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Specifications
Current - Saturation (Isat):
6.8A
Mfr. Part #:
LMSC201610R33MTA
Package:
0806
Key Attributes
Model Number:
LMSC201610R33MTA
Product Description
Product Overview
The LMSC201610R33MTA is a Mini Molded Chip Power Inductor designed for energy storage or filtering in electronic circuits. It features a closed magnetic circuit design for excellent anti-electromagnetic interference, high installation density, and suitability for SMT processes. Constructed with soft magnetic powder, coil, and electrode pins, it offers magnetic circuit closure, reduced leakage flux, super low resistance, and ultra-high current rating.
Product Attributes
- Brand: Not specified
- Origin: Not specified
- Material: Soft magnetic powder, coil, electrode pin
- Color: Not specified
- Certifications: Halogen free, RoHS compliant
Technical Specifications
| Part Number | Inductance (H) | Test Freq. (MHz) | DC Resistance (m) Typ. | DC Resistance (m) Max. | Saturation Current (Isat) (A) Typ. | Saturation Current (Isat) (A) Max. | Temperature Rise Current (Irms) (A) Typ. | Temperature Rise Current (Irms) (A) Max. | Rated Voltage Max. (V) |
| LMSC201610R33MTA | 0.33 | 1 | 13 | 16 | 7.6 | 6.8 | 5.3 | 4.8 | 20 |
Dimensions (Fig. 4-1)
| Type | A (mm) | B (mm) | C (mm) | D (mm) | L (mm) | G (mm) | H (mm) |
| 201610 | 2.00.2 | 1.60.2 | 1.0Max | 0.6 Typ | 2.1 | 0.5 | 1.7 |
Reliability Test Items
| Test Item | Requirements | Test Methods and Remarks |
| Solderability | 1. Appearance: No obvious damage. 2. Solder coverage: > 95%. | 1. Solder: Sn-free Ag(3.0-4.0)Cu(0.5-1.0); 2. Temp: 2455; 3. Time: 31 sec. |
| Terminal Strength | 1. No falling off. 2. No disconnection/cracks. 3. Inductance change: 10%. | 1. Solder onto test board. 2. Push perpendicular: 12.5N, 30mm/min. 3. Duration: 101 sec. 4. Push-head radius: 0.5mm. |
| Bending | 1. No falling off. 2. No disconnection/cracks. | 1. Solder onto test board. 2. Bend to 2mm. 3. PCB size: 100401.0 (or 0.8mm) mm. 4. Duration: 30s. 5. Rate: 0.5mm/s. |
| Reflow | 1. Appearance: No mechanical damage. 2. Inductance change: 10%. | Max. 260, for 3 times. |
| Long-term humid heat | 1. Appearance: No hidden cracks, rust, or excessive glue. 2. Inductance change: 10%. | 1. Temp: 60. 2. Humidity: 95%RH. 3. Time: 1000H +24/-0 hours. 4. Test after 1H standing. |
| Dropping | 1. Appearance: No obvious damage. 2. Inductance change: 10%. | 1. Solder onto test boards. 2. Drop from 1m onto marble floor. 3. 6 faces, 3 times each (18 drops total). 4. Counterweight: 250g 20g. |
| Long-term high temperature and high humidity | 1. Appearance: No hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance change: 10%. | 1. Temp: 852. 2. Humidity: 855%. 3. Duration: 1000H +24/0 hours. 4. Test after 1H standing. |
| Low-temperature storage | 1. Appearance: No hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance change: 10%. | 1. Temp: -402. 2. Time: 1000 +24/-0 hours. 3. Test after 1 hour standing. |
| High-temperature storage | 1. Appearance: No hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance change: 10%. | 1. Temp: 125+2/-0. 2. Time: 1000+24/-0 hours. 3. Test after 1 hour standing. |
| Long-term durability | 1. Appearance: No hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance change: 10%. | 1. Temp: 85 2. 2. Duration: 1000 + 24 / -0 hours. 3. Applied current: Rated current. 4. Test after 1 hour standing. |
| Thermal Shock | 1. Appearance: No hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance change: 10%. | 1. -55+0/-5 (303 min) Room Temp (5 min) 125+5/-0 (303 min) Room Temp. 2. Conversion time: 5 min Max. 3. Cycles: 100. 4. Test after 1 hour standing. |
| Vibration | 1. No parts falling off or cracks. 2. Inductance change: 10%. | 1. Solder onto test board. 2. Acceleration: 5g. 3. Sweep speed: 20 min/cycle. 4. Cycles: 12 per axis (X, Y, Z), 36 total. 5. Frequency: 10 - 2000Hz. |
| Humid heat load (60/95%RH + loading) | 1. Appearance: No hidden cracks, rust, glue overflow, or obvious damage. 2. Inductance change: 10%. | 1. Temp: 60. 2. Humidity: 95%RH. 3. Applied Current: Rated current. 4. Duration: 1000H +24/-0 hours. 5. Test after 1 hour standing. |
Packaging and Storage
| Section | Details |
| Tape packaging dimensions | Code (mm): A0=1.950.05, B0=2.350.05, K0=1.150.05, T=0.250.05 |
| Units/Reel | 3K |
| Tape Direction | See Fig. 7-2 |
| Reel Dimensions | See Fig. 7-3 |
| Peel force of top cover tape | Peel speed: ~300 mm/min. Force: 0.1 to 0.7N. |
| Storage Conditions | Recommended: -10~40, 70% RH (Max.). Use within one year of delivery. Check solderability if stored over 6 months. |
Reflow Profile
| Method | Parameters |
| Reflow Soldering | Tp: 255~260 Max. 30 seconds (tp); 217 60~150 seconds; Pre-Heat: 150 ~ 200 60~120 seconds; Time from 25 to peak: 8 minutes max. |
| Soldering iron | 3505 max., 3 seconds. |
2504101957_Linepri-LMSC201610R33MTA_C46527043.pdf
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