inch 7.0080.079 2.3620.039 0.5310.020 0.4490.039 0.3540.012
RM2512 mm 1782.00 60.001.00 13.500.50 15.401.00 13.000.3 4,000 pcs
RM2512 Inch 7.0080.079 2.3620.039 0.5310.020 0.6060.039 0.5120.012

Packing Dimensions

Packing Type Size A (mm) B (mm) W (mm) F (mm) E (mm) P1 (mm) P2 (mm) P0 (mm) D0 (mm) T (mm)
Paper Tape RM1206 2.00.15 3.60.2 8.00.2 3.50.05 1.750.1 4.00.1 2.00.05 4.00.1 1.500.1 0.840.1
Emboss Tape RM2512 3.60.2 18.00.2 12.00.2 5.50.05 1.750.1 4.00.1 2.00.05 4.00.05 1.500.1 1.000.15

Reliability Test Methods

Item Test Conditions
Temperature Coefficient TCR=(R-R0)/(t-t0)R0 106 (ppm)
High Temperature Exposure 1000 hrs. @T=125. Measure the variation of resistance at 244 hours after test conclusion.
Low Temperature operation 45 min. @T=-55. Measure the variation of resistance after test conclusion.
Temperature cycling 1000 Cycles (-55 to +125). Measurement at 244 hours after test conclusion.
Short-time overload Applied 5.0 times of rated power for 5 second. Measure the variation of resistance.
Biased Humidity 1000 hours 85/85%RH. Note: Specified conditions: 10% of operating power. Measurement at 244 hours after test conclusion.
Operational life Put the specimen in a chamber at 702 temperature, and applied rated Current for 1.5H and rested for 0.5H repeatedly till total test time is 1000 +48/-0 hrs. Measure the variation of resistance.
Solder ability Dip the terminal in a flux and then dip into a soldering bath at 2455 for 2~3sec.
Resistance to soldering heat Dip the terminal in a flux and then dip into a soldering bath at 2605 for 101sec. Measure the variation of resistance.
Mechanical Shock 100g's, Normal duration is 6ms, half sine shock pulse. Measure the variation of resistance.
Resistance to vibration 5g's for 20min. 12 cycles, 10-2000Hz. Measure the variation of resistance.
Board Flex Min 2mm deflection, 60sec. Measure the variation of resistance.
Terminal Strength Applied a 17.7N (1.8Kg) for 601seconds.
Thermal shock Use -55/+125, Number of cycles is 300. Devices mounted. Maximum transfer time is 20 seconds. Dwell time is 15 minutes. Air Air. Measure the variation of resistance.
Flammability V-0 or V-1 are acceptable. Electrical test not required.
ESD test Other: 2KV, 2 times/1s.

Peel Force of Top Cover Tape

The top cover tape is pulled at a speed of 300 mm/min with the angle between the tape during peel and the direction of unreeling maintained at 165 to 180 degrees. The peel force of paper carrier tape shall be 0.1N to 0.7N (10 to 70 g), the peel force of plastic carrier tape shall be 0.3N to 1N (30 to 100 g).


2410121217_LIZ-RM2512FBR080GM_C5154744.pdf

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