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quality Thick Film Chip Array Resistors LIZ CA024AJF0101G Pb Free Halogen Free 0402 Size 1 Percent Tolerance factory
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quality Thick Film Chip Array Resistors LIZ CA024AJF0101G Pb Free Halogen Free 0402 Size 1 Percent Tolerance factory
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Specifications
Number of Resistors:
4
Number of Pins:
8
Tolerance:
±5%
Resistance:
100Ω
Power(Watts):
62.5mW
Temperature Coefficient:
±200ppm/℃
Mfr. Part #:
CA024AJF0101G
Package:
0402x4
Key Attributes
Model Number: CA024AJF0101G
Product Description

Product Overview

The CA Series Thick Film Chip Array Resistors are designed for Pb-free and halogen-free applications. These resistors offer a reliable solution for various electronic circuits, manufactured by Lizhi Electronics (Kunshan) Co., Ltd. for Lizhi Electronics (Nantong) Co., Ltd. They are suitable for applications requiring precise resistance values and robust performance.

Product Attributes

  • Manufacturer: Lizhi Electronics (Kunshan) Co., Ltd.
  • Customer: Lizhi Electronics (Nantong) Co., Ltd.
  • Type: Thick Film Chip Array Resistors
  • Compliance: Pb-free, Halogen-free (RoHS exemption for lead in glass)

Technical Specifications

Model Type Size Rated Power Tolerance Resistance Value Example Packing Code
CA Series Thick Film Chip Array Resistors 8P4R (0603) 1/10W 5% 1K G (Reel)
CA034AJA0102G CA: Thick Film Chip Array Resistors 034A = 8P4R (0603) A = 1/10W J = 5% Resistance Value: 0102 = 10K (for 5%) G = Reel
024A = 8P4R (0402) F = 1/16W F = 1% Resistance Value Example (1%): 49R9 = 49.9, 1002 = 10K V = Bulk
G = 2% Resistance Value Example (2%, 5%): 06R8 = 6.8, 0564 = 560K S = Double Standard Quantity (Reel)

Dimensions

Type L (mm) W (mm) H (mm) L1 (mm) Q (mm) P (mm) L2 (mm)
CA024A 2.000.10 1.000.10 0.400.05 0.180.10 0.330.10 0.500.10 0.260.10
CA034A 3.200.20 1.500.20 0.550.05 0.300.15 0.500.15 0.800.15 0.300.20

Construction Materials

No. Structure Major Material
1 Ceramic substrate Alumina (Al2O3)
2 Conductive layer Silver (Ag)
3 Resistive layer Ruthenium Dioxide + Glass (RuO2 + glass)
4 Inner protective layer Glass
5 Outer Protective layer Epoxy
6 Marking Epoxy
7 Ni plating layer Nickel (Ni)
8 Sn plating layer Matte Tin (Sn)

Electrical Characteristics

Type CA024A CA034A
Rated Power 1/16W 1/10W
Max Working Voltage 50V 50V
Max Overload Voltage 100V 100V
Dielectric Withstanding Voltage 220V 430V
Resistance Value of Jumper <50m <50m
Rated Current of Jumper 1A 1A

Performance Specifications

Item Test Method Test Conditions Specification
Temperature Coefficient JIS C 5201 4.8 TCR = (R-R0)/(t-t0)R0 10^6 (ppm) R0: resistance at room temperature, R: resistance at 125 or -55, t0: room temperature, t: test temperature (125 or -55) 200 PPM/
Solderability JIS C 5201 4.17 Dip the terminal in a flux and then dip into a soldering bath at 2455 for 30.5 sec. Min 95% coverage
Insulation resistance JIS C 5201 4.6 Applied the dielectric withstanding voltage on the center of body for 605 seconds. Then measure insulation resistance. >10G
Dielectric withstanding voltage JIS C 5201 4.7 Applied the dielectric withstanding voltage on the center of body for 605 seconds. No evidence of flashover, arcing or insulation breakdown
Short-time overload JIS C 5201 4.13 Applied 2.5 times of rated voltage for 5 seconds. Measure the variation of resistance. R% = (R2-R1)/R1 * 100 (1.0% +0.05) Max
Temperature Cycling JIS C 5201 4.19 Put specimen in a chamber which temperature can be changed to 1552 or -553, repeated 5 times. Measure the variation of resistance. R% = (R2-R1)/R1 * 100 (2.0%+0.05) Max
Humidity JIS C 5201 4.24 Put the specimen in a chamber at 402 temperature and 90~95% relative humidity, then applied rated voltage for 1.5H and rested for 0.5H repeatedly till total test time is 1000 +48/-0 hours. Measure the variation of resistance. R% = (R2-R1)/R1 * 100 (2.0%+0.05) Max
Load life JIS C 5201 4.25.1 Put the specimen in a chamber at 702 temperature, ON TIME:1.5H, OFF TIME:0.5H, and applied rated voltage for 1000 +24/-0 hours. Measure the variation of resistance. R% = (R2-R1)/R1 * 100 (2.0%+0.05) Max
Terminal bending JIS C 5201 4.33 Specimen shall be mounted on test board, then bend the board and maintained for 201s. the distance of bending is 1 +0.2/0 mm. Measure the variation of resistance. R% = (R2-R1)/R1 * 100 (1.0%+0.05) Max
Moisture resistance MIL-STD-202 METHOD 106 25C~65C, 90~100%RH, 2.5 hours; 65C 90~100%RH, 3 hours; 65C~25C, 80~100%RH, 2.5 hours, 10 cycles, Measurement at 244 hours after test conclusion. R% = (R2-R1)/R1 * 100 (2.0% +0.05) Max

Tapping Specification

Dimension CA024A CA034A Unit
A 1782.0 mm
B 60.01.0 mm
C 13.50.5 mm
F 11.40.1 mm
W 9.000.3 mm
A 1.200.10 mm
B 2.200.10 mm
D 1.500.0 mm
F 1.0 mm
P0 3.500.05 mm
P1 4.000.10 mm
P2 4.000.10 mm
W 2.000.05 mm
Quantity per Reel 10,000 pcs 5,000 pcs

Peel Force of Top Cover Tape

The top cover tape is pulled at a speed of 200 mm/min with the angle between the tape during peel and the direction of unreeling maintained at 165 to 180 degrees. The peel force of paper carrier tape shall be 0.1N to 0.7N (10 to 70 g), the peel force of plastic carrier tape shall be 0.15N to 0.80N (15 to 80 g).

Soldering

Recommended Reflow Soldering Profile

(Profile details not provided in the source text)

Recommended Wave Soldering Profile

(Profile details not provided in the source text)

Hand Soldering Temperature

The iron temperature is 35010, hand soldering time less than 3S. Avoid solder iron tip direct touch the component's body.


2410121222_LIZ-CA024AJF0101G_C5381597.pdf

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