Product Overview
The SDRS7032 Series from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are shielded SMD power inductors designed for high saturation current and low DC resistance. Featuring a closed magnetic circuit to minimize leakage, these inductors offer high-accuracy dimensions suitable for automatic mounting. They are available in various package sizes and a wide inductance range, complying with RoHS, Halogen Free, and REACH standards. Ideal for applications such as thin-screen TVs, LCDs, AV equipment, gaming equipment, and DC/DC converters.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Series: SDRS7032
- Type: Shielded SMD Power Inductors
- Certifications: RoHS, Halogen Free, REACH Compliance
- Magnetic Circuit Design: Closed magnetic circuit
- Mounting Type: Surface Mount Device (SMD)
- Packaging: Bulk Package (B), Tape & Reel (T)
Technical Specifications
| Part No. | Inductance (H) | Tolerance | Test Frequency | DCR () Max | Saturation Current (A) Max | Temperature Rise Current (A) Max |
|---|---|---|---|---|---|---|
| SDRS7032-3R3N | 3.3 | 30% | 100KHz | 0.023 | 1.90 | 1.90 |
| SDRS7032-4R7N | 4.7 | 30% | 100KHz | 0.036 | 1.70 | 1.70 |
| SDRS7032-6R8N | 6.8 | 30% | 100KHz | 0.041 | 1.60 | 1.60 |
| SDRS7032-100N | 10 | 30% | 100KHz | 0.053 | 1.40 | 1.40 |
| SDRS7032-150N | 15 | 30% | 100KHz | 0.075 | 1.10 | 1.10 |
| SDRS7032-220N | 22 | 30% | 100KHz | 0.110 | 0.96 | 0.96 |
| SDRS7032-330N | 33 | 30% | 100KHz | 0.160 | 0.75 | 0.75 |
| SDRS7032-470N | 47 | 30% | 100KHz | 0.240 | 0.67 | 0.67 |
| SDRS7032-680N | 68 | 30% | 100KHz | 0.310 | 0.59 | 0.59 |
| SDRS7032-101N | 100 | 30% | 100KHz | 0.450 | 0.45 | 0.45 |
| SDRS7032-151N | 150 | 30% | 100KHz | 0.650 | 0.37 | 0.37 |
| SDRS7032-221M | 220 | 20% | 100KHz | 1.050 | 0.29 | 0.29 |
| SDRS7032-331M | 330 | 20% | 100KHz | 1.670 | 0.22 | 0.22 |
| SDRS7032-471M | 470 | 20% | 100KHz | 2.050 | 0.20 | 0.20 |
| SDRS7032-681M | 680 | 20% | 100KHz | 3.150 | 0.16 | 0.16 |
| Part No. | External Dimensions (LWH) (mm) | A (mm) | B (mm) | C (mm) | D (mm) | E (mm) | H (mm) | I (mm) | J (mm) |
|---|---|---|---|---|---|---|---|---|---|
| SDRS7032 | 7.07.03.2 | 7.00.2 | 7.00.2 | 3.20.2 | 4.0 | 2.0 | 2.2 | 2.0 | 4.0 |
Environmental Data:
- Operating Temperature: -40 to +125 (Including coils self-temperature rise)
Test Equipment:
- Inductance (L): HP4284A or HP4285A LCR meter or equivalent
- Saturation Current (Isat) & Temperature Rise Current (Irms): HP4284+42841A or equivalent
- DC Resistance (DCR): Chroma 16502 or equivalent
Product Identification: SDRS 7032 [Inductance] [Tolerance] [Packing]
- Inductance: e.g., 100 (for 10 H)
- Tolerance: J:5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30%
- Packing: B (Bulk Package), T (Tape & Reel)
Packaging:
| Part No. | Tape Dimension W (mm) | Tape Dimension P (mm) | Tape Dimension W1 (mm) | Reel Dimensions A (mm) | Reel Dimensions B (mm) | Reel Dimensions C (mm) | Reel Dimensions D (mm) | REEL (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRS7032 | 16 | 12 | 7.5 | 16.4 | 60 | 13 | 330 | 1000 | 3000 | 12,000 |
Tape and Reel Specifications:
- Cover tape peel force: 10 to 120g
- Noodle strip peeling angle: 165 to 180
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal | Pulling test (force varies by terminal area), Solder paste thickness: 0.12mm |
| Terminal Strength (DIP) | Meet requirements without any loose terminal | Pulling test (force varies by terminal diameter) |
| Resistance to Flexure | No visible mechanical damage | Flexure: 2mm, Pressurizing Speed: 0.5mm/sec, Keep time: 30 sec |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop from 1m high in 1 angle, 3 ridges and 6 surfaces, twice in each direction. |
| Solderability | No visible mechanical damage. Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402, Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin and 75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Frequency range: 10 to 55 Hz and return to 10 Hz in approx. 1 minute. Applied for 2 hours in each 3 mutually perpendicular directions (total of 6 hours). |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | 100 cycles of temperature shock (-55~40 to 85~125). Transforming interval: Max. 20 sec. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: 125~852. Duration: 962 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: Within 30%). Q factor change: Within 20%. | Temperature: 602, Humidity: 90% to 95% RH. Duration: 962 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: L/L30%). Q/Q30% (SMD series only). DCR/DCR10%. | Refer to reflow curve, peak temperature: 260+0/-5. Performed twice. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip into IPA solvent for 50.5Min, drying at room temp for 5Min, brushing 10 times. |
| Overload test | During the test no smoke, no peculiar smell, no fire. The characteristic is normal after test. | Apply twice as rated current for 5 minutes. |
| Voltage resistance test | During the test no breakdown. The characteristic is normal after test. | DC1000V, Current: 1mA, Time: 1Min. (For parts with two coils) |
Recommended reflow soldering curve: Conditions to be adjusted and confirmed according to user's environment/equipment.
Reminders for using these products:
- Storage period is within 12 months under conditions (temperature: 5~40C, humidity: 35 to 65% RH or less).
- Do not use or store in gas corrosive environments (salt, acid, alkali, etc.).
- Avoid direct contact with terminals by bare hands due to oil secretions.
- Handle products carefully to prevent damage from dropping or improper removal.
- Do not bend terminals with excessive stress to avoid wire fracture.
- Do not rinse coils by yourself; contact the manufacturer if cleaning is necessary.
- Do not expose products to magnets or magnetic fields.
- Preheat components before soldering; temperature difference between solder and chip should not exceed 150C.
- Soldering corrections after mounting should be within specified conditions to avoid short circuits, performance degradation, or lifespan reduction.
- Allow sufficient thermal design margin for self-heating when power is ON.
- For non-magnetic shield types, carefully lay out coils on the circuit board to prevent malfunctions due to magnetic interference.
2410121625_LanTu-Micro-SDRS7032-100NT_C19267853.pdf
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