<
>
Specifications
Current - Saturation (Isat):
5.1A
Mfr. Part #:
SDRH105R-100MT
Package:
SMD,10.5x10.3mm
Key Attributes
Model Number:
SDRH105R-100MT
Product Description
Product Overview
The SDRH105R Series Shielded SMD Power Inductors from SHENZHEN LANTU MICRO ELECTRIC TECHNOLOGY CO., LTD. are designed for high saturation current and low DC resistance. Featuring a closed magnetic circuit to minimize leakage, these inductors offer high-precision dimensions suitable for automatic mounting. They are available in various package sizes and a wide inductance range, complying with RoHS, Halogen Free, and REACH standards. Ideal for power supplies in VTRs, LCD televisions, notebook PCs, portable communication equipment, and DC/DC converters.
Product Attributes
- Brand: LANTU MICRO ELECTRIC TECHNOLOGY
- Series: SDRH105R
- Type: Shielded SMD Power Inductors
- Origin: SHENZHEN
- Certifications: RoHS, Halogen Free, REACH Compliance
- Magnetic Circuit: Closed magnetic circuit design
- Mounting: Suitable for automatic mounting
Technical Specifications
General Specifications:
| Item | Specification |
|---|---|
| Operating Temperature | -40 to +125 (Including coils self-temperature rise) |
| Test Equipment (Inductance) | HP4284A, HP4285A LCR meter or equivalent |
| Test Equipment (Current) | HP4284+42841A |
| Test Equipment (DCR) | Chroma 16502 or equivalent |
Product Identification:
| Component | Description |
|---|---|
| Type | SDRH |
| Inductance | e.g., 100 (for 10 uH) |
| Tolerance | J: 5%, K: 10%, L: 15%, M: 20%, P: 25%, N: 30% |
| Packing | T: Tape & Reel, B: Bulk Package |
| External Dimensions (LWH) | 105R (10.310.55.0 mm) |
Shape and Dimensions:
| Part No. | A (Max) | B (Max) | C (Max) | D | E | F | H | I | J |
|---|---|---|---|---|---|---|---|---|---|
| SDRH105R | 10.3 | 10.5 | 5.0 | 7.7 | 3.0 | 1.2 | 3.6 | 1.7 | 7.3 |
(Dimensions are in mm)
Electrical Characteristics (SDRH105R Series):
| Part No. | Inductance (H) | Tol. | Test Freq. | DCR () Max @0A | Isat (A) Max | Irms (A) Max | Temp. Rise Current (A) Max (T 40) |
|---|---|---|---|---|---|---|---|
| SDRH105R-3R3N | 3.3 | 30% | 100KHz | 0.013 | 9.50 | 6.50 | - |
| SDRH105R-4R7N | 4.7 | 30% | 100KHz | 0.016 | 9.20 | 6.30 | - |
| SDRH105R-6R8N | 6.8 | 30% | 100KHz | 0.020 | 7.00 | 6.00 | - |
| SDRH105R-8R2N | 8.2 | 30% | 100KHz | 0.023 | 5.50 | 5.00 | - |
| SDRH105R-100N | 10 | 30% | 100KHz | 0.250 | 5.10 | 4.40 | - |
| SDRH105R-120N | 12 | 30% | 100KHz | 0.032 | 4.90 | 4.00 | - |
| SDRH105R-150N | 15 | 30% | 100KHz | 0.040 | 4.20 | 3.60 | - |
| SDRH105R-180M | 18 | 20% | 100KHz | 0.046 | 3.70 | 3.40 | - |
| SDRH105R-220M | 22 | 20% | 100KHz | 0.058 | 3.30 | 3.20 | - |
| SDRH105R-270M | 27 | 20% | 100KHz | 0.650 | 3.20 | 3.00 | - |
| SDRH105R-330M | 33 | 20% | 100KHz | 0.810 | 2.70 | 2.60 | - |
| SDRH105R-390M | 39 | 20% | 100KHz | 0.103 | 2.48 | 2.50 | - |
| SDRH105R-470M | 47 | 20% | 100KHz | 0.122 | 2.35 | 2.30 | - |
| SDRH105R-560M | 56 | 20% | 100KHz | 0.144 | 2.30 | 2.10 | - |
| SDRH105R-680M | 68 | 20% | 100KHz | 0.193 | 2.00 | 1.90 | - |
| SDRH105R-820M | 82 | 20% | 100KHz | 0.219 | 1.80 | 1.60 | - |
| SDRH105R-101M | 100 | 20% | 100KHz | 0.247 | 1.50 | 1.35 | - |
| SDRH105R-121M | 120 | 20% | 100KHz | 0.298 | 1.40 | 1.18 | - |
| SDRH105R-151M | 150 | 20% | 100KHz | 0.355 | 1.30 | 1.10 | - |
| SDRH105R-181M | 180 | 20% | 100KHz | 0.393 | 1.20 | 1.00 | - |
| SDRH105R-221M | 220 | 20% | 100KHz | 0.483 | 1.08 | 0.94 | - |
| SDRH105R-271M | 270 | 20% | 100KHz | 0.632 | 0.88 | 0.80 | - |
| SDRH105R-331M | 330 | 20% | 100KHz | 0.780 | 0.85 | 0.73 | - |
| SDRH105R-391M | 390 | 20% | 100KHz | 0.957 | 0.78 | 0.70 | - |
| SDRH105R-471M | 470 | 20% | 100KHz | 1.220 | 0.71 | 0.54 | - |
| SDRH105R-561M | 560 | 20% | 100KHz | 1.352 | 0.65 | 0.52 | - |
| SDRH105R-681M | 680 | 20% | 100KHz | 1.519 | 0.59 | 0.51 | - |
| SDRH105R-821M | 820 | 20% | 100KHz | 1.694 | 0.51 | 0.48 | - |
| SDRH105R-102M | 1000 | 20% | 100KHz | 1.946 | 0.49 | 0.42 | - |
Note: Saturation Current: DC current at which inductance drops 30% from its value without current. Temperature Rise Current: the actual value of DC current when the temperature rise is T 40 (Ta=25). Rated DC Current: The lesser value of Isat or Irms. Component temperature is affected by circuit design, PCB trace size/thickness, airflow, and other cooling provisions; verify in end application.
Packaging Specifications:
| Part No. | Tape Width (W) (mm) | Pitch (P) (mm) | Tape Width (W1) (mm) | Reel Dia. (A) (mm) | Reel Width (B) (mm) | Reel Hole Dia. (C) (mm) | Reel Hub Dia. (D) (mm) | Reel (PCS) | Inside Box (PCS) | Outside Carton (PCS) |
|---|---|---|---|---|---|---|---|---|---|---|
| SDRH105R | 24 | 16 | 11.5 | 24.4 | 60 | 13 | 330 | 800 | 1600 | 6400 |
Cover Tape Peel Off Condition:
- Peel Force: 10 to 120g
- Peeling Angle: 165 to 180
Reliability Testing:
| Item | Requirements | Test Methods and Remarks |
|---|---|---|
| Terminal Strength (SMT) | Meet requirements without any loose terminal. | Pulling test based on terminal sectional area (A). Solder paste thickness: 0.12mm. Speed: 1.0mm/s. Keep time: 101s. |
| Terminal Strength (DIP) | Meet requirements without any loose terminal. | Pull force applied gradually and maintained for 10 seconds, based on terminal diameter. |
| Resistance to Flexure | No visible mechanical damage. | Solder to test jig, apply force. Flexure: 2mm. Speed: 0.5mm/sec. Keep time: 30 sec. |
| Dropping | No case deformation or change in appearance. No short and no open. | Drop packaged products from 1m height, 1 angle, 3 ridges, 6 surfaces, twice each direction. |
| Solderability | Wetting shall exceed 75% coverage. Terminals must have 95% minimum solder coverage. | Solder temperature: 2402. Duration: 3 sec. Solder: Sn/3.0Ag/0.5Cu. Flux: 25% Resin/75% ethanol. |
| Vibration | No visible mechanical damage. Inductance change: Within 10%. Q factor change: Within 20%. | Solder to jig, subjected to simple harmonic motion (10-55 Hz, 1.5mm amplitude) for 2 hours in 3 perpendicular directions. |
| Thermal Shock | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | 100 cycles of temperature transition between 85~125 and -55~40. Transforming interval: Max. 20 sec. Stabilize at normal condition for 1-2 hours. |
| Low temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Temperature: -55~-402. Duration: 962 hours. Stabilize at normal condition for 1-2 hours. |
| High temperature Storage | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Temperature: 85~1252. Duration: 962 hours. Stabilize at normal condition for 1-2 hours. |
| Damp Heat (Steady States) | No visible mechanical damage. Inductance change: Within 10% (Mn-Zn: 30%). Q factor change: Within 20%. | Temperature: 602. Humidity: 90% to 95% RH. Duration: 962 hours. Stabilize at normal condition for 1-2 hours. |
| Heat endurance of Reflow soldering | No significant defects in appearance. L/L10% (Mn-Zn: 30%). Q/Q30% (SMD series only). DCR/DCR10%. | Reflow twice according to recommended curve. Peak temperature: 260+0/-5. |
| Resistance to solvent test | No case deformation or change in appearance or obliteration of marking. | Dip in IPA solvent for 50.5Min, dry for 5Min, brush 10 times. |
| Overload test | No smoke, no peculiar smell, no fire during test. Characteristics normal after test. | Apply twice rated current for 5 minutes. |
| Voltage resistance test | No breakdown during test. Characteristics normal after test. | DC1000V, Current: 1mA, Time: 1Min (for parts with two coils). Refer to catalogue for specific products. |
Recommended Reflow Soldering Curve:
(Refer to the provided graph in the original document for detailed temperature profiles.)
Reminders for Using These Products:
- Storage: Within 12 months, under 5~40C and 35~65% RH. Terminal solderability may deteriorate beyond this period.
- Environment: Avoid use and storage in corrosive gas environments (salt, acid, alkali, etc.).
- Handling: Avoid direct contact with terminals with bare hands due to oil secretions affecting solderability. Handle products carefully to prevent damage from dropping or improper removal.
- Terminal Bending: Do not excessively bend terminals to prevent wire fracture.
- Cleaning: Do not rinse coils. Contact the manufacturer if cleaning is necessary.
- Magnetic Fields: Do not expose products to magnets or magnetic fields.
- Preheating: Always preheat components before soldering. Ensure the temperature difference between solder and chip does not exceed 150C.
- Soldering Corrections: Perform corrections within specified conditions. Overheating may cause short circuits, performance degradation, or reduced lifespan.
- Thermal Design: Account for self-heating when power is on; ensure sufficient thermal design margin.
- Non-Magnetic Shield Type: Carefully consider coil placement in PCB design to avoid malfunctions due to magnetic interference.
2410121647_LanTu-Micro-SDRH105R-100MT_C5127230.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
