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quality LIZ CA024AJF0150G Lead Free Thick Film Chip Array Resistors with Compact 8P4R 0402 Size and Performance factory
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quality LIZ CA024AJF0150G Lead Free Thick Film Chip Array Resistors with Compact 8P4R 0402 Size and Performance factory
>
Specifications
Number of Resistors:
4
Number of Pins:
8
Tolerance:
±5%
Resistance:
15Ω
Power(Watts):
62.5mW
Temperature Coefficient:
±200ppm/℃
Mfr. Part #:
CA024AJF0150G
Package:
0402x4
Key Attributes
Model Number: CA024AJF0150G
Product Description

Product Overview

The CA Series Thick Film Chip Array Resistors are lead-free and halogen-free components designed for various electronic applications. They offer reliable performance with a wide resistance range and are available in different sizes and tolerances. These resistors are suitable for applications requiring compact and robust solutions.

Product Attributes

  • Brand: (LIZHI ELECTRONICS)
  • Origin: Kunshan City, Jiangsu Province, China
  • Type: Thick Film Chip Array Resistors
  • Compliance: Pb-free, Halogen-free (RoHS exemption for lead in glass)

Technical Specifications

Model/Series Type Size Rated Power Tolerance Resistance Value Example Resistance Range Max Working Voltage Max Overload Voltage Dielectric Withstanding Voltage Jumper Resistance Jumper Rated Current Operating Temperature Range Storage Conditions
CA Series Thick Film Chip Array Resistors 8P4R (0603) 1/10W 5% 1K 1 ~ 1M 50V 100V 430V <50m 1A -55 ~ +155 530, 3075%RH
CA024A CA 8P4R (0402) 1/16W 1%, 2%, 5% 49R9 (49.9), 1002 (10K), 06R8 (6.8), 0564 (560K) 1 ~ 1M 50V 100V 220V <50m 1A -55 ~ +155 530, 3075%RH
CA034A CA 8P4R (0603) 1/10W 1%, 2%, 5% 49R9 (49.9), 1002 (10K), 06R8 (6.8), 0564 (560K) 1 ~ 1M 50V 100V 430V <50m 1A -55 ~ +155 530, 3075%RH

Dimensions (mm)

Type L W H L1 Q P L2
CA024A 2.000.10 1.000.10 0.400.05 0.180.10 0.330.10 0.500.10 0.260.10
CA034A 3.200.20 1.500.20 0.550.05 0.300.15 0.500.15 0.800.15 0.300.20

Performance Specifications

Item Test Method Test Conditions Specification
Temperature Coefficient JIS C 5201 4.8 R0: Resistance at room temperature; R: Resistance at 125 or -55; t0: Room temperature; t: Test temperature (125 or -55) 200 PPM/
Solderability JIS C 5201 4.17 Dip into soldering bath at 2455 for 30.5 sec after fluxing. Min 95% coverage
Insulation Resistance JIS C 5201 4.6 Applied dielectric withstanding voltage on the center of body for 605 sec. >10G
Dielectric Withstanding Voltage JIS C 5201 4.7 Applied dielectric withstanding voltage on the center of body for 605 sec. No evidence of flashover, arcing or insulation breakdown
Short-time Overload JIS C 5201 4.13 Applied 2.5 times rated voltage for 5 sec. (1.0% +0.05) Max
Temperature Cycling JIS C 5201 4.19 1552 to -553, 5 cycles. (2.0%+0.05) Max
Humidity JIS C 5201 4.24 402, 90~95% RH; Rated voltage applied for 1.5h, rest for 0.5h, repeated for 1000 hours. (2.0%+0.05) Max
Load Life JIS C 5201 4.25.1 702, ON TIME:1.5H, OFF TIME:0.5H, rated voltage applied for 1000 hours. (2.0%+0.05) Max
Terminal Bending JIS C 5201 4.33 Bend test on mounted specimen, 201 sec hold time, 1 +0.2/0 mm bending distance. (1.0%+0.05) Max
Moisture Resistance MIL-STD-202 METHOD 106 10 cycles (25C~65C, 90~100%RH, 2.5h; 65C 90~100%RH, 3h; 65C~25C, 80~100%RH, 2.5h). Measurement 244 hours after test conclusion. (2.0% +0.05) Max

Tapping Specification

Dimension CA024A CA034A
Reel Dimension (mm) 1782.0 (A), 60.01.0 (B), 13.50.5 (C), 11.40.1 (F), 9.000.3 (W) 1782.0 (A), 60.01.0 (B), 13.50.5 (C), 11.40.1 (F), 9.000.3 (W)
Quantity per Reel 10,000 pcs 5,000 pcs
Carrier Tape Dimension (mm) 1.200.10 (A), 2.200.10 (B), 1.500.0 (D), 1.0 (F), 3.500.05 (P0), 4.000.10 (P1), 4.000.10 (P2), 2.000.05 (W) 1.900.15 (A), 3.400.20 (B), 1.500.0 (D), 1.0 (F), 3.500.05 (P0), 4.000.10 (P1), 4.000.10 (P2), 2.000.05 (W)
Peel Force (Top Cover Tape) Paper: 0.1N to 0.7N (10 to 70 g); Plastic: 0.15N to 0.80N (15 to 80 g) at 200 mm/min, 165-180 degree angle. Paper: 0.1N to 0.7N (10 to 70 g); Plastic: 0.15N to 0.80N (15 to 80 g) at 200 mm/min, 165-180 degree angle.

Soldering Recommendations

Hand Soldering: Iron temperature 35010, time less than 3 seconds. Avoid direct contact of solder iron tip with the component body.

(Note: Reflow and Wave soldering profiles are detailed in the original document but not fully extractable into a structured table without further interpretation.)


2410121222_LIZ-CA024AJF0150G_C5381594.pdf

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